The invention relates to a light source 1 comprising a photonic wire 20 having a single-mode core 21 and adapted to support an optical mode which is degenerate in polarization, comprising an emitter 24 of a pair of photons which are intended to be entangled in polarization. The photonic wire 20 comprises a cladding 25 which is asymmetrical in rotation and extends along a principal transverse axis At.sub.g. Furthermore, the light source 1 comprises a correction device 50 adapted to induce by electrostatic effect a mechanical deformation of the photonic wire 20 in a plane parallel to the substrate 10, along a deformation axis Ad forming an angle of inclination of between 0° and 90°, these values being exclusive, with respect to the principal transverse axis At.sub.g, the mechanical deformation leading to mechanical strains experienced by the emitter 24, thus improving the degree of entanglement of the photon pair.

A Dense Wavelength Division Multiplexing (DWDM) photonic integration circuit (PIC) that implements a DWDM system, such as a transceiver, is described. The DWDM PIC architecture includes photonic devices fully integrating on a single manufacturing platform. The DWDM PIC has a multi-wavelength optical laser, a quantum dot (QD) laser with integrated heterogeneous metal oxide semiconductor (H-MOS) capacitor, integrated on-chip. The multi-wavelength optical laser can be a symmetric comb laser that generates two equal outputs of multi-wavelength light. Alternatively, the DWDM PIC can be designed to interface with a stand-alone multi-wavelength optical laser that is off-chip. In some implementations, the DWDM PIC integrates multiple optimally designed photonic devices, such as a silicon geranium (SiGe) avalanche photodetector (APD), an athermal H-MOS wavelength splitter, a QD photodetector, and a heterogenous grating coupler. Accordingly, fabricating the DWDM PIC includes a unique III-V to silicon bonding process, which is adapted for its use of SiGe APDs.

There is set forth herein a method including a substrate; a dielectric stack disposed on the substrate; one or more photonics device integrated in the dielectric stack; and a laser light source having a laser stack including a plurality of structures arranged in a stack, wherein structures of the plurality of structures are integrated in the dielectric stack, wherein the laser stack includes an active region configured to emit light in response to the application of electrical energy to the laser stack.

A beam steering apparatus includes a substrate; at least one light source provided on the substrate; a first waveguide configured to transmit a first light beam radiated from the at least one light source; at least one beam splitter configured to split the first light beam transmitted by the first waveguide to obtain a second light beam; a second waveguide configured to receive the second light beam; and a quantum dot optical amplifier provided on the second waveguide and comprising a barrier layer, a quantum dot layer, and a wetting layer, the quantum dot optical amplifier being configured to modulate a phase of the second light beam, and to amplify an intensity of the second light beam.

A combination of microvalves and waveguides may enable the creation of reconfigurable on-chip light sources compatible with planar sample preparation and particle sensing architecture using either single-mode or multi-mode interference (MMI) waveguides. A first type of light source is a DFB laser source with lateral gratings created by the light valves. Moreover, feedback for creating a narrowband light source does not have to be a DFB grating in the active region. A DBR configuration (Bragg mirrors on one or both ends of the active region) or simple mirrors at the end of the cavity can also be used. Alternately, ring resonators may be created using a valve coupled to a bus waveguide where the active gain medium is either incorporated in the ring or inside an enclosed fluid. The active light source may be activated by moving a fluid trap and/or a solid-core optical component defining its active region.

A surface plasmon infrared nano-pulse laser having a multi-resonance competition mechanism, consisting of the four parts of a surface plasmon nano-pin resonance chamber (1), a spacer layer (2), a gain medium (3), and a two-dimensional material layer (4). The surface plasmon nano-pin resonance chamber (1) consists of a metal nano rod (11) and one or more nano sheets (12) grown thereon, the surface plasmon nano-pin resonance chamber (1) and the gain medium (3) being isolated by the isolating layer (2), and the two-dimensional material layer (4) covering a surface of the surface plasmon nano-pulse laser; positive and negative electrodes (5) are located at two ends of the surface plasmon nano-pulse laser, and a layer of a two-dimensional material having a feature of saturatable absorption is introduced to a surface of the nano-pin resonance chamber.

A photonic integrated device is provided, includes a substrate, a two-dimensional material unit and semiconductor light-emitting units located at both sides thereof are disposed on the substrate; the two-dimensional material unit is provided with a luminescent two-dimensional material of which a luminous band is longer than that of the semiconductor light-emitting unit, and the semiconductor light-emitting unit provides a pump light source for the two-dimensional material unit to pump the luminescent two-dimensional material to emit light. The photonic integrated device in the present disclosure can obtain different luminous bands by changing the number of layers or kinds of the luminescent two-dimensional material. Meanwhile, the photonic integrated device according to the present disclosure adopts an optical pumping luminescence method without forming a p-n junction, which simplifies process difficulty compared with an electrical pumping luminescence method of manufacturing the p-n junction based on the luminescent two-dimensional material in the prior art.

An epitaxial structure includes a semiconductor substrate, a dislocation blocking layer; and one or more active layers.

A vertical-cavity surface-emitting laser (VCSEL) has at least a substrate, electrical contacts, a first mirror region, a second mirror region and an active region between the mirror regions; where the mirror regions comprise distributed Bragg reflectors formed of a plurality of layers; laser emission is from at least one gallium arsenide antimonide nanostructure in the active region; and each said nanostructure contains more antimony atoms than arsenic atoms.

A method for etching a semiconductor structure (110) is provided, the semiconductor structure comprising a sub-surface quantum structure (30) of a first III-V semiconductor material,beneath a surface layer (31) of a second III-V semiconductor material having a charge carrier density of less than 510.sup.17 cm.sup.3. The sub-surface quantum structure may comprise, for example, a quantum well, or a quantum wire, or a quantum dot. The method comprises the steps of exposing the surface layer to an electrolyte (130), and applying a potential difference between the first III-V semiconductor material and the electrolyte, to electrochemically etch the sub-surface quantum structure (30) to form a plurality of nanostructures, while the surface layer (31) is not etched. A semiconductor structure, uses thereof, and devices incorporating such semiconductor structures are further provided.