A modular jack connector compensates for plug characteristics via a controlled primary compensation in the immediate vicinity of the connector interface. A jack contact assembly is positioned within a jack housing and includes first and second sets of elongate contacts each having a plug contact portion and a signal output portion. Each elongate contact is configured such that their respective plug contact portions are coplanar and a signal path is defined between their plug contact portions and their signal output portions. A flexible circuit board is coupled proximate to the plug contact portions, and configured to provide capacitance compensation between respective contacts engaged thereby, wherein the capacitance compensation is offset from a signal path defined between the plug contact portions and the corresponding signal output portions.

A modular jack connector compensates for plug characteristics via a controlled primary compensation in the immediate vicinity of the connector interface. A jack contact assembly is positioned within a jack housing and includes first and second sets of elongate contacts each having a plug contact portion and a signal output portion. Each elongate contact is configured such that their respective plug contact portions are coplanar and a signal path is defined between their plug contact portions and their signal output portions. A flexible circuit board is coupled proximate to the plug contact portions, and configured to provide capacitance compensation between respective contacts engaged thereby, wherein the capacitance compensation is offset from a signal path defined between the plug contact portions and the corresponding signal output portions.

Embodiments of the present invention relate to the field of telecommunication, and more specifically, to communication connectors such as, for example, shielded plug and jack connectors. In an embodiment, the present invention is a communication jack that includes a housing and a front sled assembly having a plurality of plug interface contacts (PICs), the front sled assembly being moveable along a horizontal plane of the communication jack between a first position and a second position, the first position being different from the second position.

Microelectronic assemblies, as well as related structures, devices, and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a microelectronic device having a hexagonal node configuration, wherein the hexagonal node configuration may include a differential signal node pair; a power node; and a plurality of ground nodes; and wherein the differential signal node pair, the power node, and the plurality of ground nodes are arranged in a hexagonal parallelogon pattern, wherein the differential signal node pair includes a first differential signal node adjacent to a second differential signal node, and wherein the power node is adjacent and symmetric to the differential signal node pair; and a microelectronic substrate electrically coupled to the microelectronic device.

Microelectronic assemblies, as well as related structures, devices, and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a microelectronic device having a hexagonal node configuration, wherein the hexagonal node configuration may include a differential signal node pair; a power node; and a plurality of ground nodes; and wherein the differential signal node pair, the power node, and the plurality of ground nodes are arranged in a hexagonal parallelogon pattern, wherein the differential signal node pair includes a first differential signal node adjacent to a second differential signal node, and wherein the power node is adjacent and symmetric to the differential signal node pair; and a microelectronic substrate electrically coupled to the microelectronic device.

A modular RJ45-type plug apparatus is provided for forming a connector interface with a connector jack in a high speed data transmission network. A housing comprises an insulative front portion and a conductive shield portion attachable to define an interior, within which is positioned a contact subassembly including a first PCB having cable mounting pads on one end and through holes for elongate plug contacts on the other end. The contacts are connected on one end to the first PCB and on a second end to a second PCB, with bridge portions therebetween collectively defining a jack contact interface. The second PCB comprises desired electrical characteristics which provide the apparatus with certain capacitance compensation properties, wherein the capacitance compensation is offset from a signal path defined between the jack-plug connector interface and the cable pairs.

A modular RJ45-type plug apparatus is provided for forming a connector interface with a connector jack in a high speed data transmission network. A housing comprises an insulative front portion and a conductive shield portion attachable to define an interior, within which is positioned a contact subassembly including a first PCB having cable mounting pads on one end and through holes for elongate plug contacts on the other end. The contacts are connected on one end to the first PCB and on a second end to a second PCB, with bridge portions therebetween collectively defining a jack contact interface. The second PCB comprises desired electrical characteristics which provide the apparatus with certain capacitance compensation properties, wherein the capacitance compensation is offset from a signal path defined between the jack-plug connector interface and the cable pairs.

The present invention discloses a circuit substrate, including a first signal end, a second signal end, a first circular capacitor structure, and a second circular capacitor structure. The first circular capacitor structure is electrically connected to the first signal end. The second circular capacitor structure is electrically connected to the second signal end. The first circular capacitor structure and the second circular capacitor structure are located in different planes of the circuit substrate.

The present invention discloses a circuit substrate, including a first signal end, a second signal end, a first circular capacitor structure, and a second circular capacitor structure. The first circular capacitor structure is electrically connected to the first signal end. The second circular capacitor structure is electrically connected to the second signal end. The first circular capacitor structure and the second circular capacitor structure are located in different planes of the circuit substrate.

An inline communications connector is provided that includes a housing and tip and ring contacts that are mounted in the housing. The tip contact includes an input tip socket, an output tip socket and a tip socket connection section that physically and electrically connects the input and output tip sockets. The ring contact includes an input ring socket, an output ring socket and a ring socket connection section that physically and electrically connects the input and output ring sockets. The input tip socket is not collinear with the output tip socket and the input ring socket is not collinear with the output ring socket.