An amplifier includes a semiconductor substrate. A first conductive feature partially covers the bottom substrate surface to define a conductor-less region of the bottom substrate surface. A first current conducting terminal of a transistor is electrically coupled to the first conductive feature. Second and third conductive features may be coupled to other regions of the bottom substrate surface. A first filter circuit includes an inductor formed over a portion of the top substrate surface that is directly opposite the conductor-less region. The first filter circuit may be electrically coupled between a second current conducting terminal of the transistor and the second conductive feature. A second filter circuit may be electrically coupled between a control terminal of the transistor and the third conductive feature. Conductive leads may be coupled to the second and third conductive features, or the second and third conductive features may be coupled to a printed circuit board.

A high-frequency module (1) includes a first substrate (101), a second substrate (102) that faces the first substrate (101), a support (103) that supports the first substrate (101) and the second substrate (102), and a plurality of high-frequency circuit components arranged in internal space formed by the first substrate (101), the second substrate (102), and the support and on both of facing principal faces of the first substrate (101) and the second substrate (102), and the plurality of high-frequency circuit components include a power amplifier element that constitutes a power amplifier circuit (16).

Methods, devices, apparatuses, and systems provide an efficient architecture for multi-mode amplifier modules by combining components of parallel transmit paths and reducing the number of total components used in amplifier modules. One such an amplifier module, including a first transmit path connected in parallel to a second transmit path between an input of the amplifier module and an intermediate node. The amplifier module further includes a common path connected to the intermediate node and an output of the amplifier module. The common path includes one or more shared components for a signal routed through either the first and second transmit paths.

Multi-band device having multiple miniaturized single-band power amplifiers. In some embodiments, a power amplifier die can include a semiconductor substrate, and a plurality of power amplifiers (PAs) implemented on the semiconductor substrate. Each PA can be configured to drive approximately a characteristic load impedance of a downstream component along an individual frequency band signal path, such that each PA is sized smaller than a wide band PA configured to drive more than one of the frequency bands associated with the plurality of PAs. The downstream component can include an output filter.

A cascade power system includes a non-isolated buck converter in cascade with an isolated Class-E resonant circuit, where the Class-E resonant circuit operates at high frequency, for example 4 Mhz. Further, the non-isolated buck converter is configured as a current source coupled to the Class-E resonant circuit which provides a buck converter output voltage as input to the Class-E resonant circuit. The Class-E resonant circuit includes capacitive isolation for the cascade power system output.

Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed. The bulk acoustic wave components can be plasma diced along the exposed streets to thereby singulate the bulk acoustic wave components

Doherty power amplifier having reduced size. In some embodiments, a power amplification system can include a supply system configured to provide a high-voltage supply signal, and a Doherty power amplifier configured to receive the high-voltage supply signal and amplify a radio-frequency (RF) signal. The power amplification system can further include an output path configured to receive and route the amplified RF signal to a filter. The output path can be substantially free of an impedance transformation circuit.

Filtering architectures and methods for wireless applications. In some embodiments, a wireless architecture can include a pre-amplifier filter configured to filter a signal, and an amplifier assembly configured to amplify the filtered signal. The wireless architecture can further include a filter circuit configured to provide selective filtering of the amplified signal based at least in part on a rejection level of the pre-amplifier filter and a gain of the amplifier assembly. In some embodiments, such a wireless architecture can be implemented in a packaged module or a wireless device.

A multiple functional equivalence digital communications interface and a group of functional circuits are disclosed. The multiple functional equivalence digital communications interface presents a functional equivalence of each of a group of digital communications interfaces to a digital communications bus. Each functional equivalence of the group of digital communications interfaces is associated with a corresponding one of the group of functional circuits.

A cascade power system includes a non-isolated buck converter in cascade with an isolated Class-E resonant circuit, where the Class-E resonant circuit operates at high frequency, for example 4 Mhz. Further, the non-isolated buck converter is configured as a current source coupled to the Class-E resonant circuit which provides a buck converter output voltage as input to the Class-E resonant circuit. The Class-E resonant circuit includes capacitive isolation for the cascade power system output. The Class-E resonant circuit and the capacitive isolation are configured such that impedance matching for the resonant tank of the Class-E resonant circuit is independent of an output load condition.