First block (10) includes internal flow path (15). A cooling medium flows inside internal flow path (15). Curved part (56) is provided at a corner between bottom surface (54) and side wall surface (55) of internal flow path (15). Curved part (56) is continuously connected to bottom surface (54) and side wall surface (55) of internal flow path (15) and has a curved shape.

A thermoelectric device and method of use thereof are provided for cooling and powering a laser device. The thermoelectric device comprises a first side, a second side, and a plurality of thermoelectric elements disposed therebetween. The thermoelectric device engages a photodiode array of the laser device, such that when heat is generated by the photodiode array, the thermoelectric device passively cools the photodiode array by receiving the heat and converts the heat generated to electricity to power the laser device.

Provided is a semiconductor laser device enabling efficient emission of a laser beam without damaging a light emitting surface of a light emitting element. Semiconductor laser device includes light emitting element, optical element, first heat radiation part, and second heat radiation part. Laser beam emitted from light emitting element enters optical element. First heat radiation part is connected to light emitting element. Second heat radiation part is connected to light emitting element. First heat radiation part includes first recess. Second heat radiation part includes second recess. One end of optical element is fitted into first recess, and the other end of optical element is fitted into second recess.

In various embodiments, laser devices feature means, such as fasteners, for attaching a laser package to a cooling plate, which allow motion of the laser package in response to thermal cycles resulting from operation of a beam emitter therewithin. Embodiments of the invention additionally or instead include laser devices featuring segmented barrier layers for electrically isolating the laser package from the cooling plate.

Laser processing device (100) includes laser oscillator (10) that generates laser light beam (LB), optical fiber (30) that transmits laser light beam (LB), laser head (40) that emits laser light beam (LB) to workpiece (W), and chiller (50) that passes and circulates cooling water through laser oscillator (10) to cool laser oscillator (10). Laser oscillator (10) includes: a plurality of laser diodes; and a base having a cooling water channel therein and having the laser diodes mounted on a surface thereof. Laser processing device (100) is configured to change the incident angle of laser light beam (LB) entering optical fiber (30) by changing the water pressure of the cooling water flowing through the cooling water channel.

Described herein are photonic sources and related system architectures that can satisfy the optical power requirements of large photonic accelerators. Some embodiments relate to a computer comprising a photonic accelerator configured to perform matrix multiplication; a fiber array optically coupled to the photonic accelerator; and a photonic source optically coupled to the fiber array. The photonic source comprising a laser array comprising a plurality of monolithically co-integrated lasers, and a coupling lens array comprising a plurality of monolithically co-integrated lenses, the coupling lens array optically coupling the laser array to the fiber array. The laser array is configured to output between 0.1 W and 10 W of optical power.

The present disclosure relates to a laser diode system. The system may have at least one laser diode emitter having a substrate, at least one laser diode supported on the substrate, and a facet which a laser beam generated by the laser diode is emitted. A cooling subsystem is included which is disposed in contact with the substrate of the laser diode emitter. The cooling subsystem includes a plurality of cooling fins forming a plurality of elongated channels for circulating a cooling fluid therethrough to cool the laser diode emitter. The cooling fluid also flows over the facet of the laser diode emitter.

An ultra-compact, high power, fiber pump module apparatus has a heatsink with a stepped outer shape. The heatsink has at least one interior cooling channel. A plurality of single emitter diodes is positioned on one step of the stepped outer shape of the heatsink, respectively. At least two beam-shifting structures are positioned in a beam path of each of the plurality of single emitter diodes. The at least two beam-shifting structures fold each beam emitted from the plurality of single emitter diodes in at least three dimensions. At least one beam combining structure is positioned in the beam path, wherein the at least one beam combining structure combines the beams from each of the plurality of single emitter diodes into a single, combined beam. The single, combined beam is output from the ultra-compact, high power, fiber pump module apparatus.

A laser system comprising high voltage AC-to-DC power converter and one or more current sources coupled to the high voltage AC-to-DC power converter without a DC-to-DC converter between the one or more current sources and the AC-to-DC power source. Each of the one or more current sources includes a high voltage switch and one or more independent safety shutoffs. A laser module is operably coupled to the one or more current source and configured to emit electromagnetic radiation wherein the one or more safety shutoffs are configured to disable emission of electromagnetic radiation from the laser module when triggered.

The invention may be embodied in other forms than those specifically disclosed herein without departing from itMulti-kW-class blue (400-495 nm) fiber-delivered lasers and module configurations. In embodiments, the lasers propagate laser beams having beam parameter products of <5 mm*mrad, which are used in materials processing, welding and pumping a Raman laser. In an embodiment the laser system is an integration of fiber-coupled modules, which are in turn made up of submodules. An embodiment has sub-modules having a plurality of lensed blue semiconductor gain chips with low reflectivity front facets. These are locked in wavelength with a wavelength spread of <1 nm by using volume Bragg gratings in an external cavity configuration. An embodiment has modules having of a plurality of submodules, which are combined through wavelength multiplexing with a bandwidth of <10 nm, followed by polarization beam combining. The output of each module is fiber-coupled into a low NA fiber. In an embodiment a kW-level blue laser system is realized by fiber bundling and combining multiple modules into a single output fiber.