A filter device is mounted on a module substrate and is shielded by a shield member. The filter device has first and second side surfaces opposed to each other. A ground terminal and signal terminals are formed on a bottom surface of the filter device. The shield member includes side wall portions facing the first and second side surfaces. The filter device includes plural LC parallel resonance circuits therein. The inductors of the LC parallel resonance circuits are arranged in parallel with the first side surface and the bottom surface. Each inductor extends upward from its end portion electrically connected to the ground terminal, extends from the first side surface toward the second side surface, and then extends toward the bottom surface. The gap between the first side surface and the corresponding side wall portion is smaller than that between the second side surface and the corresponding side wall portion.

An LC filter includes a multilayer body, plate electrodes, capacitor electrodes, and inductor vias. The capacitor electrodes each define a capacitor between the plate electrode and a corresponding one of the capacitor electrodes. A first inductor via is connected between a first capacitor electrode and a first plate electrode. A second inductor via is connected between a second capacitor electrode and the first plate electrode. A third inductor via is connected between a third capacitor electrode and the first plate electrode. A fourth capacitor electrode faces the first and second capacitor electrodes. A fifth capacitor electrode faces the second and third capacitor electrodes. A sixth capacitor electrode faces the first and third capacitor electrodes.

An integrated passive die includes a substrate, an input node, an output node, and RF filtering circuitry. The RF filtering circuitry includes a number of LC tank circuits coupled between the input node and the output node. Each one of the LC tank circuits include an inductor and a capacitor. The inductor is formed by a metal trace over the substrate. The capacitor is coupled in parallel with the inductor over the substrate. The inductor and the capacitor are provided such that a resonance frequency of the combination of the inductor and the capacitor is less than a self-resonance frequency of the inductor.

A filter circuit including a plurality of capacitances and a plurality of inductances including one variable reactance that is either an inductance or a capacitance. The filter circuit has a plurality of resonant modes that each correspond to resonance at a resonant frequency between the variable reactance and one or more of the plurality of inductances and one or more of the plurality of capacitances. The variable reactance is conductively coupled with one or more other inductances and capacitances of the pluralities of inductances and capacitances such that a change in the variable reactance causes a change in a resonant frequency of more than one of the plurality of resonant modes. Front-end modules and wireless communication devices incorporating such a filter circuit and a method using such a filter circuit are also described.

The integrated circuit includes a power amplifier, an antenna, and a matching and filtering network including a direct current power supply stage on an output node of the power amplifier, a first section, and a second section. The direct current power supply stage and the two sections include inductor-capacitor “LC” arrangements configured to have an impedance that is matched to the output of the power amplifier in the fundamental frequency band. The LC arrangements of the direct current power supply stage and of the first section are furthermore configured to have resonant frequencies that are respectively adapted to attenuate harmonic frequency bands of the fundamental frequency band.

An electronic component includes a stack and an inductor wound about an axis orthogonal to a stacking direction. The inductor includes a first conductor layer portion and two through hole columns. The first conductor layer portion includes two conductor layers disposed at positions different from each other in the stacking direction and connected in parallel to each other. Area of a first conductor layer is larger than area of a second conductor layer.

An electronic component includes a stack and first to third inductors. Area of a region obtained by perpendicularly projecting a first space including a first axis and surrounded by the first inductor onto an XZ plane is larger than area of a region obtained by perpendicularly projecting a second space including a second axis and surrounded by the second inductor onto a YZ plane. The third inductor is disposed such that a third axis does not intersect the first space but intersects the second space.

An electronic component includes a stack and first to fourth inductors. The second inductor is disposed after the first inductor in a −Y direction. The third inductor and the fourth inductor are disposed after the first inductor and the second inductor, respectively, in a −X direction. Two or more through hole columns are connected in parallel to a part near each end of a conductor layer portion in each of the first inductor and the fourth inductor in a longitudinal direction. One through hole column is connected to a part near each end of a conductor layer portion in each of the second inductor and the third inductor in a longitudinal direction.

An electronic component includes a stack and first and second inductors. The first inductor includes a first through hole column, a second through hole column, a first conductor layer portion, a second conductor layer portion, and a third conductor layer portion. The second conductor layer portion is connected to an end of the first through hole column and extends close to the second through hole column. The third conductor layer portion is connected to the second through hole column and extends close to the first through hole column.

The integrated circuit includes a power amplifier intended to provide a signal in a fundamental frequency band, an antenna, and a matching and filtering network having a first section, a second section, and a third section. The three sections include LC arrangements configured to have an impedance matched to the power amplifier's output in the fundamental frequency band. The LC arrangements of the first section and the second section are configured to have resonant frequencies adapted to attenuate the harmonic frequency bands of the fundamental frequency band.