A device may include a lead-frame including a first electrode and a second electrode, a carrier, a set of optical devices mechanically and electrically connected to the first electrode, and a set of electrical connections that electrically connects the second electrode to the set of optical devices. The lead-frame and the carrier may be mechanically connected to each other via a set of interlocking structures associated with the lead-frame and the carrier. The lead-frame and the set of optical devices may have matching coefficients of thermal expansion. The first electrode and the second electrode may be electrically isolated from each other.

A light-emitting element includes: a substrate; a semiconductor chip, formed over the substrate, that includes a plurality of semiconductor layers; a first protective film formed on a first end face of the semiconductor chip that includes a luminous point from which light is emitted; and a first light-absorbing film formed on a part of a surface of the first protective film. The first light-absorbing film covers a part of the surface of the first protective film excluding a portion of the surface through which light emitted from the luminous point passes.

A laser component including a molded body, and a laser chip embedded into the molded body and configured to emit a laser beam in an emission direction, wherein a surface of the molded body includes a deflection section arranged and inclined relative to the emission direction such that a laser beam emitted by the laser chip impinges on the deflection section and is subjected to total internal reflection at the deflection section.

A thermally tunable optoelectronic module includes a light emitting assembly operable to emit light of a particular wavelength or range of wavelengths. The light emitting assembly is disposed to a temperature-dependent wavelength shift. The thermally tunable optoelectronic module further includes an optical assembly aligned to the light emitting assembly, and separated from the light emitting assembly by an alignment distance. The thermally tunable optoelectronic module further includes a thermally tunable spacer disposed between the optical assembly and the light-emitting assembly, the thermally tunable spacer is operable to counteract the temperature-dependent wavelength shift.

A multi-wavelength integrated device (5) including plural semiconductor lasers (6) and plural modulators (7) modulating output beams of the plural semiconductor lasers (6) respectively is mounted on the stem (1). Plural leads (10) penetrates through the stem (1) and are connected to the plural semiconductor lasers (6) and the plural modulators (7) respectively. Each lead (10) is a coaxial line in which plural layers are concentrically overlapped with one another. The coaxial line includes a high frequency signal line (12) transmitting a high frequency signal to the modulator (7), a GNU line (14), and a feed line (16) feeding a DC current to the semiconductor laser (6). The high frequency signal line (12) is arranged at a center of the coaxial line. The GND line (14) and the feed line (16) are arranged outside the high frequency signal line (12).

A laser diode module is described herein. In accordance with a first exemplary embodiment, the laser diode module includes a first semiconductor die including at least one electronic switch, and a second semiconductor die including at least one laser diode. The second semi-conductor die is bonded on the first semiconductor die using a chip-on-chip connecting technology to provide electrical connection between the electronic switch and the laser diode.

A semiconductor laser device includes a semiconductor laser element, a sub mount member, a mount section having an upper surface on which the semiconductor laser element is mounted with the sub mount member interposed therebetween, a lead pin disposed at left and right sides of the mount section, a retainer that retains the mount section and the lead pin together and that is composed of an insulative material, and a protrusion protruding toward the left and right sides of the mount section. A lower surface of the mount section is parallel to an upper surface of the mount section and protrudes from a lower surface of the retainer.

A semiconductor laser component including a semiconductor chip arranged to emit laser radiation, a cladding that is electrically insulating and covers the semiconductor chip in places, and a bonding layer that electrically conductively connects the semiconductor chip to a first connection point, wherein the semiconductor chip includes a cover surface, a bottom surface, a first front surface, a second front surface, a first side surface and a second side surface, the first front surface is arranged to decouple the laser beam, the cladding covers the semiconductor chip at least in places on the cover surface, the second front surface, the first side surface and the second side surface, and the bonding layer on the cladding extends from the cover surface to the first connection point.

A light emitting module includes a light emitting device, a heat dissipating plate, and a holder. The light emitting device has a light extraction window and a plurality of electrodes. The light emitting device is secured to the heat dissipating plate. The heat dissipating plate is secured to the holder. The holder includes a plurality of terminals respectively connected to the electrodes of the light emitting device. The heat dissipating plate includes an exposed portion exposed from the holder when viewed from a side of the light emitting module on which the light extraction window of the light emitting device is provided.

Light emission efficiency is increased in an eye-safe light source by regulating light distribution properties. An eye-safe light source includes a package, a semiconductor laser that emits laser light from a left light emission end surface and a right light emission end surface, and a wire that is joined to the semiconductor laser. The semiconductor laser is joined to the package such that the laser light is emitted parallel to an upper surface of a lead frame of the package. The package includes reflection surfaces that face the left light emission end surface and the right light emission end surface and reflect the laser light. In top view, a direction in which the wire extends is perpendicular to a direction of emission of the laser light.