The disclosure describes packages having portions of a lead frame as electrically conductive leads. The conductive leads can facilitate bringing signals acquired at the top of a package down to electrically conductive pads at the bottom of the package (or vice-versa). The techniques can be used in a range of different applications, for example, the monitoring of signals to enhance the safety of a light emitting package, as well as other applications in which a signal acquired at a top side of an package needs to be brought to conductive pads at a bottom side of the package, or to bring signals from conductive pads at the bottom side of the package to the top side of the package.

The disclosure describes packages having portions of a lead frame as electrically conductive leads. The conductive leads can facilitate bringing signals acquired at the top of a package down to electrically conductive pads at the bottom of the package (or vice-versa). The techniques can be used in a range of different applications, for example, the monitoring of signals to enhance the safety of a light emitting package, as well as other applications in which a signal acquired at a top side of an package needs to be brought to conductive pads at a bottom side of the package, or to bring signals from conductive pads at the bottom side of the package to the top side of the package.

The invention relates to a laser chip located between a first and a second electrically and thermally conductive component, wherein: a first lateral surface of the laser chip is connected in a planar manner to a first lateral surface of the first component; the second lateral surface of the laser chip is connected in a planar manner to a first lateral surface of the second component; the laser chip has a radiation side which is located between the components; the radiation side is arranged set back inwardly at a predefined distance from the first end faces of the components; and a radiation space, which extends from the radiation side of the laser chip to the first end faces of the components is formed between the first lateral surfaces of the two components and adjacent to the radiation side of the laser chip.

The invention relates to a laser chip located between a first and a second electrically and thermally conductive component, wherein: a first lateral surface of the laser chip is connected in a planar manner to a first lateral surface of the first component; the second lateral surface of the laser chip is connected in a planar manner to a first lateral surface of the second component; the laser chip has a radiation side which is located between the components; the radiation side is arranged set back inwardly at a predefined distance from the first end faces of the components; and a radiation space, which extends from the radiation side of the laser chip to the first end faces of the components is formed between the first lateral surfaces of the two components and adjacent to the radiation side of the laser chip.

A semiconductor laser device includes a semiconductor laser element, a sub mount member, a mount section having an upper surface on which the semiconductor laser element is mounted with the sub mount member interposed therebetween, a lead pin disposed at left and right sides of the mount section, a retainer that retains the mount section and the lead pin together and that is composed of an insulative material, and a protrusion protruding toward the left and right sides of the mount section. A lower surface of the mount section is parallel to an upper surface of the mount section and protrudes from a lower surface of the retainer.

An optoelectronic module includes a spacer with an optical component mounting surface, a fluid permeable channel, and a module mounting surface. The fluid permeable channel and module mounting surface allow the channels to be sealed to foreign matter during certain manufacturing steps and to remain free from blockages, such as solidified flux, during certain manufacturing steps. Further, the channels can permit heat to escape from the optoelectronic module during operation.

A laser diode packaging structure includes a lead frame and a laser chip. The lead frame includes a frame body that has a front side and a back side opposite to the front side, a front circuit layer and a back circuit layer that are respectively disposed on the front and back sides, and an inner circuit layer that is disposed inside the frame body. The inner circuit layer includes first and second circuit connecting units, each of which has at least one first conductive via to electrically connect to the front circuit layer, and at least one second conductive via to electrically connect to the back circuit layer. The laser chip is mounted on and electrically connected to the front circuit layer, and is configured to emit a laser beam.

A laser diode packaging structure includes a lead frame and a laser chip. The lead frame includes a frame body that has a front side and a back side opposite to the front side, a front circuit layer and a back circuit layer that are respectively disposed on the front and back sides, and an inner circuit layer that is disposed inside the frame body. The inner circuit layer includes first and second circuit connecting units, each of which has at least one first conductive via to electrically connect to the front circuit layer, and at least one second conductive via to electrically connect to the back circuit layer. The laser chip is mounted on and electrically connected to the front circuit layer, and is configured to emit a laser beam.

A laser diode surface mounting structure, having at least one edge-emitting laser diode chip, including two electrodes; a heat-dissipating plate for carrying one of the two electrodes of the at least one edge-emitting laser diode chip, which has a top conductive layer, a bottom conductive layer, and at least one conductive through hole extending from the top conductive layer to the bottom conductive layer for electrically conducting; two or more metal plates spaced apart from each other and located on a plane, wherein a first metal plate is located under the heat-dissipating plate and in contact with the bottom conductive layer of the heat-dissipating plate, and a second metal plate is located adjacent to and separated from the first metal plate; and an insulating frame having an opening and being disposed above the two or more metal plates for holding the two or more metal plates.

A laser projection module, that may include a laser projection module cover comprising a top portion, a bottom portion and a one or more of side portions to define a cavity within the cover, wherein the top portion is configured to couple an optical lens. A lead frame may be at least partially integrated into the bottom cover portion of the laser projection module, where the lead frame includes an outer lead frame portion and an inner lead frame portion relative to the cover, wherein the inner lead frame portion is configured to couple a laser diode assembly in one area of the inner lead frame portion within the cavity.