Patent classifications
H01R12/714
MEMORY ON PACKAGE WITH INTERPOSER WITH COMPRESSION-BASED CONNECTORS
A system connects a board to a substrate through an interposer board having compressible connectors through the interposer board. The connectors through the interposer board are compression-based connector pins that extends above and below the interposer board to make electrical contact between the board and the substrate. The system can include a plate to secure the board to the substrate and compress the compression-based connectors of the interposer board.
Compact multi-line connector
A multi-line electrical assembly that includes a multi-line cable (14), including a multiplicity of insulated conductive wires (59); and a multi-line electrical plug (16), physically connected to the cable. The plug has a housing (56) and a plurality of spaced-apart printed circuit hoards (PCBs, 48), housed in the housing and having a first end (47) that is connected to the cable and having a second end (46), separated from the first end. Further, the PCBs bear a plurality of conductive traces (50), at least some of the traces being electrically connected to the wires proximal to the first end. The traces terminate proximal to the second end.
Pyrotechnic installation consisting of at least one firework, an electric igniter, and a docking base, the installation comprising a system for removably coupling them
The present invention concerns a coupling and power transmission system for an electric igniter, in particular for single-shot type fireworks (10), the system comprising a casing (11), in which the pyrotechnic components are housed, said casing having a first side that is open and a second side with a shaped connector (12), said shaped connector (12) comprising a channel (15) for connecting to said pyrotechnic components and adapted to removably receive an electric igniter (16), said electric igniter (16) being rigidly coupled to a printed circuit (18) on a PCB support (17), the printed circuit comprising two concentric tracks which are short-circuited via a connection track on a break-away tab (19) of the PCB support (17), whereby removal of the tab (19) eliminates the short-circuit, said shaped connector (12) being couplable, in a removable manner and with freedom of rotation with respect to an axis, to a docking base (13), said docking base (13) comprising the electronic components for transmission of an electrical signal to said electric igniter (16) and in particular three contacts (20), aligned with each other and dimensioned in relation to said printed circuit (18), ensuring connection between the tracks of said printed circuit (18) and the contacts (20) independently of the angular position of said shaped connector (12) with respect to said docking base.
HETEROGENOUS SOCKET CONTACT FOR ELECTRICAL AND MECHANICAL PERFORMANCE SCALING IN A MICROELECTRONIC PACKAGE
A microelectronic socket structure and a method of forming the same. The socket structure comprises: a socket structure housing defining a cavity therein; and an interconnection structure including: a contact element disposed at least in part within the cavity, and configured to be electrically coupled to a corresponding microelectronic package, the contact element corresponding to one of a signal contact element or a ground contact element; and a conductive structure disposed at least in part within the cavity, electrically coupled to the contact element, and having an outer contour that is non-conformal with respect to an outer contour of the contact element.
Hybrid socket for higher thermal design point processor support
A power delivery system for a hardware processor includes a motherboard (MB), a voltage regulator (VR), an elastomer computer socket, and a plurality of power delivery paths within the socket. The socket connects the MB to the processor and comprises a first set of power pins that is connected to the processor by surface mount elements, and a second set of power pins that is not connected to the processor by surface mount elements. The plurality of electrical power delivery paths deliver VR power from the second set of C power pins to the first set of power pins for power delivery to the processor. The alignment frame aligns the processor, the plurality of power pins, and the MB. The plurality of power paths alone may meet the power demands of the processor. If not, a power plane from the MB provides additional power.
LIGHT ASSEMBLY SYSTEM INCLUDING A LIGHT ASSEMBLY AND A SOFTWARE REFLASH KIT AND A METHOD OF OPERATION
A light assembly system includes a light assembly and a software reflash kit for updating software of an internal control unit of the light assembly. The light assembly is constructed for releasable receipt of an electrical communication device of the software reflash kit. The light assembly includes a housing, the control unit, and an access port. The housing defines an enclosed, sealable, chamber. The control unit is located in the chamber. The access port is defined by and communicates through, the housing, and is adapted to receive the electrical communication device for detachable electrical engagement to the control unit.
Adapter and external support structure for biosignal measurement system, biosignal measurement system and connection method
A biosignal measurement system comprises an adapter for a biosignal measurement device, and an external support structure separate from the adapter. The adapter comprises tool-less connectors, which are repeatedly connectable to and disconnectable from their counter connectors of the external support structure, and a device connector, which has an electrical connection with the tool-less connectors and which has a connection with the biosignal measurement device that the adapter carries. The external support structure comprises an electrode support structure with electrodes and tool-less counter connectors, the electrodes and the tool-less counter connectors having an electrical connection therebetween. The electrodes form an electrical contact with skin for receiving the biosignal. The counter connectors are in electrical contact with the connectors of the adapter for transferring the biosignal to the biosignal measurement device through the adapter.
Board-to-board connector
A connector is mounted on an input-output board. The connector is interposed between the input-output board and a CPU board, and thereby a plurality of pads of the input-output board and a plurality of pads of the CPU board are respectively electrically connected. The connector includes a rectangular flat-plate housing having a first positioning hole and a second positioning hole, and at least one contact row held on the housing. The first positioning hole is formed at a first housing corner part of the housing. The second positioning hole is formed at a fourth housing corner part, which is at a diagonal position with respect to the first housing corner part, of the housing.
SEALED ELECTRICAL CONNECTOR
Devices and methods for a sealed electrical connector are described herein. Some embodiments include a spring connecting a first PCB to a second PCB, wherein the spring includes a first end portion in contact with the first PCB, a second end portion in contact with the second PCB, and a middle portion extending between the first end portion and the second end portion, a spacer surrounding the middle portion of the spring, a first seal seated in a first groove of the spacer and in contact with the first PCB, and a second seal seated in a second groove of the spacer and in contact with the second PCB.
CONNECTOR AND FORMING METHOD OF CONNECTOR
A connector comprises an insert-molded body. The insert-molded body comprises a housing and a terminal partially embedded in the housing. The housing has a main portion. The main portion is formed with a trace hole and an accommodation space. The terminal has a held portion, a bent-back portion extending forward from the held portion, a support portion extending rearward from the bent-back portion and a contact portion supported by the support portion. The held portion has a wide portion. When the insert-molded body is seen from above, the wide portion is, at least in part, visible through the trace hole. Each of the support portion and the contact portion has a size smaller than that of the wide portion in the lateral direction. The wide portion is partially visible through the accommodation space when the insert-molded body is seen from below.