A light source apparatus for endoscope includes a light source, a collective lens, a light shielding member which shields at least a part of the light emitted from the light source, and allows light which is not shielded, to be transmitted as transmitted light, an optical fiber on which, the transmitted light transmitted through the light shielding member is incident, a holding member which includes a heat insulating member, and holds at least one of the light source, the collective lens, and the light shielding member by fixing at a respective position thereof, and a heat exhausting member which exhausts heat generated in the light shielding member to an outside of the holding member.

TRI-DIODE FOR LASER THERAPY AND TRI-DIODE-BASED EQUIPMENT FOR USE IN LASER THERAPY, this invention patent application proposes a tri-diode used to generate a particular type of laser that can be used to treat all types of cellular lesions, both in humans and in other animals. The invention can be applied to any age of patient and any lesion condition. The tri-diode proposed generates a laser from a combination of three specific molecules, namely: zinc, phosphorus or phosphate and aluminum; it is used to encourage cell regeneration, having a useable power of between 1.2 W and 1.5 W in each diode and a total power of between 3.6 W and 4.5 W, with a wavelength of between 780 and 808 nm; the zinc, phosphorus or phosphate and aluminum molecules can be combined in up to 26 mixtures.

A tunable laser has a solid state laser medium with optical gain region and generates coherent radiation through a facet. A lens collects the coherent radiation and generates a collimated light beam. An external cavity includes a reflective surface and an optical filter, the reflective surface reflecting the collimated beam back to the lens and laser medium, the optical filter positioned between the reflective surface and the lens and having two surfaces and a thermally tunable optical transmission band within the optical gain region of the laser medium. The optical filter (1) transmits a predominant portion of the collimated beam at a desired wavelength of operation, and (2) specularly reflects a remaining portion of the collimated beam from each surface, the collimated beam being incident on the optical filter such that the reflected collimated beams propagate at a non-zero angle with respect to the incident collimated beam.

An atomic oscillator includes a semiconductor laser, an atomic cell, a light receiving element, a first temperature control element, and a second temperature control element. The semiconductor laser includes a first mirror layer, a second mirror layer, and an active layer disposed between the first mirror layer, the second mirror layer, and a heat transfer member disposed on the second mirror layer. The atomic cell is irradiated with light emitted from the semiconductor laser. In the atomic cell, an alkali metal atom is accommodated. The light receiving element detects intensity of light transmitted through the atomic cell and outputs a detection signal. The first temperature control element controls a temperature of the semiconductor laser. The second temperature control element is controlled based on the detection signal and is connected to the heat transfer member.

A semiconductor laser includes a first mirror layer, a second mirror layer, an active layer disposed between the first mirror layer and the second mirror layer, a semiconductor layer disposed in the second mirror layer, an insulation region configured to insulate the second mirror layer and the semiconductor layer from each other, a first electrode connected to the first mirror layer, a second electrode connected to the second mirror layer, and a third electrode connected to the semiconductor layer.

An atomic oscillator includes a semiconductor laser, an atomic cell, a light receiving element, a first temperature control element, a heat transfer member, and a second temperature control element. The semiconductor laser includes a resonator and an insulation layer disposed around the resonator. The resonator includes a first mirror layer, a second mirror layer, and an active layer disposed between the first mirror layer and the second mirror layer. The atomic cell is irradiated with light emitted from the semiconductor laser. In the atomic cell, an alkali metal atom is accommodated. The light receiving element detects intensity of light transmitted through the atomic cell and outputs a detection signal. The first temperature control element controls a temperature of the semiconductor laser. The heat transfer member is disposed in the insulation layer. The second temperature control element is controlled based on the detection signal and is connected to the heat transfer member.

A tunable laser has a solid state laser medium having an optical gain region and generates coherent radiation through a facet. A lens collects the coherent radiation and generates a collimated light beam. Components of an external cavity include a reflective surface and an optical filter, the reflective surface reflecting the collimated beam back to the lens and the laser medium, the optical filter positioned between the reflective surface and the lens and having two surfaces with a thermally tunable optical transmission band within the optical gain region of the laser medium. The optical filter (1) transmits a predominant portion of the collimated beam at a desired wavelength of operation, and (2) specularly reflects a remaining portion of the collimated beam from each surface, the collimated beam being incident on the optical filter such that the reflected collimated beams propagate at a non-zero angle with respect to the incident collimated beam.

An integrated optical transceiver, comprising a laser component, comprising an array of VCSEL diodes formed on a laser diode substrate; a laser driving component, comprising laser diode driving circuitry formed on a laser driving circuitry substrate; a photodiode component, comprising an array of photodiodes formed on a photodiode substrate; and a photodiode driving component, comprising photodiode driving circuitry formed on a photodiode driving circuitry substrate; a first heat sink comprising a connected piece of material to transport excess heat away from the integrated optical transceiver and connected to both the laser and photodiode driving components; and an electrically insulating material separating the photodiode substrate from the first heat sink and being air or dielectric material with a relative dielectric constant <10, wherein the electrically insulating material provides a gap having an effective electrical distance of at least 80 m between the photodiode substrate and the first heat sink.

An optical module and a method of assembling the optical module are disclosed. The optical module comprises a laser unit, a modulator unit, and a detector unit mounted on respective thermo-electric coolers (TECs). The modulator unit, which is arranged on an optical axis of the first output port from which a modulated beam is output, modulates the continuous wave (CW) beam output from the laser unit. On the other hand, the laser unit and the detector unit are arranged on another optical axis of the second output port from which another CW beam is output. The method of assembling the optical module first aligns one of the first combination of the laser unit and the modulator unit with the first output port and the second combination of the laser unit and the detector unit, and then aligns another of the first combination and the second combination.

To provide an optical module whose power consumption in an ambient temperature range is reduced, and an optical transmission equipment. The optical module includes: a housing; a box type optical subassembly including a bottom portion serving as a heat dissipation face; and a heat conductive member disposed between the bottom portion of the optical subassembly and a bottom portion of the housing. The optical subassembly includes one or a plurality of optical semiconductor devices, and a temperature controller on which the one or plurality of optical semiconductor devices are mounted and which is placed on an inner bottom portion of the optical subassembly. The heat conductive member is disposed only at a portion of the bottom portion of the optical subassembly.