A light source device includes: a laser diode including an emission end surface for emitting laser light and a rear end surface opposite to the emission end surface; a reflecting member that reflects a portion of the laser light emitted from the emission end surface of the laser diode; a photodetector configured to detect light that is reflected at the reflecting member; and a light-shielding member disposed between the rear end surface of the laser diode and the photodetector, the light-shielding member configured to shield at least a portion of light emitted from the rear end surface of the laser diode.

A light source device includes: a laser diode including an emission end surface for emitting laser light and a rear end surface opposite to the emission end surface; a reflecting member that reflects a portion of the laser light emitted from the emission end surface of the laser diode; a photodetector configured to detect light that is reflected at the reflecting member; and a light-shielding member disposed between the rear end surface of the laser diode and the photodetector, the light-shielding member configured to shield at least a portion of light emitted from the rear end surface of the laser diode.

A laser device is provided. The laser device includes a case, a plurality of light-emitting assemblies, an upper cover assembly and a stress-offsetting structure. The case includes a bottom plate and a frame body. The frame body is disposed on the bottom plate, and is enclosed on the bottom plate to form an accommodating space with an opening. The plurality of light-emitting assemblies is located in the accommodating space and are disposed on the bottom plate. The upper cover assembly is fixed to the case and covers the opening. The stress-offsetting structure is disposed in the frame body and/or in the upper cover assembly, and is configured to be contracted in a squeezing direction when the stress-offsetting structure is squeezed.

An optical member includes: a conversion member including a fluorescent material; a light reflecting ceramic holding the conversion member, the conversion member and the light reflecting ceramic having a continuous surface; a light-transmissive film on the continuous surface; and a wiring on the light-transmissive film.

An optical member includes: a conversion member including a fluorescent material; a light reflecting ceramic holding the conversion member, the conversion member and the light reflecting ceramic having a continuous surface; a light-transmissive film on the continuous surface; and a wiring on the light-transmissive film.

A light-emitting device includes: a base including: a mount surface, and a lateral wall located around the mount surface, the lateral wall including: a pair of first protrusions located opposite to each other in a first direction which is parallel to a side of the mount surface, and a pair of second protrusions located opposite to each other in a second direction which is perpendicular to the first direction, the second protrusions being provided lower than the first protrusions; one or more light-emitting elements mounted on the mount surface of the base; a first light-transmissive member sealing a space in which the one or more light-emitting elements are mounted; and one or more wires connecting to the one or more light-emitting elements, the one or more wires being bonded on conduction regions provided on at least one of upper surfaces of the second protrusions.

A light-emitting device includes: a base including: a mount surface, and a lateral wall located around the mount surface, the lateral wall including: a pair of first protrusions located opposite to each other in a first direction which is parallel to a side of the mount surface, and a pair of second protrusions located opposite to each other in a second direction which is perpendicular to the first direction, the second protrusions being provided lower than the first protrusions; one or more light-emitting elements mounted on the mount surface of the base; a first light-transmissive member sealing a space in which the one or more light-emitting elements are mounted; and one or more wires connecting to the one or more light-emitting elements, the one or more wires being bonded on conduction regions provided on at least one of upper surfaces of the second protrusions.

A vertical cavity surface emitting laser (VCSEL) may include a substrate layer, epitaxial layers on the substrate layer, and angled reflectors configured to receive an optical beam emitted toward a bottom surface of the VCSEL and redirect the optical beam through an exit window in a top surface of the VCSEL. In some implementations, the angled reflectors may be formed in the substrate layer. Additionally, or alternatively, the VCSEL may include molded optics, where the molded optics include the angled reflectors. In some implementations, the exit window may include an integrated lens.

A vertical cavity surface emitting laser (VCSEL) may include a substrate layer, epitaxial layers on the substrate layer, and angled reflectors configured to receive an optical beam emitted toward a bottom surface of the VCSEL and redirect the optical beam through an exit window in a top surface of the VCSEL. In some implementations, the angled reflectors may be formed in the substrate layer. Additionally, or alternatively, the VCSEL may include molded optics, where the molded optics include the angled reflectors. In some implementations, the exit window may include an integrated lens.

A light emitting device includes: a base comprising a first wiring, a second wiring, and a third wiring; a first semiconductor laser element electrically connected to the first wiring and the second wiring, at an upper surface side of the base; a second semiconductor laser element electrically connected to the second wiring and the third wiring, at the upper surface side of the base; and a base cap fixed to the base such that the first semiconductor laser element and the second semiconductor laser element are enclosed in a space defined by the base and the base cap. The first semiconductor laser element and the second semiconductor laser element are connected in series. A portion of each of the first, second, and third wirings is exposed at the upper surface of the base at locations outside of the space defined by the base and the base cap.