An optical semiconductor device outputting a predetermined wavelength of laser light includes a quantum well active layer positioned between a p-type cladding layer and an n-type cladding layer in thickness direction. The optical semiconductor device includes a separate confinement heterostructure layer positioned between the quantum well active layer and the n-type cladding layer. The optical semiconductor device further includes an electric-field-distribution-control layer positioned between the separate confinement heterostructure layer and the n-type cladding layer and configured by at least two semiconductor layers having band gap energy greater than band gap energy of a barrier layer constituting the quantum well active layer. The optical semiconductor device is applied to a ridge-stripe type laser.

An optical semiconductor device outputting a predetermined wavelength of laser light includes a quantum well active layer positioned between a p-type cladding layer and an n-type cladding layer in thickness direction. The optical semiconductor device includes a separate confinement heterostructure layer positioned between the quantum well active layer and the n-type cladding layer. The optical semiconductor device further includes an electric-field-distribution-control layer positioned between the separate confinement heterostructure layer and the n-type cladding layer and configured by at least two semiconductor layers having band gap energy greater than band gap energy of a barrier layer constituting the quantum well active layer. The optical semiconductor device is applied to a ridge-stripe type laser.

Embodiments of the present application provide a laser light source and a laser projection device. The laser light source includes a laser assembly and a light combination mirror assembly. The laser assembly includes at least a laser, a light emitting surface of the laser has a plurality of light emitting regions, and beams emitted from different ones of the plurality of light emitting regions are in different colors. The light combination mirror assembly includes a plurality of mirrors that are sequentially arranged along an optical transmission path of the laser, with each of the mirrors corresponding to one of the light emitting regions. The light combination mirror assembly is used to converge the beams in different colors emitted from the laser to form a white beam.

An electronic device and associated methods are disclosed. In one example, the electronic device includes a laser package. In selected examples, the laser package can include a substrate having a substrate front surface and defining a cavity that extends into the substrate front surface. The laser package can further include a photonic integrated circuit (PIC) attached to the substrate within the cavity at a first surface of the PIC, and laser circuitry communicably coupled to a second surface of the PIC opposite the first surface.

A thermo-optical ground plane includes a plate configured to mount a diode laser device defining a first surface area, an evaporation chamber in thermal communication with the plate, and a channel defined in thermal communication with the evaporation chamber. The channel is configured to receive and circulate a coolant fluid at a predetermined flowrate. The evaporation chamber is configured to receive a working fluid. The inner walls of the evaporation chamber define a second surface area that is greater than the first surface area of the diode laser device. The plate comprises beam shaping and folding optics for collimating and focusing the light from the diode laser device on an optical fiber. Light from a plurality of thermo-optical ground planes is combined on a single optical fiber. The structure enables cooling with exceptionally low coolant flowrate while also maintaining small specific volume and small specific weight.

An illumination device includes a laser source, a conventional diffuser element, and an extender optic with a curved interior surface and a curved outer surface. Light emitted by the laser source with a given field of illumination (FOI) is received by the conventional diffuser element and outputted towards the interior surface of the extender optic with an increased FOI; the outer surface of the extender optic then outputs the light received by the interior surface as light with an even greater FOI, typically in the range of 120° to 185°.

Disclosed herein are various embodiments for high performance wireless data transfers. In an example embodiment, laser chips are used to support the data transfers using laser signals that encode the data to be transferred. The laser chip can be configured to (1) receive a digital signal and (2) responsive to the received digital signal, generate and emit a variable laser signal, wherein the laser chip comprises a laser-emitting epitaxial structure, wherein the laser-emitting epitaxial structure comprises a plurality of laser-emitting regions within a single mesa structure that generate the variable laser signal. Also disclosed are a number of embodiments for a photonics receiver that can receive and digitize the laser signals produced by the laser chips. Such technology can be used to wireless transfer large data sets such as lidar point clouds at high data rates.

A semiconductor laser module that includes a package accommodating therein a plurality of optical components, includes: a semiconductor laser device that emits laser light toward one end side in the package; an optical fiber having an incident end of the laser light on another end side in the package, the another end being in an opposite direction of an emission direction in which the semiconductor laser device emits the laser light; and a turn-back unit that turns back the laser light toward the another end side in the package, the another end being in the opposite direction of the emission direction in which the semiconductor laser device emits the laser light, and outputs the laser light to the incident end of the optical fiber.

A semiconductor laser module that includes a package accommodating therein a plurality of optical components, includes: a semiconductor laser device that emits laser light toward one end side in the package; an optical fiber having an incident end of the laser light on another end side in the package, the another end being in an opposite direction of an emission direction in which the semiconductor laser device emits the laser light; and a turn-back unit that turns back the laser light toward the another end side in the package, the another end being in the opposite direction of the emission direction in which the semiconductor laser device emits the laser light, and outputs the laser light to the incident end of the optical fiber.

An optical-path-displacement-compensation-based emission optical power stabilization assembly, comprising: a laser, a lens, and an optical fiber coupling port disposed on a first substrate and a second substrate according to a preset arrangement scheme, wherein an expansion coefficient of the second substrate is larger than that of the first substrate, and the preset arrangement scheme enables initial distances between the laser and the lens, between the lens and the optical fiber coupling port, and/or between the laser and the optical fiber coupling port to differ from respective optical coupling distances from an optical coupling point by a preset value, thereby ensuring that a coupling loss on an optical path changes along with the temperature, forming a complementary effect with respect to an optical power-temperature curve of the laser, which reduces a temperature-caused fluctuation of the emission optical power of an optical assembly.