A heat dissipation base is suitable for a transistor outline packaged laser diode. The heat dissipation base includes a basal wall and a heat dissipation wall extending outward from one side of the basal wall, the side surface of the basal wall defines a can-shaped packaging area. The heat dissipation wall is located in the packaging area and has a bearing surface. The heat dissipation base further includes an extension wall extending outward from the other side of the basal wall, the basal wall, the heat dissipation wall, and the extension wall are integrated, and the extension wall includes a primary cooling surface for in contact with an external heat dissipation element. The present invention also provides a transistor outline packaged laser diode using the above-mentioned heat dissipation base.

An elongated laser beam optical assembly. The assembly has a laser light source that produces a laser beam. A cylindrical anamorphic lens has a planar surface at a first end and an anamorphic surface at a second end thereof, the first end receiving the laser beam from the laser light source and producing an output laser beam from the second end thereof. An aperture passes the output laser beam from the second end of the anamorphic lens to produce an elongated laser beam.

An optical element mounting package includes a recess, a mounting portion for an optical element, and a reflector. The mounting portion is at a bottom surface of the recess. The reflector is, in the recess, positioned forward in an emission direction of light of the optical element. A first portion is a portion of an inner side surface of the recess, and is positioned in an opposite direction to the emission direction. The first portion has an inclined surface toward the bottom surface of the recess.

An optical element mounting package includes a recess, a mounting portion for an optical element, and a reflector. The mounting portion is at a bottom surface of the recess. The reflector is, in the recess, positioned forward in an emission direction of light of the optical element. A first portion is a portion of an inner side surface of the recess, and is positioned in an opposite direction to the emission direction. The first portion has an inclined surface toward the bottom surface of the recess.

A pump laser package may include an input fiber to send signal light on a first optical path. A first lens may be arranged on the first optical path. The pump laser package may include a source to send pump light on a second optical path. A second lens and a negative lens may be arranged on the second optical path. The first lens and the negative lens may be arranged to create a virtual image associated with the pump light. The pump laser package may include an output fiber on a third optical path. The first lens may be arranged on the third optical path. The pump laser package may include a combiner to receive the signal light on the first optical path, receive the pump light on the second optical path, and send the signal light and the pump light on the third optical path.

A light emitting device includes a semiconductor laser element, a support member and a wavelength conversion member. The support member defines a through-hole through which laser light emitted from the semiconductor laser element passes. The wavelength conversion member has a lateral surface fixed to an inner wall of the through-hole, a first main surface having a first region to which the laser light is incident, a second main surface opposite to the first main surface, and an inclined surface connected to the second main surface and the lateral surface. The inclined surface is inclined such that a thickness of a peripheral portion of the wavelength conversion member is thinner than a thickness of a center portion of the wavelength conversion member. The inclined surface partially overlaps with the first region of the first main surface in plan view.

A laser assembly for use with an additive manufacturing system, which includes a base block configured to be moved along a scan direction axis in the additive manufacturing system, a plurality of laser emitters preferably arranged in an array of at least two rows of two or more laser emitters. At least a portion of a heat sink assembly is configured to draw heat away from the base block and/or the laser emitters. The assembly includes a controller assembly a controller assembly configured to control a movement of the base block along the first axis and to independently control at least timing and duration of energy emitted from each laser emitter of the plurality of laser emitters as the base block moves along the first axis.

A distance detecting system for use in mobile machines comprises a gallium and nitrogen containing laser diode disposed within a light of a mobile machine. The gallium and nitrogen containing laser diode is configured to emit a first light with a first peak wavelength. A wavelength conversion member is configured to produce a white light. A first sensing light signal is based on the first peak wavelength. One or more optical elements are configured to direct at least partially the white light to illuminate one or more target objects or areas and to transmit respectively the first sensing light signal for sensing at least one remote point. A detector is configured to detect reflected signals of the first sensing light signal to determine coordinates of the at least one remote point.

A distance detecting system for use in mobile machines comprises a gallium and nitrogen containing laser diode disposed within a light of a mobile machine. The gallium and nitrogen containing laser diode is configured to emit a first light with a first peak wavelength. A wavelength conversion member is configured to produce a white light. A first sensing light signal is based on the first peak wavelength. One or more optical elements are configured to direct at least partially the white light to illuminate one or more target objects or areas and to transmit respectively the first sensing light signal for sensing at least one remote point. A detector is configured to detect reflected signals of the first sensing light signal to determine coordinates of the at least one remote point.

A laser collimating module includes a heat dissipating base having a fixing element on a top thereof and a plurality of pins at a bottom thereof, a laser diode chip disposed on the fixing element, a cap covering on the heat dissipating base with a placing space therein and an opening on a top thereof, and a cylindrical lens disposed in the placing space. The opening of the cap is connecting to the placing space and aligning with the laser diode chip correspondingly. The cylindrical lens has a first surface facing toward the laser diode chip with a first minimized distance arranged therebetween and a second surface facing toward the opening with a second minimized distance arranged therebetween. The laser diode chip is stimulated and emits an elliptical laser beam, and a light emitting angle is formed. As the elliptical laser beam passes through the cylindrical lens, the light emitting angle is narrowed and the laser beam is collimated to be a linear beam.