An electronic component includes an upper surface, a lower surface, a side surface, a circuit pattern, and an upper surface shield electrode. The circuit pattern is provided inside the electronic component. The upper surface shield electrode is disposed on the upper surface. In a plan view from a normal direction of the upper surface, a center of gravity of the upper surface shield electrode is spaced from a center of gravity of the upper surface.

An electronic component includes a multilayer body including dielectric layers, a circuit pattern, and band-shaped conductor patterns. The circuit pattern includes a conductor pattern that is disposed inside the multilayer body and defines an inductor. The band-shaped conductor patterns are grounded and cover a portion of a shield surface. An internal surface is located between the circuit pattern and an upper surface. On a shield surface, a non-shielded area is provided which is not covered with any of the band-shaped conductor patterns, and through which magnetic flux generated from the inductor is able to pass.

A multilayer band pass filter includes a first LC parallel resonator electrically connected to a first input/output terminal, a second LC parallel resonator electrically connected to a second input/output terminal, and a third LC parallel resonator is magnetically coupled to the first LC parallel resonator. The first LC parallel resonator includes a first inductor. The second LC parallel resonator includes a second inductor. The third LC parallel resonator is magnetically coupled to the second LC parallel resonator. A bypass connects the first inductor and the second inductor to each other.

A semiconductor device capable of reducing in size thereof and suppressing degradation in the characteristics of circuit components is provided. The semiconductor device includes an LC circuit comprised of a spiral inductor provided over a semiconductor substrate and a capacitive element coupled with the spiral inductor. The spiral inductor includes a central area encircled with a metal wiring and a peripheral area other than the central area. The capacitive element is formed in an upper-layer or a lower-layer position corresponding to the peripheral area other than the central area.

A multilayer filter includes dielectric layers, a first terminal, a second terminal, a first inductor, a second inductor, and first to fifth capacitors. In a stacking direction of the dielectric layers, at least one of a first air-core portion defined by the first inductor and a second air-core portion defined by the second inductor includes, in a region from the first inductor layer to the second inductor layer, a region enabling magnetic flux to pass therethrough without being obstructed by the first to fifth capacitors and the third inductor.

A multilayer substrate includes a via electrode defining and functioning as an end portion on ground terminals side of a first inductor connected to a shield electrode, the end portion on a signal line side is adjacent to or in a vicinity of a first principal surface than the end portion on the ground terminals side is in the lamination direction of base material layers, a via electrode defining and functioning as the end portion on the ground terminals side of a second inductor is connected to the shield electrode, and the end portion on the signal line side is adjacent to or in a vicinity of the first principal surface than the end portion on the ground terminals side is in the lamination direction of the base material layers.

Reflectionless low-pass, high-pass, band-pass, band-stop, all-pass, and all-stop filters, as well as a method for designing such filters is disclosed, along with a method of enhancing the performance of such filters through the use of sub-networks to further modify and improve the frequency response. These filters preferably function by absorbing the stop-band portion of the spectrum rather than reflecting it back to the source, which has significant advantages in many different applications. The sub-networks preferably offer additional degrees of freedom by which the leakage through the parent filter may be cancelled or reinforced to alter cutoff sharpness, stop-rejection, or other measures of performance.

Filter circuits having acoustic wave resonators in a transversal configuration are disclosed. In the transversal configuration, the acoustic wave resonators are arranged transverse to an input and output port of the filter circuit. As such, all the acoustic wave resonators of the filter circuit are connected to the input port and connected to the output port. In the transversal configuration, the filter circuit can be designed for any transfer function without being restricted to a coupling coefficient of a piezoelectric material used in the acoustic wave resonators. In this regard, the filter circuit can achieve very wideband filter responses, multiband responses, and/or responses with arbitrary position of transmission zeros. The filter circuit having the transversal configuration can also be designed for complex transmission zeros for phase equalization.

A laminate defining a high-frequency laminated component includes a ground electrode on a bottom surface of a lowermost insulating layer. A second insulating layer includes an inner-layer ground electrode arranged over substantially the entire surface thereof. A portion from a third insulating layer to a fifth insulating layer is provided with a capacitor electrode defining a series capacitor of a ground impedance adjustment circuit and capacitor electrodes defining a first parallel capacitor and a second parallel capacitor. A sixth insulating layer has an inner-layer ground electrode provided over substantially the entire surface thereof. The inner-layer ground electrodes are arranged in electrical continuity with the ground electrode by via holes.

A low pass filter includes a first via-hole conductor connected to a first end portion of a first inductor and a third end portion of a second inductor and extending to another side in a lamination direction with respect to a second end portion of the first inductor and a fourth end portion of the second inductor, and a first capacitor electrically connected in parallel with at least a portion of the first inductor and a portion of the second inductor and defined by a first capacitor conductor layer. The low pass filter allows the interval between attenuation poles to be easily adjusted.