A first terminal housing chamber of a terminal body includes a first elastic contact part that contacts the first counterpart terminal while imparting resilient force in a direction orthogonal to an insertion direction of the first counterpart terminal, and gaps with respect to the first counterpart terminal in a direction orthogonal to the insertion direction of the first counterpart terminal and the resilient force imparting direction of the first elastic contact part. A second terminal housing chamber of the terminal body includes a second elastic contact part that contacts the second counterpart terminal while imparting resilient force in a direction orthogonal to an insertion direction of the second counterpart terminal, and gaps with respect to the second counterpart terminal in a direction orthogonal to the insertion direction of the second counterpart terminal and the resilient force imparting direction of the second elastic contact part.

A memory card includes a substrate, first row terminals and second row terminals. The substrate has a first pair of side edges extending in a first direction and a second pair of side edges extending in a second direction perpendicular to the first direction. The first row terminals are arranged adjacent to an insertion side edge of the substrate, the first row terminals including a first power terminal, the insertion side edge being one of the first pair of side edges. The second row terminals are arranged further from the insertion side edge than the first row terminals, the second row terminals including a second power terminal. At least one recessed terminal among the first and second row terminals includes a recess area in an exposed surface of the at least one terminal.

An electrical connector is used to be electrically connected to a chip module, and includes a body provided with at least one accommodating groove. The body has a supporting block protrudingly provided upward at one side of the accommodating groove, and the supporting block is configured to upward support the chip module. At least one terminal is correspondingly accommodated in the at least one accommodating groove. The terminal includes: a first base accommodated in the accommodating groove; an elastic arm formed by bending and extending forward from the first base and located at one side of the supporting block to be electrically connected to the chip module; and a through slot running vertically through the elastic arm. The supporting block has a rear end. The first base is located behind the rear end. The through slot extends forward and does not pass beyond the rear end.

An electrical connector is used for electrically connecting a chip module to a circuit board, and includes an insulating body provided with at least one accommodating slot, and at least one terminal provided in the at least one accommodating slot. The terminal has a first base and a second base formed by bending from the first base. An elastic arm is formed by bending upward and extending from the first base. The elastic arm is provided with a contact portion to be conductively connected with the chip module. The first base has a retaining portion located at a lower end thereof and extending downward. The retaining portion fits with the at least one accommodating slot to retain the terminal in the insulating body. A conducting portion extends downward from the second base to be conductively connected with the circuit board.

The present disclosure relates to a movable socket assembly. The movable socket assembly may include a housing, a plug part installed in said housing, a plurality of elastic conducting contact points formed on said plug part, and an adjusting mechanism for positioning the plug part out of the housing so that the plug part can be removably inserted into an external power outlet. The housing may further include a first housing and a second housing, and the second housing can retract into the first housing to extend the flat insertion piece out of the housing through an opening of the second housing.

A memory card includes a substrate, first row terminals and second row terminals. The substrate has a first pair of side edges extending in a first direction and a second pair of side edges extending in a second direction perpendicular to the first direction. The first row terminals are arranged adjacent to an insertion side edge of the substrate, the first row terminals including a first power terminal, the insertion side edge being one of the first pair of side edges. The second row terminals are arranged further from the insertion side edge than the first row terminals, the second row terminals including a second power terminal. At least one terminal among the first and second row terminals includes a recess area in an exposed surface of the at least one terminal.

An electrical connector used to be electrically connected to a chip module includes a body provided with multiple accommodating holes running through the body and at least one accommodating grooves. Each accommodating groove is formed between two adjacent accommodating holes to communicate the two adjacent accommodating holes with each other. Multiple terminals are correspondingly accommodated in the accommodating holes respectively. Each terminal includes a base and an elastic portion bending and extending upward from the base, and the elastic portion upward abuts the chip module. Each accommodating groove correspondingly accommodates the base of one of the terminals. Each accommodating groove is used for lowering strength of the body. When the electrical connector is soldered to a circuit board by high-temperature heating, the body is prone to be softened under the high temperature and thus becomes smooth, such that warping occurring during forming of the body is eliminated.

A power connector includes an insulating body and a power terminal module. The power terminal module includes a first power terminal and a second power terminal. The first power terminal includes a first elastic arm, a second elastic arm, a first abutting arm and a second abutting arm. The second power terminal includes a third elastic arm, a fourth elastic arm and a space between the third elastic arm and the fourth elastic arm. The first elastic arm and the second elastic arm extend into the space. The first abutting arm abuts against the third elastic arm. The second abutting arm abuts against the fourth elastic arm. As a result, the power connector has greater plugging force and better heat dissipation performance.

An electrical connector includes an insulating body and multiple terminals. The insulating body has multiple terminal holes running through an upper surface and a lower surface thereof. Each terminal has a connecting portion correspondingly located in a corresponding terminal hole, a conducting portion extending from the connecting portion, an elastic arm formed by bending upward and extending from the connecting portion upward out of the corresponding terminal hole, and a contact portion bending upward and extending from the elastic arm. When a chip module is pressed downward, a bottom surface of each conductive sheet of a circuit board downward abuts a top surface of the contact portion, and the elastic arm deforms downward. The contact portion, the elastic arm, the connecting portion and the conducting portion are integrally formed. A thickness of the connecting portion is greater than a thickness of the contact portion.

A socket connector includes a socket substrate having first socket substrate conductors and second socket substrate conductors, receptacle contacts electrically coupled to corresponding first socket substrate conductors and socket contacts electrically coupled to corresponding second socket substrate conductors. The receptacle contacts have receptacles receiving pin contacts of an electronic package and the socket contacts have terminating ends and mating ends with deflectable spring beams terminated to package contacts of the electronic package. At least one of the first socket substrate conductors and the second socket substrate conductors are configured to electrically connect the electronic package with the host circuit board.