The present invention relates to a cavity filter including: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein a part of the terminal portion, positioned between the electrode pad and the RF signal connecting portion, is elastically deformed to absorb assembly tolerance existing in a terminal insertion port. Therefore, the cavity filter can efficiently absorb assembly tolerance which occurs through assembly design, and prevent disconnection of an electric flow, thereby preventing degradation in performance of an antenna device.

A connector is provided with a housing, a circuit board to be arranged along a width direction in a board insertion portion of the housing, and a connecting member to be arranged in the housing and including a contact point portion to be connected to a conductive portion of the circuit board. The connecting member is configured to be swingable in the width direction.

An optoelectronic component includes an optical module and a host circuit board. The optical module includes a module circuit board and a gold finger that is located on a first surface of the module circuit board. The host circuit board includes a conductive elastomer corresponding to the gold finger and that is located on a first surface of the host circuit board. The module circuit board is located on the host circuit board, the first surface of the module circuit board and the first surface of the host circuit board face each other, and the gold finger is in contact with the conductive elastomer.

In embodiments of the invention, the invention comprises a light tip cable including a cartridge assembly affixed to a medial end of the cable, the cartridge assembly including an emitter housing where the emitter housing includes an opening at a medial end of the housing and a flange at a lateral end of the housing. In embodiments of the invention, the cartridge assembly includes a light emitting element in the housing extending to the opening, retention features covering at least a portion of the housing, including the flange, the retention features comprising a lateral face and a lobe and at least one load bearing strand extending from the cable to the emitter; and electrical connectors extending from the cable to the light emitting element.

A power adapter assembly structure is disclosed and includes a housing, a circuit board, a socket and an elastic element. The circuit board including a first abutting surface and the socket including a second abutting surface are fastened in the housing. The elastic element connected between the circuit board and the socket includes a main body, a first hanging arm and a second hanging arm. The first hanging arm and the second hanging arm are disposed at two opposite ends of the main body, and constantly abuts the first abutting surface and the second abutting surface, respectively. A first gap is formed between the main body and the first abutting surface, and less than a first length of the first hanging arm. A second gap is formed between the main body and the second abutting surface, and less than a second length of the second hanging arm.

Devices and methods for a sealed electrical connector are described herein. Some embodiments include a spring connecting a first PCB to a second PCB, wherein the spring includes a first end portion in contact with the first PCB, a second end portion in contact with the second PCB, and a middle portion extending between the first end portion and the second end portion, a spacer surrounding the middle portion of the spring, a first seal seated in a first groove of the spacer and in contact with the first PCB, and a second seal seated in a second groove of the spacer and in contact with the second PCB.

An electrical connector includes a holding member that is electrically insulating, and a signal terminal and a male ground terminal held by the holding member. The male ground terminal is disposed next to the signal terminal. The male ground terminal includes a frame projecting in side view, and a cavity formed inside the frame. The male ground terminal includes a shielding part that is conductive and configured to electromagnetically shield the cavity. The shielding part is located at the cavity and held by the holding member provided to the cavity.

Memory on Package (MOP) apparatus with reverse CAMM (Compression Attached Memory Module) and compression mount technology (CMT) connector(s). The MOP includes a first (MOP) substrate to which one or more CPUs, SoC, and XPUs that is operatively coupled to one or more CAMMs with a CMT connector(s) disposed between an array of CMT contact pads on the CAMM substrate and an array of CMT contact pad on the substrate. The one or more CAMMs are include multiple memory chips or packages such as LP DDR chips or DDR (S)DRAM chips/packages mounted to an underside of the CAMM substrate via signal coupling means such as a ball grid array (BGA), where the CAMM orientation is inverted such that the memory chips/packages are disposed downward, resulting in a reduced Z-height of the MOP. A MOP may include two CAMMs with a respective CMT connector disposed between the CAMM substrates and the MOP substrate.

A high temperature electrical connector, which may be used to connect a temperature sensor mounted in a combustion chamber of an automotive engine to a cable. The connector has a housing made of high temperature material, such as alumina ceramic. Connector terminals may be retained within the housing but may float relative to the housing, to reduce stresses associated with differential thermal expansion of the housing and terminals and reduce transmission of vibration and resultant degradation of connector performance. Compliant portions may extend from an intermediate portion of the terminals to make contact with pads on a sensor substrate inserted into the connector. The terminals may be retained with an end cap, secured to the housing. Retention of the terminals may be aided by pockets in the housing that receive tips of the terminals. Channels, receiving the intermediate portions of the terminals, may open into the pockets.

Embodiments of connector-less modules and associated platforms employing the module. The module employs a Land Grid Array (LGA) comprising an array of LGA pins on the underside of the module PCB that are configured to engage respective pads patterned on a motherboard or system board PCB by applying a downward force to the module PCB. A novel clip assembly is provided to apply the downward force, while also aligning the module PCB (and its LGA) to the motherboard or system board PCB. A heat shield is provided that is configured to be disposed over the module PCB to facilitate enhanced thermal spreading and lowering thermal resistance both towards the heat shield and the PCBs. Example modules include a WWAN module and an NVMe SSD module. The module PCB may employ an M.2 form factor or other form factors.