A terminal unit assembly in which a plurality of terminal units extending in a longitudinal direction are arranged in a lateral direction orthogonal to the longitudinal direction, and a frame member including an assembly accommodating recess for accommodating the terminal unit assembly; wherein the terminal unit includes a longitudinally extending terminal holding part, a main body held by the terminal holding part, a plurality of terminals including contact parts protruding above the top face or below the bottom face of the terminal unit and contact arms connecting the main body to the contact parts, and a housing wall extending in the longitudinal direction; and the terminal holding part includes a plurality of laterally protruding protrusions, and at least one of the protrusions abuts against a housing wall of an adjacent terminal unit.

A plurality of laterally extending modules aligned longitudinally orthogonal to the lateral direction with terminals attached to each module housing, each terminal including a longitudinally extended main body held in the module housing, a contact arm extending upward or downward from the main body, the contact arm including a contact portion contacting a counter terminal, a first bent portion connected to the main body and bent upward or downward, and a second bent portion formed between the contact portion and the first bent portion and bent in a direction opposite to the first bent portion.

A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.

In a terminal module, a case includes a pair of side walls and a terminal member includes a first terminal relatively movable with respect to the pair of side walls. Each of the pair of side walls includes a first divided wall portion and a second divided wall portion. The first divided wall portion includes a first terminal receiving portion. The second divided wall portion includes a second terminal receiving portion. The first terminal includes a guided portion, a first engaging portion and a second engaging portion. The respective first divided wall portions of the pair of respective side walls are parallel to each other. The respective second divided wall portions of the pair of respective side walls are parallel to each other. At the first position, the guided portion of the first terminal is arranged between the first divided wall portion and the second divided wall portion.

An electrical connector comprises a substrate, a datum reference position, a first electrical terminal, a second electrical terminal, a first plurality of intermediary members, a first plurality of contact members, a second plurality of intermediary members, and a second plurality of contact members. The first plurality of intermediary members is between the first electrical terminal and the datum reference position. The second plurality of intermediary members is between the second electrical terminal and the datum reference position. A connector array comprises one or more of the electrical connectors. A testing apparatus comprises a tester base, a supporting member, a frame, one or more of the connector arrays, and an upper cover.

An electrical contact for connecting a chip module to a print circuit board, the electrical contact comprises a main body, an upper elastic arm and a lower mounting arm extending upwardly from the main body, and a lower elastic arm and a lower mounting arm extending downwardly from the main body. The upper mounting arm is disposed at the downside of the upper elastic arm and forms a space therebetween; the lower mounting arm is disposed at the downside of the lower elastic arm and forms a space therebetween. The upper elastic arm and the lower elastic arm are respectively deformed by the chip module and print circuit board to resist to the upper mounting arm and lower mounting arm, thereby shortening the current path between the chip module and the print circuit board for improving the high frequency performance of an electrical connector.

A plurality of module housings extending in a lateral direction and arranged in a longitudinal direction orthogonal to the lateral direction, and terminals attached to the module housings are included. The terminals each include a pair of contact parts respectively projecting upward above an upper surface and downward below a lower surface of each of the module housings, and a first direction conversion mechanism configured to convert at least some of displacement and a force received by the pair of contact parts in an upper-lower direction orthogonal to the lateral direction and the longitudinal direction into displacement and a force in the longitudinal direction. The module housings each include a second direction conversion mechanism configured to convert at least some of displacement and a force received from each of the terminals in the longitudinal direction into displacement and a force in the upper-lower direction.

An electrical connector includes an insulative housing and a contact module essentially composed of a plurality of contacts integrally formed within an insulator via an insert-molding process wherein the contact module is assembled to the housing via two steps along different directions perpendicular to each other. The housing forms a plurality of protrusions engaged with the corresponding ribs of contact module in the vertical direction so as to retain the contact module to the housing reliably. All the insulator, the contacts and the housing are arranged in a staggered manner

Housing includes: insertion part into which a connection target is inserted; a plurality of first grooves provided inside insertion part so as to align along an alignment direction being perpendicular to the insertion direction of the connection target, first contact parts being respectively disposed in first grooves; a plurality of second grooves provided inside insertion part so as to oppose to first grooves, second contact parts being respectively disposed in second grooves; first partition wall partitioning adjacent first contact parts; and second partition wall partitioning adjacent second contact parts. At least one of first partition wall and second partition wall has a height dimension in a direction perpendicular to both the insertion direction and the alignment direction, the height dimension being smaller at least at one end in the alignment direction than at a portion between opposite ends in the alignment direction in order to reduce capacitance between contact parts.

An electrical component socket includes a socket body arranged on a circuit board and including a receiving portion configured to receive an electrical component. The socket body includes an arrangement portion in which a row of contact pins to be in contact with leads of an IC package is arranged. At least one of these contact pins and another one of the contact pins adjacent to the at least one of the contact pins have an arrangement pitch that is narrower than a pitch between the terminals of the electrical component, and the other one of the contact pins and still another one of the contact pins adjacent to the other one of the contact pins have an arrangement pitch that is substantially equal to the pitch between the terminals of the electrical component.