A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer, a surrounding wall, a light emitting unit, an adhesive, and a light permeable element. The surrounding wall is annular with step structure and includes an upper tread surface arranged away from the substrate, an upper riser surface connected to an inner edge of the upper tread surface, a lower tread surface disposed at an inner side of the upper riser surface, an accommodating groove disposed between the lower tread surface and the upper riser surface, and a lower riser surface connected to an inner edge of the lower tread surface and arranged away from the upper tread surface. The lower riser surface and the first surface jointly define a receiving space.

A light emission device of one embodiment reduces zero-order light included in output of an S-iPM laser. The light emission device includes a light emission unit and a phase modulation layer. The phase modulation layer has a base layer and modified refractive index regions each including modified refractive index elements. In each unit constituent region centered on a lattice point of an imaginary square lattice set on the phase modulation layer, the distance from the corresponding lattice point to each of the centers of gravity of the modified refractive index elements is greater than 0.30 times and is not greater than 0.50 times of the lattice spacing. In addition, the distance from the corresponding lattice point to the center of gravity of the modified refractive index elements as a whole is greater than 0 and is not greater than 0.30 times of the lattice spacing.

An in-plane-emitting semiconductor diode laser employs a surface-trapped optical mode existing at a boundary between a distributed Bragg reflector and a homogeneous medium, dielectric or air. The device can operate in both TM-polarized and TE-polarized modes. The mode exhibits an oscillatory decay in the DBR away from the surface and an evanescent decay in the dielectric or in the air. The active region is preferably placed in the top part of the DBR close to the surface. The mode behavior strongly depends on the wavelength of light, upon increase of the wavelength the mode becomes more and more extended into the homogeneous medium, the optical confinement factor of the mode in the active region drops until the surface-trapped mode vanishes. Upon a decrease of the wavelength, the leakage loss of the mode into the substrate increases. Thus, there is an optimum wavelength, at which the laser threshold current density is minimum, and at which the lasing starts. This optimum wavelength is temperature-stabilized, and shifts upon temperature increase at a low rate less than 0.1 nm/K, indicating wavelength-stabilized operation of the device. The approach applies also to semiconductor optical amplifiers or semiconductor gain chips which are also wavelength-stabilized. Reflectivity of the surface-trapped mode from an uncoated facet of the device can be extremely low, also <1E-4 or even <1E-5 which is particularly advantageous for amplifiers or gain chips. For diode lasers, a specific intermediate reflective coating can be deposited on the facet to put its reflectivity into a range from 0.5% to 3%, which lies within targeted values for lasers. An optical integrated circuit can employ wavelength-stabilized amplifiers operating in a surface-trapped mode, wherein such devices amplify light propagating along a dielectric waveguide.

A system for optical data interconnect of a source and a sink includes a first HDMI compatible electrical connector able to receive electrical signals from the source. A first signal converter is connected to the first HDMI compatible electrical connector and includes electronics for conversion of TMDS or FRL electrical signals to optical signals, with the electronics including an optical conversion device. At least one optical fiber is connected to the first signal converter. A second signal converter is connected to the at least one optical fiber and includes electronics for conversion of optical signals to differential electrical signals. A power module for the second signal converter includes a power tap connected to TMDS or FRL circuitry and a first voltage regulator connected to the power tap to provide power to an electrical signal amplifier. A rechargeable battery module is used to trigger power activation of connected ports, with the battery module being connected to the power tap. A second HDMI compatible electrical connector is connected to the second signal converter and able to send signals to the sink.

