A semiconductor light emitter includes a substrate, a semiconductor multilayer structure including a light emission unit that emits light in an oblique direction with respect to the substrate, a base on which the substrate is disposed, a holding member that holds the substrate at an angle set in advance with respect to the base, a temperature control unit disposed parallel to the substrate to adjust a temperature of the substrate, and a shaping optical system held against the substrate to shape a luminous flux emitted from the semiconductor multilayer structure.

A semiconductor light emitter includes a substrate, a semiconductor multilayer structure including a light emission unit that emits light in an oblique direction with respect to the substrate, a base on which the substrate is disposed, a holding member that holds the substrate at an angle set in advance with respect to the base, a temperature control unit disposed parallel to the substrate to adjust a temperature of the substrate, and a shaping optical system held against the substrate to shape a luminous flux emitted from the semiconductor multilayer structure.

A semiconductor device includes a substrate, an epitaxial stack disposed on the substrate, a first connection layer between the epitaxial stack and the substrate and a first electrode disposed on the first connection layer. The substrate has a first side surface and a second side surface. The epitaxial stack has a semiconductor structure with a first lateral surface adjacent to the first side surface and a second lateral surface opposing the first lateral surface and adjacent to the second side surface. The first connection layer has a first protruding portion extending beyond the first lateral surface and a second protruding portion extending beyond the second lateral surface. The first electrode is in contact with the first protruding portion and the second protruding portion.

A light-emitting device includes a base structure, a light-emitting element, an optical member, and first and second adhesive parts. The first adhesive parts are disposed in first and second regions of a second surface of the base structure. The second adhesive parts are located at both opposite sides of the first adhesive part without being in contact with the first adhesive part. In the top view, a virtual first line segment, which connects two points respectively on the first adhesive parts in the first and second regions, extends across a first surface of the base structure. A virtual line segment, which connects two points respectively on the second adhesive parts at the both opposite sides of the first adhesive part, does not extend across the first surface. A width of the first adhesive part along the line segment is greater than a width of the second adhesive part.

A light-emitting device includes a base structure, a light-emitting element, an optical member, and first and second adhesive parts. The first adhesive parts are disposed in first and second regions of a second surface of the base structure. The second adhesive parts are located at both opposite sides of the first adhesive part without being in contact with the first adhesive part. In the top view, a virtual first line segment, which connects two points respectively on the first adhesive parts in the first and second regions, extends across a first surface of the base structure. A virtual line segment, which connects two points respectively on the second adhesive parts at the both opposite sides of the first adhesive part, does not extend across the first surface. A width of the first adhesive part along the line segment is greater than a width of the second adhesive part.

An optical assembly comprising a busbar system comprising an electrically conductive first busbar conductively coupled to one or more electrically conductive mechanical fasteners and one or more vertical-cavity surface-emitting laser (VCSEL) array modules each comprising one or more electrically conductive contacts. Each VCSEL array module is releasably fastened to the busbar system by the one or more of the mechanical fasteners. When in a fastened position, the one or more mechanical fasteners are conductively coupled to the one or more electrically conductive contacts to provide an electrical connection between the first busbar and the one or more VCSEL array modules.

An optical assembly comprising a busbar system comprising an electrically conductive first busbar conductively coupled to one or more electrically conductive mechanical fasteners and one or more vertical-cavity surface-emitting laser (VCSEL) array modules each comprising one or more electrically conductive contacts. Each VCSEL array module is releasably fastened to the busbar system by the one or more of the mechanical fasteners. When in a fastened position, the one or more mechanical fasteners are conductively coupled to the one or more electrically conductive contacts to provide an electrical connection between the first busbar and the one or more VCSEL array modules.

Provided is a thermoelectric cooler built-in stem, including a first stem member on a top face of which a temperature controlled target device such as an optical module or the like is mounted, a second stem member which opposes to the first stem member each other, and a thermoelectric cooler being sandwiched between the first stem member and the second stem member, for controlling the temperature controlled target device, whereby a space between the first stem member and the second stem member is filled by an insulating resin whose thermal conductivity is low.

Provided is a thermoelectric cooler built-in stem, including a first stem member on a top face of which a temperature controlled target device such as an optical module or the like is mounted, a second stem member which opposes to the first stem member each other, and a thermoelectric cooler being sandwiched between the first stem member and the second stem member, for controlling the temperature controlled target device, whereby a space between the first stem member and the second stem member is filled by an insulating resin whose thermal conductivity is low.

Apparatus include a plurality of laser diodes configured to emit respective laser diode beams having perpendicular fast and slow beam divergence axes mutually perpendicular to respective beam axes, and beam shaping optics configured to receive the laser diode beams and to circularize an ensemble image space and NA space of the laser diode beams at an ensemble coupling plane. In selected examples, beam shaping optics include variable fast axis telescopes configured to provide variable fast axis magnification and beam displacement.