Embodiments of the present invention generally relate to communication connectors, and methods of manufacture thereof and their components. In some embodiments, the methods focus on reducing the net effect on electrical performance of communication connectors from variation in manufacturing, where the connectors include multiple stages of capacitive coupling.

Embodiments of the present invention generally relate to communication connectors, and methods of manufacture thereof and their components. In some embodiments, the methods focus on reducing the net effect on electrical performance of communication connectors from variation in manufacturing, where the connectors include multiple stages of capacitive coupling.

A RJ connector assembly having the characteristics of simple structural design, effective and rational use of space and compact structure is disclosed to include an input PCB module including an input PC board and two RJ modular terminal blocks bonded to two opposite sides of the input PC board, an output PCB module including an output PC board disposed in parallel to the input PC board and an output interface located on the output PC board, and a connecting PCB module including a connecting PC board with a top side thereof electrically bonded to the input PC board and an opposing bottom side thereof electrically bonded to the output PC board.

A RJ connector assembly having the characteristics of simple structural design, effective and rational use of space and compact structure is disclosed to include an input PCB module including an input PC board and two RJ modular terminal blocks bonded to two opposite sides of the input PC board, an output PCB module including an output PC board disposed in parallel to the input PC board and an output interface located on the output PC board, and a connecting PCB module including a connecting PC board with a top side thereof electrically bonded to the input PC board and an opposing bottom side thereof electrically bonded to the output PC board.

A capacitive coupling system includes a plurality of conductive pads situated on a dielectric layer. A plurality of switches are connected between pairs of the conductive pads via conductive linkages. The switches are operable to selectively connect selected pairs of the conductive pads to selectively adjust capacitances between conductor pairs of an electrical connector.

A capacitive coupling system includes a plurality of conductive pads situated on a dielectric layer. A plurality of switches are connected between pairs of the conductive pads via conductive linkages. The switches are operable to selectively connect selected pairs of the conductive pads to selectively adjust capacitances between conductor pairs of an electrical connector.

An electronic device includes a housing, a circuit board, a charging interface and an antenna unit. The housing is provided with an external interface. The circuit board is arranged in the housing and includes a grounding metal. The charging interface is arranged in the housing and in communication with the external interface. The charging interface includes a metal casing. The metal casing is provided with a plurality of grounding solder pads, and the grounding solder pads are arranged to be separated from the grounding metal. The antenna unit is coupled with the charging interface.

A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, a shielding case surrounding the housing, a circuit board in the housing having a substrate, a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing, a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing, a first set of traces on a top layer of the substrate that connects at least one first via with at least one corresponding second via; and a second set of traces on a side of the substrate opposite the top layer that connects at least one first via with at least one second via.

A communication plug configured to be mated with a communication outlet. The plug has first contacts configured to physically contact and form electrical connections with second contacts of the outlet. The plug also includes a substrate with wire contacts and first, second, third, and fourth layers. The first layer includes first conductors connecting a first portion of the first contacts with a first portion of the wire contacts. The fourth layer includes second conductors connecting a second portion of the first contacts with a second portion of the wire contacts. The second layer includes a first plurality of capacitor plates electrically connected to first selected ones of the first contacts. The third layer includes a second plurality of capacitor plates electrically connected to second selected ones of the first contacts. Each of the first plurality of capacitor plates forms a capacitor with at least one of the second plurality of capacitor plates.

A communication plug configured to be mated with a communication outlet. The plug has first contacts configured to physically contact and form electrical connections with second contacts of the outlet. The plug also includes a substrate with wire contacts and first, second, third, and fourth layers. The first layer includes first conductors connecting a first portion of the first contacts with a first portion of the wire contacts. The fourth layer includes second conductors connecting a second portion of the first contacts with a second portion of the wire contacts. The second layer includes a first plurality of capacitor plates electrically connected to first selected ones of the first contacts. The third layer includes a second plurality of capacitor plates electrically connected to second selected ones of the first contacts. Each of the first plurality of capacitor plates forms a capacitor with at least one of the second plurality of capacitor plates.