A light source device with a safety mechanism includes a wavelength converting device and a laser light source configured to provide a laser beam. The wavelength converting device includes a substrate facing toward the laser light source, an optical converting layer disposed on the substrate, and a safety examination layer disposed on one side of the optical converting layer. After the laser beam passes through the safety examination layer, the laser beam enters the optical converting layer. The safety examination layer includes a first conductive film arranged along a first direction and a second conductive film arranged along a second direction. The first conductive film and the second conductive film intersect each other.

A socket for an electronic component includes: an electrically insulating material; a base body including at least one opening configured for accommodating an electrically conductive pin configured for being electrically connected to the electronic component, the at least one opening being sealed with the electrically insulating material such that the electrically conductive pin is fed through the at least one opening while being electrically insulated from the base body; and a shell part including a pedestal configured for accommodating the electronic component, at least the shell part of the socket including a metal with a thermal conductivity of at least 100 W/mK.

A socket for an electronic component includes: an electrically insulating material; a base body including at least one opening configured for accommodating an electrically conductive pin configured for being electrically connected to the electronic component, the at least one opening being sealed with the electrically insulating material such that the electrically conductive pin is fed through the at least one opening while being electrically insulated from the base body; and a shell part including a pedestal configured for accommodating the electronic component, at least the shell part of the socket including a metal with a thermal conductivity of at least 100 W/mK.

Provided is a light source device, a projector, a machining device, a light source unit, and a light source device adjusting method in which a replacement of a light source unit can be easily performed when required. The light source device 1 includes: a plurality of light source units 21 arranged in a two-dimensional array, each of the plurality of light source units having a plurality of light sources 21 and a support plate 22 supporting the plurality of light sources 21, each of the plurality of light sources 21 including a light emitting element for emitting a laser beam and a package housing the light emitting element; a base substrate 31 having a surface 311 on which the plurality of light source units 2 is arranged; and a fixing member 4 configured to detachably fix the support plate 22 to the base substrate 31.

An electronic-element mounting package includes a wiring substrate having a first surface and a wiring pattern thereon; a base having a second surface and a through hole whose opening is on the second surface; a signal line penetrating the through hole and having a first end exposed from an opening of the through hole; and an insulating member between an inner surface of the through hole and the signal line and has an end portion and a main portion. The end portion has an end surface on a side of the opening of the through hole, and the main portion is farther from the opening of the through hole than the end portion. The electronic-element mounting package also has a conductive joining material with which the wiring pattern and the first end are joined. Permittivity of the end portion is larger than permittivity of the main portion.

There are provided high power, high brightness solid-state laser systems that maintain initial beam properties, including power levels, and do not have degradation of performance or beam quality, for at least 10,000 hours of operation. There are provided high power, high brightness solid-state laser systems containing Oxygen in their internal environments and which are free from siloxanes.

Disclosed herein is a semiconductor laser element capable of suppressing a wavelength dependency of a reflection ratio. A reflective film of the semiconductor laser element includes an L.sub.1 layer arranged at a first position from the end faces of the resonator and having a refractive index of n1; and a periodic structure configured by layering a plurality of pairs of an L.sub.2N layer and an L.sub.2N+1 layer. The L.sub.2N layer has a refractive index of n2, and the L.sub.2N+1 layer has a refractive index of n3, where n2<n3. The L1 layer has a linear expansion coefficient of ±30% with respect to a linear expansion coefficient of the substrate and is made of a film having an optical film thickness thinner than λ/4. An L.sub.2 layer arranged at a second position from the end faces of the resonator is made of a film having an optical film thickness thinner than λ/4.

A light emitting device includes a base member, a laser element, a retaining member, a fluorescent member, and first and second fixing members. The retaining member has a first surface on a laser element side and a second surface not on the laser element side. The fluorescent member is fixed to a through hole of the retaining member. The first and second fixing members clamp the retaining member. The first and second fixing members have first and second contact surfaces in contact with the first and second surfaces of the retaining member, respectively. A distance between the first and second contact surfaces becomes smaller as the first and second contact surfaces become farther from the through hole. The retaining member, the first and second fixing members are arranged such that a space surrounded by the retaining member, and the first and second fixing members exists around the retaining member.

Systems, methods, and other embodiments for utilizing electrical and digital technologies for monitoring and controlling laser sources from an entirely separate location are disclosed. In particular, the present invention relates to using any radio frequency signal in conjunction with driving and control capabilities for application with TO-style laser diodes and TO-style solid-state laser devices of any, and all powers, currents, or voltages.

Systems, methods, and other embodiments for utilizing electrical and digital technologies for monitoring and controlling laser sources from an entirely separate location are disclosed. In particular, the present invention relates to using any radio frequency signal in conjunction with driving and control capabilities for application with TO-style laser diodes and TO-style solid-state laser devices of any, and all powers, currents, or voltages.