An integrated passive die includes a substrate, an input node, an output node, and RF filtering circuitry. The RF filtering circuitry includes a number of LC tank circuits coupled between the input node and the output node. Each one of the LC tank circuits include an inductor and a capacitor. The inductor is formed by a metal trace over the substrate. The capacitor is coupled in parallel with the inductor over the substrate. The inductor and the capacitor are provided such that a resonance frequency of the combination of the inductor and the capacitor is less than a self-resonance frequency of the inductor.

Multiple LC parallel resonators in which inductors and capacitors are connected in parallel are located inside a multilayer body. The inductors each include a loop inductor including a line-shaped conductor pattern and at least one pair of via conductors connected to the line-shaped conductor pattern. When the multilayer body is seen through in a height direction, in all the loop inductors of the LC parallel resonators, open via conductors are closer to a center of the multilayer body, and short-circuit via conductors are closer to an outer side of the multilayer body in at least one of a width direction and a length direction.

RF communications circuitry, which includes a first tunable RF filter and a first RF low noise amplifier (LNA) is disclosed. The first tunable RF filter includes a pair of weakly coupled resonators, and receives and filters a first upstream RF signal to provide a first filtered RF signal. The first RF LNA is coupled to the first tunable RF filter, and receives and amplifies an RF input signal to provide an RF output signal.

Aspects of this disclosure relate to a band pass filter that includes LC resonant circuits coupled to each other by a capacitor. A bridge capacitor can be in parallel with series capacitors, in which the series capacitors include the capacitor coupled between the LC resonant circuits. The bridge capacitor can create a transmission zero at a frequency below the passband of the band pass filter. The LC resonant circuits can each include a surface mount capacitor and a conductive trace of the substrate, and an integrated passive device die can include the capacitor. Band pass filters disclosed herein can be relatively compact, provide relatively good out-of-band rejection, and relatively low loss.

A multilayer LC filter includes a multilayer body in which dielectric layers are laminated, first linear conductive patterns, second linear conductive patterns, third linear conductive patterns, capacitor conductive patterns, ground conductive patterns, and via conductors. When the multilayer body is seen through in the direction in which the dielectric layers are laminated, the first linear conductive patterns and the third linear conductive patterns in a first inductor intersect with each other, and the first linear conductive patterns and the third linear conductive patterns in a second inductor intersect with each other.

An LC resonator includes a laminate body including dielectric layers that are laminated in a lamination direction. The LC resonator includes a first capacitor, a second capacitor, and an inductor connected between the first capacitor and the second capacitor. A first end of the inductor is isolated in a direct current from a ground node by the first capacitor. A second end of the inductor is isolated in a direct current from the ground node by the second capacitor.

A multilayer band pass filter includes a first LC parallel resonator electrically connected to a first input/output terminal, a second LC parallel resonator electrically connected to a second input/output terminal, and a third LC parallel resonator is magnetically coupled to the first LC parallel resonator. The first LC parallel resonator includes a first inductor. The second LC parallel resonator includes a second inductor. The third LC parallel resonator is magnetically coupled to the second LC parallel resonator. A bypass connects the first inductor and the second inductor to each other.

A lumped element directional coupler having an asymmetrical structure. The lumped element directional coupler can be integrated while being compact by using lumped elements, instead of transmission lines, have broadband characteristics through the lumped elements being asymmetrically arranged, and further increase bandwidth by additionally providing a negative capacitor element or, more particularly, a negative capacitor element having loss.

Filter circuits having a resonator-based filter and a magnetically-coupled filter are disclosed. A filter circuit is deployed with a resonator-based passband filter connected to a magnetically-coupled filter which mitigates or reduces flyback of the resonator-based filter. The magnetically-coupled filter can be a passband filter with a relatively low insertion loss. The magnetically-coupled filter can be designed to mitigate flyback of the resonator-based filter by attenuating frequency response at selected frequency ranges.

A method for reducing a quantity of cable runs to antennas can include the step of providing a circuit of reactive elements coupled between an input terminal and at least two output terminals. The circuit can be used to separate a broadband signal into two or more disjoint expected frequency ranges. The circuit can match the impedance at the at least two output terminals to the impedance expected by the antennas. The elements of the circuit can have reactances and arrangement so that when a broadband RF signal is applied at the input terminal, two or more disjoint expected frequencies can be applied to the respective output terminals. The power at each output terminal can sufficiently match the antennas' expected power, and insertion losses can be minimized.