A terminal-wire bonding method includes: arranging a first core at a second end of a first terminal-wire having a first terminal connected with the first core exposed from an insulating sheath at a first end, onto a side of an anvil and a second core at a second end of a second terminal-wire having a second terminal connected with the second core exposed, at a first end, from an insulating sheath longer than the insulating sheath of the first terminal-wire, onto a side of a horn; and bonding the first core at the second end and the second core at the second end together by ultrasonic bonding between the horn and the anvil.

A terminal-wire bonding method includes: arranging a first core at a second end of a first terminal-wire having a first terminal connected with the first core exposed from an insulating sheath at a first end, onto a side of an anvil and a second core at a second end of a second terminal-wire having a second terminal connected with the second core exposed, at a first end, from an insulating sheath longer than the insulating sheath of the first terminal-wire, onto a side of a horn; and bonding the first core at the second end and the second core at the second end together by ultrasonic bonding between the horn and the anvil.

A self-aligning mechanical mount and electrical connection system for an electronic module comprises a mechanical mount assembly configured to be integrated into or attached to a base frame and defining a mount connection position assurance (CPA) feature for self-aligning and securing of the electronic module therein, and an electrical connection assembly configured to be integrated into or attached to the mechanical mount assembly and comprising a modular electrical connector (i) being electrically connected to an electrical backbone wire cable and (ii) defining a connector CPA feature for self-aligning the modular electrical connector with a corresponding electrical connector integrated into or attached to the electronic module when the electronic module is secured in the mechanical mount assembly.

The connector terminal includes an insulation body and multiple terminal bodies. Each of the multiple terminal bodies includes: a base part, an elastic arm and a welding part. The base part includes a first base part and a second base part, the first base part and the second base part form a bending structure, a first end of the first base part is embedded in the insulation body, a second end of the first base part is connected to a first end of the second base part, and a second end of the second base part is embedded in the insulation body. The elastic arm is connected to the first end of the first base part and extends out of a first end of the insulation body. The welding part is connected to the second end of the second base part and extends out of a second end of the insulation body.

The connector terminal includes an insulation body and multiple terminal bodies. Each of the multiple terminal bodies includes: a base part, an elastic arm and a welding part. The base part includes a first base part and a second base part, the first base part and the second base part form a bending structure, a first end of the first base part is embedded in the insulation body, a second end of the first base part is connected to a first end of the second base part, and a second end of the second base part is embedded in the insulation body. The elastic arm is connected to the first end of the first base part and extends out of a first end of the insulation body. The welding part is connected to the second end of the second base part and extends out of a second end of the insulation body.

A multiple coaxial connector includes a contact pair that is composed of a first contact and a second contact, a body that accommodates each contact, a shell that accommodates the body, a shield cover that covers a portion of the shell, and a board mounting portion. The first contact includes a first main body portion that is extended in a first direction, a first contact portion that is formed on one end of the first main body portion and is to be brought into contact with a contact of the mating multiple coaxial connector, and a first leading portion that is extended from the other end of the first main body portion in a direction that is orthogonal to the first direction and directs toward a second direction. A plurality of the contact pairs are arranged in a third direction.

A circuit connection module include a board, an electronic component mounted on the board, and an electrically conductive member connected to the electronic component so as to be thermally conductive. The electronic component includes a heat dissipation portion exposed on an outer surface of the electronic component. The electrically conductive member includes a plate-shaped portion connected to the heat dissipation portion so as to be thermally conductive, and a terminal portion in which one end is connected to the plate-shaped portion so as to be thermally conductive and electrically conductive and the other end is in contact with a mating terminal.

A circuit connection module include a board, an electronic component mounted on the board, and an electrically conductive member connected to the electronic component so as to be thermally conductive. The electronic component includes a heat dissipation portion exposed on an outer surface of the electronic component. The electrically conductive member includes a plate-shaped portion connected to the heat dissipation portion so as to be thermally conductive, and a terminal portion in which one end is connected to the plate-shaped portion so as to be thermally conductive and electrically conductive and the other end is in contact with a mating terminal.

A multilayer ceramic capacitor includes a multilayer body including stacked dielectric layers and stacked internal electrode layers, and external electrodes respectively connected to the internal electrode layers. The external electrodes each include a lower plated layer and a Pd-plated layer on the lower plated layer. Recesses are provided on a surface of the Pd-plated layer and include first recesses each having a circle equivalent diameter of an opening of about 0.5 μm or more and about 4 μm or less and second recesses each having a circle equivalent diameter of an opening of about 10 μm or more and about 22 μm or less. The first recesses are greater in number than the second recesses. The second recesses and the first recesses are in a mixed state.

A multilayer ceramic capacitor includes a multilayer body including stacked dielectric layers and stacked internal electrode layers, and external electrodes respectively connected to the internal electrode layers. The external electrodes each include a lower plated layer and a Pd-plated layer on the lower plated layer. Recesses are provided on a surface of the Pd-plated layer and include first recesses each having a circle equivalent diameter of an opening of about 0.5 μm or more and about 4 μm or less and second recesses each having a circle equivalent diameter of an opening of about 10 μm or more and about 22 μm or less. The first recesses are greater in number than the second recesses. The second recesses and the first recesses are in a mixed state.