A distributed power amplifier includes radio frequency (RF) input and output terminals. A first field effect transistor (FET) is coupled at a first gate terminal to the RF input terminal and at a first drain terminal to the RF output terminal. The first FET has a first periphery and a first source terminal electrically connected to ground potential. A second FET has a second periphery smaller than the first periphery. The second FET has a second gate terminal electrically coupled to the first gate terminal through a first inductor, a second drain terminal electrically coupled to the first drain terminal through a second inductor, and a second source terminal electrically connected to the ground potential. A drain voltage terminal, which excludes a resistive element, is electrically coupled to a drain bias network through which a drain bias voltage is applied to the first drain terminal and the second drain terminal.

An amplification unit contains two or more sets containing a plurality of amplification circuits, and amplifies power of an RF (Radio Frequency) signal. A combining unit contains two or more combiners corresponding to the two or more sets, combines RF signals output by the amplification circuits, and outputs a resultant RF signal. The amplification unit and the combining unit have two or more connectors which are arranged transversely. The amplification unit and the combining unit are attachable/detachable.

An amplification unit contains two or more sets containing a plurality of amplification circuits, and amplifies power of an RF (Radio Frequency) signal. A combining unit contains two or more combiners corresponding to the two or more sets, combines RF signals output by the amplification circuits, and outputs a resultant RF signal. The amplification unit and the combining unit have two or more connectors which are arranged transversely. The amplification unit and the combining unit are attachable/detachable.

An embodiment of a module (e.g., an amplifier module) includes a substrate, a transmission line, and a ground plane height variation structure. The substrate is formed from a plurality of dielectric material layers, and has a mounting surface and a second surface opposite the mounting surface. A plurality of non-overlapping zones is defined at the mounting surface. The transmission line is coupled to the substrate and is located within a first zone of the plurality of non-overlapping zones. The ground plane height variation structure extends from the second surface into the substrate within the first zone. The ground plane height variation structure underlies the transmission line, a portion of the substrate is present between the upper boundary and the transmission line, and the ground plane height variation structure includes a conductive path between an upper boundary of the ground plane height variation structure and the second surface.

Doherty power amplifier having high supply voltage. In some embodiments, a power amplification system can include a supply system configured to provide a high-voltage supply signal, and a Doherty power amplifier having an input splitter configured to receive and split a signal into a carrier amplifier and a peaking amplifier. The Doherty power amplifier can further include a combiner configured to combine amplified signals from the carrier and peaking amplifiers to provide an output signal. The Doherty power amplifier can be configured to receive the high-voltage supply signal for operation of the carrier and peaking amplifiers. The power amplification system can further include an output path configured to couple the combiner to a filter. The Doherty power amplifier can have an impedance substantially the same as an impedance of the filter when operated with the high-voltage supply signal.

An amplifier arrangement (200) for amplifying input signals and a method for operating the amplifier arrangement are disclosed. The amplifier arrangement (200) comprises a main amplifier circuit (210) having an input and an output; a first (221) and second (222) auxiliary amplifier circuits each having an input and an output, wherein each of the first (221) and second (222) auxiliary amplifier circuits being selectively operable to operate in combination with the main amplifier circuit (210). The amplifier arrangement (200) further comprises a single hybrid coupler circuit (230) having a first port (221) being coupled to the output of the main amplifier circuit (210), a second port (232) being coupled to the output of the first auxiliary amplifier circuit (221), a third port (233) being coupled to the output of the second auxiliary amplifier circuit (222) and a fourth port (234) being coupled to the load (240) of the amplifier (200).

Included is a compensation circuit (9) having one end connected to another end of a first output circuit (7) and another end of a second output circuit (8) and another end grounded, the compensation circuit having an electrical length of 90 degrees at a first operation frequency and an electrical length of 45 degrees at a second operation frequency which is half of the first operation frequency.

Included is a compensation circuit (9) having one end connected to another end of a first output circuit (7) and another end of a second output circuit (8) and another end grounded, the compensation circuit having an electrical length of 90 degrees at a first operation frequency and an electrical length of 45 degrees at a second operation frequency which is half of the first operation frequency.

An amplification apparatus includes: a signal splitter for splitting an input radio frequency signal and outputting the resulting split radio frequency signals; a plurality of amplifier units for amplifying the radio frequency signals outputted from the signal splitter, the amplifier units being disposed circularly to form a generally cylindrical shape; a plurality of water cooling heat sinks disposed circularly at positions corresponding to the positions of the plurality of amplifier units so as to cool the plurality of amplifier units by cooling water; and a signal combiner for combining the radio frequency signals outputted from the plurality of amplifier units, respectively, and outputting the resulting combined radio frequency signal.

An embodiment of a module (e.g., an amplifier module) includes a substrate, a transmission line, and a ground plane height variation structure. The substrate is formed from a plurality of dielectric material layers, and has a mounting surface and a second surface opposite the mounting surface. A plurality of non-overlapping zones is defined at the mounting surface. The transmission line is coupled to the substrate and is located within a first zone of the plurality of non-overlapping zones. The ground plane height variation structure extends from the second surface into the substrate within the first zone. The ground plane height variation structure underlies the transmission line, a portion of the substrate is present between the upper boundary and the transmission line, and the ground plane height variation structure includes a conductive path between an upper boundary of the ground plane height variation structure and the second surface.