Patent classifications
H03F2203/21157
Receiving module, packaging structure, printed circuit board, and electronic device
This application provides a receiving module, a packaging structure, a printed circuit board, and an electronic device, which can mitigate a problem that application scenarios of a front-end receiving module of an existing GNSS receiver are limited. The receiving module includes a first filtering unit, an amplifying unit, and a control element. When the amplifying unit operates in a first mode, the first end of the amplifying unit acts as a signal input end, and in this way, the first filtering unit acts as a front filtering unit. When the amplifying unit operates in a second mode, the first end of the amplifying unit acts as a signal output end, and in this way, the first filtering unit acts as a rear filtering unit.
Radio frequency circuit and radio frequency module
A radio frequency circuit includes a first radio frequency circuit, a second radio frequency circuit, and a first switch circuit. The first switch circuit includes a first terminal connected to an antenna connection terminal, a second terminal connected to the first radio frequency circuit, and a third terminal connected to the second radio frequency circuit. The first radio frequency circuit includes a first power amplifier circuit supporting a first power class, and a first filter circuit connected to the first power amplifier circuit and having a passband that includes a first band. The second radio frequency circuit includes a second power amplifier circuit supporting a second power class having a maximum output power greater than a maximum output power of the first power class. The second radio frequency circuit includes a second filter circuit connected to the second power amplifier circuit and having a passband that includes the first band.
High-frequency module and communication device
A high-frequency module includes: a module substrate that has major surfaces that face each other; a plurality of post electrodes placed on the major surface; and a power amplification component placed on the major surface. The power amplification component includes: a base material that has major surfaces and that face each other, the major surface being located between the major surface and the major surface; an amplification transistor formed on a side of the major surface of the base material; and a metal electrode placed on the major surface and connected to the amplification transistor.
WIDE-RANGE SWITCHED-MODE POWER AMPLIFIER ARCHITECTURE
According to one embodiment, a power amplifier includes a plurality of switches and an output tank network. One or more of the switches are configured to generate one or more first intermediate waveforms having one or more first fundamental frequency components, and one or more of the switches are configured to generate one or more second intermediate waveforms by chopping the one or more first intermediate waveforms with controllable timing. The second intermediate waveforms have one or more second fundamental frequency components that are controllably reduced from those of the one or more first intermediate waveforms. The output tank network is configured to filter the one or more second intermediate waveforms to provide an output waveform to a load, the output waveform having one or more third fundamental frequency components. In some cases, all switches achieve zero voltage switching under different power and load conditions with resistive and reactive loads.