A laser package is described, the laser package comprising a plurality of laser diodes separately attached to at least one sub-mount having respective connecting pads, wherein, during operation, each of the laser diodes emits light having a fast axis and a slow axis defining a fast axis plane and a slow axis plane, wherein the fast axis planes of all laser diodes are parallel to each other and the distance between the fast axis planes of at least two laser diodes is smaller than the lateral distance between these laser diodes. Furthermore, a system with at least two laser packages is described.

A laser package is described, the laser package comprising a plurality of laser diodes separately attached to at least one sub-mount having respective connecting pads, wherein, during operation, each of the laser diodes emits light having a fast axis and a slow axis defining a fast axis plane and a slow axis plane, wherein the fast axis planes of all laser diodes are parallel to each other and the distance between the fast axis planes of at least two laser diodes is smaller than the lateral distance between these laser diodes. Furthermore, a system with at least two laser packages is described.

A multilaser arrangement includes: a housing including a base plate, a housing cap fastened on the base plate, and a transparent element, the base plate including a bottom face, the housing cap including an opening with the transparent element assigned to the opening for the passage of electromagnetic radiation; lasers, each being arranged inside the housing at a distance from the bottom face of the base plate, the housing cap including an upper wall and a side wall, which includes a lower edge and a surface, is formed integrally with the upper wall, and ends with the lower edge fastened on the base plate, the side wall having a first thickness and a second thickness, the first thickness being measured in a direction perpendicular to the surface, the second thickness being measured at the lower edge and being less than or equal to the first thickness.

The present disclosure provides a method for manufacturing a diffusion cover that diffuses and transmits light from a semiconductor light-emitting element. The method includes the steps of preparing a base member having an obverse surface and a reverse surface that face away from each other in a thickness direction; forming a lens material on the obverse surface, the lens material containing a photosensitive transparent resin; and removing a portion of the lens material by performing grayscale exposure and development, and forming a lens having a plurality of lens members. Such a configuration can provide a diffusion cover suitable for reducing the manufacturing cost.

The present disclosure provides a method for manufacturing a diffusion cover that diffuses and transmits light from a semiconductor light-emitting element. The method includes the steps of preparing a base member having an obverse surface and a reverse surface that face away from each other in a thickness direction; forming a lens material on the obverse surface, the lens material containing a photosensitive transparent resin; and removing a portion of the lens material by performing grayscale exposure and development, and forming a lens having a plurality of lens members. Such a configuration can provide a diffusion cover suitable for reducing the manufacturing cost.

A method for manufacturing a hermetic side looking laser surface-mount device (SMD) package includes forming a glass cap. An array of pockets is formed in the first glass wafer. The array of pockets is sealed by bonding a second glass wafer to the first glass wafer. The glass cap is released by singulating the sealed array of pockets.

A method for manufacturing a hermetic side looking laser surface-mount device (SMD) package includes forming a glass cap. An array of pockets is formed in the first glass wafer. The array of pockets is sealed by bonding a second glass wafer to the first glass wafer. The glass cap is released by singulating the sealed array of pockets.

A laser light source includes: a laser diode chip including an emission layer, a substrate supporting the emission layer, and an emission end surface; a submount that includes a principal surface on which the laser diode chip is fixed and a pair of lens supports located at opposite sides with respect to the emission end surface of the laser diode chip; a lens bonded to the end surfaces of the pair of lens supports; and a semiconductor laser package housing the aforementioned elements. The laser diode chip is fixed to the submount with the emission layer being closer to the submount than is the substrate. The emission end surface of the laser diode chip is located outward with respect to an edge of the principal surface. The end surfaces of the pair of lens supports are located outward with respect to the first end surface of the laser diode chip.

Provided is a semiconductor laser device enabling efficient emission of a laser beam without damaging a light emitting surface of a light emitting element. Semiconductor laser device includes light emitting element, optical element, first heat radiation part, and second heat radiation part. Laser beam emitted from light emitting element enters optical element. First heat radiation part is connected to light emitting element. Second heat radiation part is connected to light emitting element. First heat radiation part includes first recess. Second heat radiation part includes second recess. One end of optical element is fitted into first recess, and the other end of optical element is fitted into second recess.

Provided is a semiconductor laser device enabling efficient emission of a laser beam without damaging a light emitting surface of a light emitting element. Semiconductor laser device includes light emitting element, optical element, first heat radiation part, and second heat radiation part. Laser beam emitted from light emitting element enters optical element. First heat radiation part is connected to light emitting element. Second heat radiation part is connected to light emitting element. First heat radiation part includes first recess. Second heat radiation part includes second recess. One end of optical element is fitted into first recess, and the other end of optical element is fitted into second recess.