A medical device assembly comprises a medical device comprising a shaft having proximal and distal end portions. The device further comprises a sensor at the distal end portion of the shaft that comprises first and second leads extending therefrom to the proximal end portion of the shaft. The device further comprises an electromechanical connector having a plurality of pins at a first end thereof. First and second of the pins are electrically connected to the first and second sensor leads, respectively, thereby forming a first partial magnetic loop between the first and second pins. The connector further comprises first and second jumpers electrically connecting the first pin and third pins, and second and fourth pins, respectively, thereby forming a second partial magnetic loop. The partial magnetic loops are configured to combine with partial magnetic loops of another connector to form a pair of magnetic noise cancellation loops.

An electrical connector that includes a circuit board having a board substrate that has opposite board surfaces and a thickness measured along an orientation axis that extends between the opposite board surfaces. The circuit board has associated pairs of input and output terminals and signal traces that electrically connect the associated pairs of input and output terminals. The input and output terminals being configured to communicatively coupled to mating and cable conductors, respectively. Each associated pair of input and output terminals is electrically connected through a corresponding signal trace that has a conductive path extending along the board substrate between the corresponding input and output terminals. At least two signal traces form a broadside-coupling region in which the conductive paths of the at least two signal traces are stacked along the orientation axis and spaced apart through the thickness and extend parallel to each other for a crosstalk-reducing distance.

An electrical connector that includes a circuit board having a board substrate that has opposite board surfaces and a thickness measured along an orientation axis that extends between the opposite board surfaces. The circuit board has associated pairs of input and output terminals and signal traces that electrically connect the associated pairs of input and output terminals. The input and output terminals being configured to communicatively coupled to mating and cable conductors, respectively. Each associated pair of input and output terminals is electrically connected through a corresponding signal trace that has a conductive path extending along the board substrate between the corresponding input and output terminals. At least two signal traces form a broadside-coupling region in which the conductive paths of the at least two signal traces are stacked along the orientation axis and spaced apart through the thickness and extend parallel to each other for a crosstalk-reducing distance.

A communications plug, for high frequency applications, includes a housing, a plurality of contact conductor blades and insulation displacement contacts. A printed circuit board has a plurality of transmission paths connecting corresponding blades and insulation displacement contacts. The plug has a major coupling including coupling between the blades. The PCB further includes a compensation coupling arrangement that provides a smaller coupling as compared to the major coupling. The compensation coupling is no more than one half of the major coupling and has a different polarity from that of the major coupling. The compensation coupling is connected to a set of transmission paths at a location between the major coupling and the insulation displacement contacts.

A communications plug, for high frequency applications, includes a housing, a plurality of contact conductor blades and insulation displacement contacts. A printed circuit board has a plurality of transmission paths connecting corresponding blades and insulation displacement contacts. The plug has a major coupling including coupling between the blades. The PCB further includes a compensation coupling arrangement that provides a smaller coupling as compared to the major coupling. The compensation coupling is no more than one half of the major coupling and has a different polarity from that of the major coupling. The compensation coupling is connected to a set of transmission paths at a location between the major coupling and the insulation displacement contacts.

Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.

Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.

A connector includes a wafer having first, second, third, and fourth communication channels. The first and second communication channels form a first differential pair, and the third and fourth communication channels form a second differential pair. The wafer includes a plug and a receptacle. The plug includes a first portion of the first, second, third, and fourth communication channels. The receptacle includes a second portion of the first, second, third, and fourth communication channels. A first crisscross is located at a first predetermined location of the first and second communication channels of the first differential pair. The first crisscross changes a first polarity of a first signal to be transmitted on the first differential pair. A second polarity of a second signal to be transmitted on the second differential pair remains the same throughout an entire length of the second differential pair.

A connector includes a wafer having first, second, third, and fourth communication channels. The first and second communication channels form a first differential pair, and the third and fourth communication channels form a second differential pair. The wafer includes a plug and a receptacle. The plug includes a first portion of the first, second, third, and fourth communication channels. The receptacle includes a second portion of the first, second, third, and fourth communication channels. A first crisscross is located at a first predetermined location of the first and second communication channels of the first differential pair. The first crisscross changes a first polarity of a first signal to be transmitted on the first differential pair. A second polarity of a second signal to be transmitted on the second differential pair remains the same throughout an entire length of the second differential pair.

An electronic device including a universal serial bus type-C connector. The connector includes a first plurality of contacts and a second plurality of contacts. Each of the first plurality of contacts and each of the second plurality of contacts include a first layer formed of a first material and a second layer formed of a second material, the second layer over the first layer. The second layer is present in a first area of each of the first plurality of contacts and the second layer is absent from the first area of each of the second plurality of contacts.