A game control device includes a housing, a circuit board, a joystick control module, and a limiting frame. The housing includes a shell plate, a through hole, and an internal accommodation space. The through hole is defined through the shell plate along an axial direction and in communication with the internal accommodation space. The circuit board is disposed in the internal accommodation space. The joystick control module includes a joystick and a motion sensor. The motion sensor is disposed in the internal accommodation space and electrically connected to the circuit board. One end of the joystick is detachably connected to the motion sensor, the other end of the joystick protrudes out of the shell plate, and the joystick is within the through hole. The limiting frame is disposed on the shell plate and detachably connected to the through hole to limit a movement of the joystick along the axial direction.

An electrical connector that connects circuit boards in a coplanar manner. The electrical connector includes a frame comprising a plate, and two platforms extending above the plate and substantially parallel to each other. A housing of the electrical connector holding conductive elements is coupled to the plate of the frame such that a top surface of the housing is substantially flush with top surfaces of the two platforms. The platforms of the frame have threaded holes extending therethrough such that screws can be inserted to hold one of the two platforms of the electrical connector to a first circuit board and the other one of the two platforms of the electrical connector to a second circuit board that is substantially edge aligned to the first circuit board. Such a configuration enables connecting circuit boards of various thicknesses in a coplanar manner.

A circuit board assembly includes an electrical connector mounted to a circuit board having a connector housing holding contacts in a contact array. A connector mount having a bracket is coupled to the mounting surface of the circuit board proximate to the mating edge. The electrical connector is movably coupled to the connector mount to move relative to the circuit board during mating with the mating electrical connector. The connector mount has a biasing member compressible along a compression axis parallel to the mating direction to allow the electrical connector to float in the mating direction relative to the circuit board. The electrical connector is movably coupled to the connector mount in a confined envelope in at least one floating direction perpendicular to the mating direction.

A driving tool for driving jackset screws includes an input shaft, output shafts, gear assembly, driver heads, and a yoke. The input shaft is configured to receive torque. The first and second output shafts are operably connected to the input shaft via the gear assembly. The gear assembly includes a differential gear assembly rotatably engaged with the input shaft. The first driver head is attached to a distal end of the first output shaft. The second driver head is attached to a distal end of the second output shaft. The yoke is connected to and extends between ends of the first and second output shafts. The yoke defines a position of the distal ends of the first and second shafts relative to each other and is configured to adjust a distance between the first and second driver heads.

A connector for providing an electrical connection between at least one terminating mating terminal to a substrate. The connector includes a housing having at least one terminal receiving cavity. A receptacle terminal is positioned in the at least one terminal receiving cavity. The receptacle terminal has a latching projection which cooperates with the at least one mating terminal to retain the at least one mating terminal in electrical engagement with the receptacle terminal when the at least one mating terminal is fully inserted in the at least one terminal receiving cavity. A release mechanism is provided in the housing in line with the latching projection of the receptacle terminal, the release mechanism is configured to cooperate with the receptacle terminal to depress the latching projection when the at least one mating terminal is to be removed from the at least one terminal receiving cavity.

A dense, high-speed interconnection may be formed with a mating header and receptacle connector. The header connector may have groups of mating contact portions extending from the connector housing. Structural projections may extend from the housing adjacent some or all of the groups of mating contact portions. The groups of mating contact portions may be signal and ground mating contact portions associated with a signal pair. The groups may be arranged in an array and the structural projections may be arranged in an array intercalated with the array of the groups of mating contact portions. A receptacle connector may include an array of apertures configured to receive the structural projections. The structural projections may be shaped and positioned to reduce damage to the mating contact portions of the header connector, enable reliable manufacture, and to provide a high-density mating interface.

An interposer includes a planar substrate and a pad array formed on a bottom side of the planar substrate to connect with a pin array within a CPU socket. A serial computer expansion bus connector is formed on the top side of the planar substrate and is electronically coupled to a portion of the pad array. The interposer further includes a perimeter structure adapted for securing to a CPU carrier. The interposer may be included in a kit with a heatsink securable to the CPU socket, wherein the heatsink includes a contact area for contacting the interposer and applying a load to the interposer. A printed circuit board assembly may include first and second CPU sockets that are connected by a CPU interconnect, where the interposer may be installed in the first CPU socket and a CPU may be installed in the second CPU socket.

An electrical connector assembly is provided and includes a carrier having an upper surface and a lower surface. The lower surface is configured to face a host circuit board. The upper surface is configured to face a component circuit board of an electrical component. The carrier includes a plurality of contact openings therethrough. The electrical connector assembly includes contacts coupled to the carrier and passing through the corresponding contact openings. Each contact has a conductive polymer column extending between an upper mating interface and a lower mating interface. The conductive polymer column is compressible between the upper mating interface and the lower mating interface. The conductive polymer column includes an inner core and an outer support body. The inner core is manufactured from a first material. The outer support body is manufactured from a second material. The second material has a lower compression set than the first material. The first material has a higher electrical conductivity than the second material.

An electrical connection device comprises an electrical connector. The electrical connector comprises: an insulative body; a plurality of conductive terminals provided to the insulative body; a metal shell surrounding the insulative body and an outer shielding member. The metal shell comprises a top portion, two openings respectively formed at two sides of the top portion and two first ground pieces positioned opposite to a side where the top portion is present and extending outwardly respectively from the two openings. The outer shielding member comprises a main body transversally provided on the top portion of the metal shell and covering the two openings and two second ground pieces respectively extending outwardly from two ends of the main body, the two second ground pieces each have a penetrating hole penetrating from a top surface to a bottom surface. At least a part of each penetrating hole of the two second ground pieces receives the corresponding first ground piece. By that the outer shielding member covers the two openings of the metal shell, EMI may be prevented from being produced.

A power electronics arrangement has a power semiconductor module, with a contact spring, with a load connecting element and with a mounting device which is embodied as part of an electrically operated vehicle. The power semiconductor module has a load connection element which preferably projects outwards from the interior of the power semiconductor module, and preferably has there a first external contact face for external connection, and the load-connecting element has a second contact face. An electrically conductive pressure contact connection is embodied between the first contact face and the second contact face by a contact spring, wherein the pressure on the contact spring which is necessary for this is implemented by connecting the power semiconductor module in a frictionally locking fashion to the mounting device.