A signal transmission circuit includes a common frequency filter configured to filter a signal centering on a common frequency that is an anti-resonance frequency; a first frequency filter configured to filter a signal centering on a first frequency that is an anti-resonance frequency; a second frequency filter configured to filter a signal centering on a second frequency that is an anti-resonance frequency; a first route connected to a first signal wiring line configured to transmit a digital signal; and a second route connected to a second signal wiring line configured to transmit a digital signal. The first route has the common frequency filter connected to a power supply circuit, and the first frequency filter disposed between the common frequency filter and the first signal wiring line and connected in series to the common frequency filter, the second route has the common frequency filter, and the second frequency filter disposed between the common frequency filter and the second signal wiring line and connected in series to the common frequency filter, and both the first frequency and the second frequency are equal to or higher than the common frequency.

Aspects of this disclosure relate to a band pass filter that includes LC resonant circuits coupled to each other by a capacitor. A bridge capacitor can be in parallel with series capacitors, in which the series capacitors include the capacitor coupled between the LC resonant circuits. The bridge capacitor can create a transmission zero at a frequency below the passband of the band pass filter. The LC resonant circuits can each include a surface mount capacitor and a conductive trace of the substrate, and an integrated passive device die can include the capacitor. Band pass filters disclosed herein can be relatively compact, provide relatively good out-of-band rejection, and relatively low loss.

An on-chip microwave filter circuit includes a substrate formed of a first material that exhibits at least a threshold level of thermal conductivity, wherein the threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The filter circuit further includes a dispersive component configured to filter a plurality of frequencies in an input signal, the dispersive component including a first transmission line disposed on the substrate, the first transmission line being formed of a second material that exhibits at least a second threshold level of thermal conductivity, where the second threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The dispersive component further includes a second transmission line disposed on the substrate, the second transmission line being formed of the second material.

A filter device includes a filter including at least one inductor and at least one capacitor, and a stack of a plurality of dielectric layers and a plurality of conductor layers. The plurality of dielectric layers include at least one first dielectric layer formed of a first dielectric material and at least one second dielectric layer formed of a second dielectric material. The plurality of conductor layers include at least one first conductor layer in contact with the at least one first dielectric layer, and at least one second conductor layer in contact with the at least one second dielectric layer. The temperature coefficient of resonant frequency of the first dielectric material has a positive value. The temperature coefficient of resonant frequency of the second dielectric material has a negative value.

A filter device includes a first port, a second port, a first high-pass filter, a first low-pass filter, and a stack. The first high-pass filter includes a first inductor. The first low-pass filter includes a first inductor. At least one second conductor layer constituting the first inductor of the first low-pass filter is located between at least one first conductor layer constituting the first inductor of the first high-pass filter and a ground conductor layer in a stacking direction.

A band-pass filter includes a first input/output port, a second input/output port, a first high-pass filter, a first low-pass filter, and a first stub resonator. The first stub resonator includes a first distributed constant line. The first low-pass filter is provided between the first input/output port and the first high-pass filter in the circuit configuration. The first distributed constant line has a first end connected to a first path connecting the first input/output port and the first low-pass filter, and a second end closest to a ground in the circuit configuration.

A multilayer circuit board with an LC resonant circuit that has an electronic component package including the multilayer circuit board with the LC resonant circuit are provided. The multilayer circuit board with the LC resonant circuit configured by alternately laminating conductive layers and insulating resin layers on both sides of a core substrate includes a first set of wiring lines, a set of vias, and a second set of wiring lines. The first set of wiring lines configures both ends of the LC resonant circuit and is formed in a first one of the conductive layers. The set of vias extends through the insulating resin layers. The second set of wiring lines is connected to an input/output terminal of the LC resonant circuit and is formed in a second one of the conductive layers. The first set of wiring lines is connected to the second set of wiring lines.

Hybrid filters and more particularly filters having acoustic wave resonators (AWRs) and lumped component (LC) resonators and packages therefor are described. In an example, a packaged filter includes a package substrate, the package substrate having a first side and a second side, the second side opposite the first side. A first acoustic wave resonator (AWR) device is coupled to the package substrate, the first AWR device comprising a resonator. A plurality of inductors is in the package substrate.

A multiplexer includes: a first terminal; a second terminal; a third terminal; a first filter connected between the first and second terminals, including a first capacitor, a first inductor, and one or more first acoustic wave resonators, and having a first passband; a second filter connected between the first and third terminals, including a second capacitor, a second inductor, and one or more second acoustic wave resonators, and having a second passband higher than the first passband; a substrate having a surface on which at least one first acoustic wave resonator of the one or more first acoustic wave resonators and at least one second acoustic wave resonator of the one or more second acoustic wave resonators are located; and a metal structure located on the surface and located between the at least one first acoustic wave resonator and the at least one second acoustic wave resonator.

A superconducting circuit includes a first port and a plurality of second ports; a plurality of filter poles, each filter pole comprising an inductor and a capacitor connected in parallel, between the first port and a second port in the plurality of second ports; an admittance inverter comprising at least one of a coupling capacitor, a coupling inductor, and a Josephson junction, the admittance inverter linking two successive filter poles together. The plurality of filter poles and associated admittance inverters define a plurality of current branches so that, when operating as a demultiplexer, an input electrical current input though the first port is routed to a selected one of the plurality of the plurality of second ports by an application of a first set of magnetic flux biases.