A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.

A testing apparatus comprises a tester base, a supporting member, a frame, one or more electrical connectors and an upper cover. Each electrical connector includes a set of contact members that are positioned on a substrate and having first and second arm portions made of an electrically conductive material. The one or more electrical connectors are mounted on top of ribs in the supporting members and each of the electrical connectors is separated from an adjacent electrical connector by a respective pair of protrusions formed on opposite sides of the frame. Each of the second arm portions of the set of contact members of each electrical connector are disposed in a respective through hole formed in a panel of the supporting member.

An interposer configured for connecting offset arrays of signal pads on parallel surfaces. Contacts of the interposer have mating portions with multiple beams. One of the beams makes contact with a pad on a first of the surfaces and is deflected when the surfaces are pressed together with the interposer between them. A second of the beams is positioned so that the first beam presses into that second beam as the first beam deflects. The second beam may contact a central location on the first beam. An electrical path through the contact from a pad on the first surface to a pad on the second surface may be shorter when the first beam is pressed into the second beam than through the first beam alone. A shorter path may improve signal integrity. Moreover, the spring force of the contact may be set by the second beam.

The present invention provides for a method and structure for forming three-dimensionally routed dielectric wires between discrete points on the two or more parallel circuit planes. The wires may be freely routed in three-dimensional space as to create the most efficient routing between the two arbitrarily defined points on the two or more parallel circuit planes. Metalizing the outer surfaces of these three dimensional dielectric wires electrically coupling the discrete wires to their respective discrete contact points. Two or more of these wires may be in intimate contact to one another electrically coupling to each other as well as to two or more discrete contact pads. These electrically coupled contact pads may be on opposite sides or on the same side of the structure and the formed metalized wires may originate on one side and terminate on the other or originate and terminate from the same side

An implantable medical device includes a cover assembly and a feedthrough assembly that couples with the cover assembly. The cover assembly receives a connector end of a lead having lead contacts, and aligns the lead contacts with pockets or apertures of the cover assembly. The feedthrough assembly may include feedthrough contacts in the form of feedthrough pins at or above a surface of a feedthrough substrate, or conductive vias on the surface of the substrate. Electrical contacts configured as leaf spring contact assemblies, torsion spring contacts, or torsion spring contact assemblies are permanently attached to the feedthrough contacts. When the cover assembly and feedthrough assembly are coupled, contact tabs of the electrical contacts are positioned in the pockets or apertures of the cover assembly. Upon complete seating of the cover assembly and feedthrough assembly, the contact tabs are compressed into contact with the lead contacts.

A socket connector includes a substrate having an upper surface and a lower surface. The substrate has a ground plane between the upper surface and the lower surface. The substrate includes contact channels between the upper and lower surfaces. The socket connector includes socket contacts received in corresponding contact channels. Each socket contact includes a contact body, an upper mating element, and a lower mating element. The upper mating element is deflectable relative to the contact body and extends to the upper surface to interface with a first electrical component. The lower mating element is deflectable relative to the contact body and extends to the lower surface to interface with a second electrical component. A plurality of the socket contacts are electrically connected to the ground plane.

An electronic device includes a casing, first and second batteries and a conductive plate. The first and second batteries are disposed in a battery slot of the casing. The conductive plate is clamped between the first and second batteries, and has a mounting portion that is mounted pivotally into a mounting groove of the casing such that the conductive plate is pivotable between a clamped position where a conductive body of the conductive plate is clamped between the first and second batteries, and an unclamped position where the conductive body is spaced apart from the first and second batteries for removal and installment of one of the first and second batteries.

An electrical connector includes: a housing defining a first face and a second face opposite to the first face, plural grooves through the first face and the second face in an upper-lower direction, and plural positioning slots corresponding to the grooves; and plural terminals arranged in a matrix and retained in the housing, each terminal comprising a main portion, a first elastic arm extending toward the first face from the main portion, and a connecting portion extending towards the second face from the main portion, the first elastic arm defining a first contact portion protruding beyond the first face, wherein the main portions are received in the positioning slots, the housing defines a resisting portion at the first face near each positioning slot, and the resisting portions restrict the main portions from moving toward the first face of the housing.

The invention deals with a support for light source(s) for a light module, notably for a motor vehicle, comprising a substrate; at least one surface light source of the organic light-emitting diode type supported by the substrate, the at least one surface light source comprising, at one or more edges, at least two electrical contact zones; electrical tracks deposited on the substrate; and electrical contacts between the electrical contact zones of the light source or sources and the electrical tracks. The electrical contacts comprise elastic blades, in contact under pressure with the contact zone or zones of the surface light source or sources and with the electrical tracks on the substrate.

A contact assembly includes a plurality of contacts serving as a socket in a laminated state and a spring. The contacts each have a mating portion forming the socket and a caught portion caught on a caught portion of another one of the contacts in a lamination direction of the contacts. At least two of the contacts adjacent to each other in the lamination direction have electrical continuity with each other via the spring that is compressible in the lamination direction between the caught portion of each of the contacts.