A three-dimensional optoelectronic device package is disclosed. The three-dimensional optoelectronic device package comprises a first board having at least one surface on which one or more optoelectronic devices is disposed, and a second board having at least one surface on which a plurality of optoelectronic devices is disposed. A side of the second board is attached to the surface of the first board on which one or more optoelectronic devices is disposed to form an angle between the surface of the first board on which one or more optoelectronic devices is disposed and the surface of the second board on which one or more optoelectronic devices is disposed. A method for manufacturing a three-dimensional optoelectronic device package is also disclosed.

An optoelectronic component is provided that includes a radiation-emitting semiconductor chip, which emits electromagnetic radiation from a radiation exit surface during operation, a carrier comprising at least two first contact points, and a cover including at least two second contact points, wherein the at least two first contact points and the at least two second contact points are electrically conductively and/or thermally conductively connected to one another by a first plurality of nanowires and a second plurality of nanowires, and the nanowires provide a mechanically stable connection between the carrier and the cover. In addition, a method for producing an optoelectronic component is provided.

An optoelectronic component is provided that includes a radiation-emitting semiconductor chip, which emits electromagnetic radiation from a radiation exit surface during operation, a carrier comprising at least two first contact points, and a cover including at least two second contact points, wherein the at least two first contact points and the at least two second contact points are electrically conductively and/or thermally conductively connected to one another by a first plurality of nanowires and a second plurality of nanowires, and the nanowires provide a mechanically stable connection between the carrier and the cover. In addition, a method for producing an optoelectronic component is provided.

The present disclosure relates to a light source system suitable for use in a time of flight camera. The light source system includes a light source, such as a laser, and a driver arranged to supply a drive current to the light source to turn the light source on to emit light. The driver includes two transistors coupled to the light source in series, such that when both transistors are turned on, a drive circuit is completed, current flows and the light source turns on. A very short pulse of light emission may be achieved efficiently by switching one of the transistors to the on-state to complete the drive circuit and a short time later turning off the other transistor in order to break the drive circuit. In this way, a pulse of light in the order of less than 1 nanosecond or less than 500 picoseconds may be achieved.

The present disclosure relates to a light source system suitable for use in a time of flight camera. The light source system includes a light source, such as a laser, and a driver arranged to supply a drive current to the light source to turn the light source on to emit light. The driver includes two transistors coupled to the light source in series, such that when both transistors are turned on, a drive circuit is completed, current flows and the light source turns on. A very short pulse of light emission may be achieved efficiently by switching one of the transistors to the on-state to complete the drive circuit and a short time later turning off the other transistor in order to break the drive circuit. In this way, a pulse of light in the order of less than 1 nanosecond or less than 500 picoseconds may be achieved.

There are provided a light emitting device capable of forming a light emitting element on a suitable substrate and a method of manufacturing the same.

A light emitting device according to the present disclosure includes: a first substrate; a plurality of light emitting elements that are provided on a first surface of the first substrate; and a second substrate that is provided on a second surface of the first substrate opposite to the first surface.

There are provided a light emitting device capable of forming a light emitting element on a suitable substrate and a method of manufacturing the same.

A light emitting device according to the present disclosure includes: a first substrate; a plurality of light emitting elements that are provided on a first surface of the first substrate; and a second substrate that is provided on a second surface of the first substrate opposite to the first surface.

The invention relates to a method for producing a semiconductor assembly, in particular connecting a semiconductor chip to a heat sink. A first metal layer consisting of Pb, Cd, In or Sn is made so thin that it is bonded by means of an opposing second metal layer consisting of another metal, for example gold, in a layer consisting of intermetallic phases. This can prevent migration of the soft metals. The brittle intermetallic layer is prevented from fracturing by a continuous pressing force.

A die bonding apparatus includes: a mounting base including a mounting area on which a first member is mounted; a heater arranged below the mounting base; a side wall configured to surround the mounting area; a collet configured to hold a second member by vacuum-chucking at an end portion; a lid including a hole, the lid being mounted on the side wall; a moving structure configured to move the collet to transport the second member held by the collet through the hole for bonding the second member to the first member; and a gas-supplying tube arranged on the side wall and configured to supply a heating gas to a heating space formed by the side wall and the lid. The lid contains a material capable of: reflecting an infrared radiation caused by the heater and the heating gas; or absorbing and re-radiating the infrared radiation.

An optical crystal can be mounted to a mounting block configured to receive the crystal. A base portion on the mounting block utilizes two walls forming a corner and a single biasing spring clip to secure the crystal. The spring clip applies forces in two different directions substantially orthogonal to the two walls. The spring clip is based off a symmetrical geometry which applies nearly the same force application in both directions. The spring also features bend regions that contact the crystal in such a way as to reduce the presence of point loads or stress risers. The length of contact along the crystal is maximized, allowing for proper force distribution and a sufficient surface are contact for static holding capabilities.