A signal transmission cable has a cable including a dielectric layer and a metallic layer. The signal transmission cable further includes a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.

A signal transmission cable has a cable including a dielectric layer and a metallic layer. The signal transmission cable further includes a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.

An electrical connector includes a housing, signal pods, and ground shields. The housing has a base that is electrically conductive. The base has chambers and ground slots extending therethrough. The chambers are defined by chamber walls that separate the chambers from the ground slots. The signal pods, which each include a dielectric body holding a pair of signal contacts, are received in the chambers. The dielectric body engages the chamber walls and electrically insulates the signal contacts from the base. The ground shields are received in the ground slots. Each ground shield surrounds an associated signal pod on at least two sides to provide electrical shielding for the signal contacts in the signal pod from other signal contacts.

A ground contact module includes a ground leadframe and a ground dielectric body. The ground leadframe has ground contacts extending between corresponding mating ends and terminating ends with transition portions therebetween. The ground dielectric body holds the ground leadframe and has a low loss layer overmolded over the ground leadframe and encasing the transition portions of the ground contacts. The ground dielectric body has lossy wings received in pockets in the low loss layer. The lossy wings are electrically coupled to corresponding ground contacts and are manufactured from lossy material capable of absorbing electrical resonance propagating through the contact module stack. The lossy wings are separate and discrete from the low loss layer and are attached to the at least one low loss layer in proximity to the corresponding ground contacts. Each lossy wing is electrically coupled to only one of the ground contacts.

The present disclosure discloses a high-speed connector including an insulating body, a number of conductive terminals, a number of conductive terminals, and a conductive plastic. The insulating body has a back surface. The conductive terminals are retained in the insulating body. The conductive plastic is disposed on the back surface of the insulating body. The cables are electrically connected with the conductive terminals. The cables extend beyond the back surface of the insulating body. The cables pass out of the conductive plastic. The high-speed connector of the present disclosure prevents the interference of electromagnetic signals at the back surface of the insulating body where the cables pass through.

The present disclosure discloses a high-speed connector including an insulating body, a number of conductive terminals, a number of conductive terminals, and a conductive plastic. The insulating body has a back surface. The conductive terminals are retained in the insulating body. The conductive plastic is disposed on the back surface of the insulating body. The cables are electrically connected with the conductive terminals. The cables extend beyond the back surface of the insulating body. The cables pass out of the conductive plastic. The high-speed connector of the present disclosure prevents the interference of electromagnetic signals at the back surface of the insulating body where the cables pass through.

An electrical connector structure includes an insulating housing, a first terminal set, a second terminal set, a third terminal set and at least one conductive member. The first, second and third terminal sets are disposed in the insulating housing. Each of the first and second terminal sets includes a plurality of signal terminals and at least one ground terminal. The conductive member is electrically connected to the ground terminals of the first and second terminal sets, and is not electrically connected to the third terminal set.

A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, a shielding case surrounding the housing, a circuit board in the housing having a substrate, a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing, a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing, a first set of traces on a top layer of the substrate that connects at least one first via with at least one corresponding second via; and a second set of traces on a side of the substrate opposite the top layer that connects at least one first via with at least one second via.

A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, a shielding case surrounding the housing, a circuit board in the housing having a substrate, a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing, a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing, a first set of traces on a top layer of the substrate that connects at least one first via with at least one corresponding second via; and a second set of traces on a side of the substrate opposite the top layer that connects at least one first via with at least one second via.

A connector C to be mounted on a case of a device includes a coated wire 10 formed such that a core 11 is coated with an insulation coating 12, a terminal fitting 20 to be fit and connected to a mating terminal, a flexible conductor 15 interposed between the terminal fitting 20 and an end of the coated wire 10, and a housing 30 made of synthetic resin and accommodating the terminal fitting 20 together with the flexible conductor 15. The core 11 of the coated wire 10 is provided with a core fixing portion 25 integrated with the core 11 and the core fixing portion 25 is embedded in the housing 30 by molding.