An in-plane-emitting semiconductor diode laser employs a surface-trapped optical mode existing at a boundary between a distributed Bragg reflector and a homogeneous medium, dielectric or air. The device can operate in both TM-polarized and TE-polarized modes. The mode exhibits an oscillatory decay in the DBR away from the surface and an evanescent decay in the dielectric or in the air. The active region is preferably placed in the top part of the DBR close to the surface. The mode behavior strongly depends on the wavelength of light, upon increase of the wavelength the mode becomes more and more extended into the homogeneous medium, the optical confinement factor of the mode in the active region drops until the surface-trapped mode vanishes. Upon a decrease of the wavelength, the leakage loss of the mode into the substrate increases. Thus, there is an optimum wavelength, at which the laser threshold current density is minimum, and at which the lasing starts. This optimum wavelength is temperature-stabilized, and shifts upon temperature increase at a low rate less than 0.1 nm/K, indicating wavelength-stabilized operation of the device. The approach applies also to semiconductor optical amplifiers or semiconductor gain chips which are also wavelength-stabilized. Reflectivity of the surface-trapped mode from an uncoated facet of the device can be extremely low, also <1E4 or even <1E5 which is particularly advantageous for amplifiers or gain chips. For diode lasers, a specific intermediate reflective coating can be deposited on the facet to put its reflectivity into a range from 0.5% to 3%, which lies within targeted values for lasers. An optical integrated circuit can employ wavelength-stabilized amplifiers operating in a surface-trapped mode, wherein such devices amplify light propagating along a dielectric waveguide.

A light modulation element according to example embodiments includes a substrate; a first lower DBR layer on the substrate including a first material layer alternately stacked with a second material layer having a different refractive index from the first material layer; a second lower DBR layer on the first lower DBR layer with a surface area less than the first lower DBR layer and including a third material layer alternately stacked with a fourth material layer having a different refractive index from the third material layer; an active layer on the second lower DBR layer, including a semiconductor material having a multi-quantum well structure and having a refractive index that varies according to an applied voltage; and an upper DBR layer on the active layer including a fifth material layer alternately stacked with a sixth material layer having a different refractive index from the fifth material layer.

The present embodiment relates to a semiconductor light emitting element having a structure that enables removal of zero-order light from output light of an S-iPM laser. The semiconductor light emitting element includes an active layer, a pair of cladding layers, and a phase modulation layer. The phase modulation layer has a base layer and a plurality of modified refractive index regions each of which is individually arranged at a specific position. One of the pair of cladding layers includes a distributed Bragg reflector layer which has a transmission characteristic with respect to a specific optical image outputted along an inclined direction with respect to a light emission surface and has a reflection characteristic with respect to the zero-order light outputted along a normal direction of the light emission surface.

The invention relates to, inter alia, a light-emitting semiconductor component comprising the following: a first mirror (102, 202, 302, 402, 502), a first conductive layer (103, 203, 303, 403, 503), a light-emitting layer sequence (104, 204, 304, 404, 504) on a first conductive layer face facing away from the first mirror, anda second conductive layer (105, 205, 305, 405, 505) on a light-emitting layer sequence face facing away from the first conductive layer, whereinthe first mirror, the first conductive layer, the light-emitting layer sequence, and the second conductive layer are based on a III-nitride compound semiconductor material, the first mirror is electrically conductive, andthe first mirror is a periodic sequence of homoepitaxial materials with varying refractive indices.

A Vertical Cavity Surface Emitting Laser (VCSEL) has a mesa having an active region, which has m active layer structures (with m2). The active layer structures are electrically connected to each other by a tunnel junction therebetween. The mesa has an optical resonator, which has first and second DBRs. The active region is between the first and second DBRs. The VCSEL has first and second electrical contacts, which provide electrical current to the active region, and an electrical control contact, which controls gain-switched laser emission of the VCSEL by at least 1 up to m-1 active layer structures by a current between the electrical control contact and the first or second electrical contact. A current aperture is between the active region and the first or second electrode. A distance between the current aperture and a furthest active layer structure is at least three times the laser light's wavelength.

The invention discloses a semiconductor optoelectronic micro-device comprising at least one cavity and at least one multilayer interference reflector. The device represents a micrometer-scale pillar with an arbitrary shape of the cross section. The device includes a vertical optical cavity, a gain medium and means of injection of nonequilibrium carriers into the gain medium, most preferably, via current injection in a p-n-junction geometry. To allow high electric-to-optic power conversion at least one contact is placed on the sidewalls of the micropillar overlapping with at least one doped section of the device. Means for the current path towards the contacts and for the heat dissipation from the gain medium are provided. Arrays of micro-devices can be fabricated on single wafer or mounted on single carrier. Devices with different cross-section of the micropillar emit light at different wavelengths.