An optoelectronic component is provided that includes a radiation-emitting semiconductor chip, which emits electromagnetic radiation from a radiation exit surface during operation, a carrier comprising at least two first contact points, and a cover including at least two second contact points, wherein the at least two first contact points and the at least two second contact points are electrically conductively and/or thermally conductively connected to one another by a first plurality of nanowires and a second plurality of nanowires, and the nanowires provide a mechanically stable connection between the carrier and the cover. In addition, a method for producing an optoelectronic component is provided.

A method for manufacturing a light emitting device includes: disposing a light emitting element on a base member; providing a bonding agent to the base member or a lid member; and bonding the base member on which the light emitting element is disposed and the lid member with the bonding agent by sandwiching the bonding agent in a molten state between the base member and the lid member, and pressing the lid member against the base member, increasing a distance between the base member and the lid member in a state in which the lid member is pressed against the base member, while maintaining a state in which the bonding agent contacts the base member and the lid member, and solidifying the bonding agent in a state in which the distance between the base member and the lid member is increased to bond the base member and the lid member.

A light-emitting device includes first and second light-emitting elements, upper submounts, and a lower submount. The upper submounts include a first submount having a first upper surface and a first lateral surface located on a same side as an emission end surface of the first light-emitting element, and a second submount having a second upper surface and a second lateral surface located on a same side as an emission end surface of the second light-emitting element. In a top plan view, the first lateral surface is located forward relative to the second lateral surface, and the emission end surface of the first light-emitting element is located forward relative to the emission end surface of the second light-emitting element. At least a portion of the first lateral surface is protruded forward relative to an edge along which an upper surface and a lateral surface of the lower submount meet.

A light source device includes: a plurality of laser diodes that includes a first laser diode for emitting laser light of red color, a second laser diode for emitting laser light of green color, and a third laser diode for emitting laser light of blue color; a substrate directly or indirectly supporting the plurality of laser diodes; and a cap secured to the substrate and covering the plurality of laser diodes. The cap includes: a first glass portion configured to transmit the laser light that is emitted from the plurality of laser diodes, and a second glass portion. At least one of the first glass portion and the second glass portion comprises an alkaline glass region. The first glass portion and the second glass portion are bonded together via an electrically conductive layer that is in contact with the alkaline glass region. The first glass portion is bonded to the substrate.

A light source device includes: a plurality of laser diodes that includes a first laser diode for emitting laser light of red color, a second laser diode for emitting laser light of green color, and a third laser diode for emitting laser light of blue color; a substrate directly or indirectly supporting the plurality of laser diodes; and a cap secured to the substrate and covering the plurality of laser diodes. The cap includes: a first glass portion configured to transmit the laser light that is emitted from the plurality of laser diodes, and a second glass portion. At least one of the first glass portion and the second glass portion comprises an alkaline glass region. The first glass portion and the second glass portion are bonded together via an electrically conductive layer that is in contact with the alkaline glass region. The first glass portion is bonded to the substrate.

A light emission module includes a first light emission unit that includes a first light emission device and emits first light. The first light emission device includes a plurality of first light emission portions, each including a light emission surface, where light from a plurality of first light emission elements is emitted, a heat dissipation surface provided opposite to the light emission surface, and a connection portion being positioned between the light emission surface and the heat dissipation surface and including a wiring mounting surface where the light emission elements are electrically connected. The light emission module further includes a first optical member that reflects the first light, a housing including a base member where the first light emission unit and the first optical member are disposed and a lid member surrounding the light emission device surrounding the first light emission unit and the first optical member that are disposed on the base member, and a heat sink being connected to the heat dissipation surface and including a mounting surface where the first light emission device is mounted. The wiring mounting surface extends upward upper than a first upper surface of the housing, and a portion of the wiring mounting surface is exposed to the outside of the housing.

A semiconductor laser device includes: a package includes a recess and an upper surface that has an outer peripheral surface and a bonding surface positioned between the recess and the outer peripheral surface, the bonding surface having inner corners on the recess side and outer corners on the outer peripheral surface side; at least one semiconductor laser element disposed in the recess of the package; and a light-transmissive member bonded to the bonding surface of the package. The radius of curvature of inner corners is greater than the radius of curvature of outer corners.

A light-emitting device includes: a semiconductor laser element; a package; an optical member fixed to the package; and a first adhesive and a second adhesive fixing the optical member to the package, the second adhesive having a better resistance to light than the first adhesive. The package has an emission surface through which light from the semiconductor laser element exits the package. In the optical member, one or more first bonding regions to which the first adhesive is bonded and one or more second bonding regions to which the second adhesive is bonded are located at positions that are closer to an incidence surface of the optical member than to an emission surface of the optical member. In the optical member, the one or more first bonding regions and the one or more second bonding regions have a light transmittance of 80% or more.

A light-emitting device includes: a semiconductor laser element; a package; an optical member fixed to the package; and a first adhesive and a second adhesive fixing the optical member to the package, the second adhesive having a better resistance to light than the first adhesive. The package has an emission surface through which light from the semiconductor laser element exits the package. In the optical member, one or more first bonding regions to which the first adhesive is bonded and one or more second bonding regions to which the second adhesive is bonded are located at positions that are closer to an incidence surface of the optical member than to an emission surface of the optical member. In the optical member, the one or more first bonding regions and the one or more second bonding regions have a light transmittance of 80% or more.

A window material for protecting near infrared light emitting lasers and or detectors is coated with a conductive coating that reduces the reflection at the wavelengths and angles of incidence of interest. The conductive coating allows the window to be heated by applying a bias across connected electrodes to remove or prevent the condensation of liquid water and the buildup of ice. The conductive material in the coating has some optical absorption in the hear infrared region of about 800 to 1600 nm, which in combination with multiple intervening dielectric layers also allows the transmission of 90% of the light while obtaining a resistance of less than about 30 Ohms-square. The coating reduces reflection loses from the window, without decreasing transmission by more that about 10%.