Embodiments disclosed herein include sockets and socket architectures. In an embodiment, a socket comprises a substrate. In an embodiment, an opening is provided through the substrate. In an embodiment, an elastomeric pin inserted into the opening. In an embodiment, the elastomeric pin is electrically conductive.

The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.

The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.

A plug connector (1) for connection of a data line, having a plug housing (2) with one or more connection elements (3) each connection element being for connection of a respective wire of the data line. The connection elements have one or more contact elements (4), and one or more conductor elements (5), via each of which a connection element (3) is electrically conductively connected to a contact element (4). Return damping of the plug connector (1) is reduced in that at least one portion (6) of the individual conductor elements (5) or at least one portion of the individual contact elements (4) is designed and arranged such that the wave impedance of the portion (6) is purposefully mismatched so that the value of the wave impedance deviates from the nominal wave impedance of the data line.

Methods and systems for providing crosstalk compensation in a jack are disclosed. According to one method, the crosstalk compensation is adapted to compensate for undesired crosstalk generated at a capacitive coupling located at a plug inserted within the jack. The method includes positioning a first capacitive coupling a first time delay away from the capacitive coupling of the plug, the first capacitive coupling having a greater magnitude and an opposite polarity as compared to the capacitive coupling of the plug. The method also includes positioning a second capacitive coupling at a second time delay from the first capacitive coupling, the second time delay corresponding to an average time delay that optimizes near end crosstalk. The second capacitive coupling has generally the same overall magnitude but an opposite polarity as compared to the first capacitive coupling, and includes two capacitive elements spaced at different time delays from the first capacitive coupling.

Methods and systems for providing crosstalk compensation in a jack are disclosed. According to one method, the crosstalk compensation is adapted to compensate for undesired crosstalk generated at a capacitive coupling located at a plug inserted within the jack. The method includes positioning a first capacitive coupling a first time delay away from the capacitive coupling of the plug, the first capacitive coupling having a greater magnitude and an opposite polarity as compared to the capacitive coupling of the plug. The method also includes positioning a second capacitive coupling at a second time delay from the first capacitive coupling, the second time delay corresponding to an average time delay that optimizes near end crosstalk. The second capacitive coupling has generally the same overall magnitude but an opposite polarity as compared to the first capacitive coupling, and includes two capacitive elements spaced at different time delays from the first capacitive coupling.

Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.

Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.

An electronic device includes a housing, a circuit board, a charging interface and an antenna unit. The housing is provided with an external interface. The circuit board is arranged in the housing and includes a grounding metal. The charging interface is arranged in the housing and in communication with the external interface. The charging interface includes a metal casing. The metal casing is provided with a plurality of grounding solder pads, and the grounding solder pads are arranged to be separated from the grounding metal. The antenna unit is coupled with the charging interface.

An electronic device includes a housing, a circuit board, a charging interface and an antenna unit. The housing is provided with an external interface. The circuit board is arranged in the housing and includes a grounding metal. The charging interface is arranged in the housing and in communication with the external interface. The charging interface includes a metal casing. The metal casing is provided with a plurality of grounding solder pads, and the grounding solder pads are arranged to be separated from the grounding metal. The antenna unit is coupled with the charging interface.