A multilayer LC filter includes one via conductor on a second edge side and two via conductors on a fourth edge side that are connected to line-shaped conductor patterns of a first inductor, and two via conductors on the second edge side and one via conductor on the fourth edge side that are connected to line-shaped conductor patterns of a second inductor, and the third to fifth inductors also have this same relationship.

A radio frequency (RF) filter system for a substrate processing chamber comprises a first RF filter coupled to a first element of the processing chamber and a second RF filter coupled to the first element of the processing chamber. Each of the RF filters comprises a first filter stage configured to reject a first frequency, a second filter stage coupled to the first filter stage and configured to reject a second frequency, and a third filter stage coupled to the second filter stage and configured to reject the first frequency. Further, the first filter stage comprises a first inductor and a first capacitance, the second filter stage comprises a second inductor and a second capacitance, the third filter stage comprises a third inductor and a third capacitance.

According to one embodiment, a compact broadband radio frequency (RF) receiver circuit includes a low noise amplifier which includes a first amplifier stage, a second amplifier stage, an inter-stage network including a higher order filter network, where the inter-stage network is coupled between the first amplifier stage and the second amplifier stage, and a double resonance transformer network coupled to an output of the second amplifier stage. The RF receiver circuit includes a low pass filter and a mixer circuit coupled between the low noise amplifier and the low pass filter.

An on-chip microwave filter circuit includes a substrate formed of a first material that exhibits at least a threshold level of thermal conductivity, wherein the threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The filter circuit further includes a dispersive component configured to filter a plurality of frequencies in an input signal, the dispersive component including a first transmission line disposed on the substrate, the first transmission line being formed of a second material that exhibits at least a second threshold level of thermal conductivity, where the second threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The dispersive component further includes a second transmission line disposed on the substrate, the second transmission line being formed of the second material.

An on-chip microwave filter circuit includes a substrate formed of a first material that exhibits at least a threshold level of thermal conductivity, wherein the threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The filter circuit further includes a dispersive component configured to filter a plurality of frequencies in an input signal, the dispersive component including a first transmission line disposed on the substrate, the first transmission line being formed of a second material that exhibits at least a second threshold level of thermal conductivity, wherein the second threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The dispersive component further includes a second transmission line disposed on the substrate, the second transmission line being formed of the second material.

A frontend module includes a first filter having a passband of a first frequency band, a second filter having a passband of a second frequency band, the second frequency band being higher than the first frequency band, a third filter having a passband of a third frequency band, the third frequency band being higher than the second frequency band, and a sub-filter, connected to the second filter, configured to provide attenuation characteristics for the first frequency band, wherein the second filter comprises a plurality of parallel LC resonance circuits arranged between a ground and different nodes, from among a plurality of nodes between a first terminal and a second terminal, wherein an inductor is connected to a portion of the plurality of parallel LC resonance circuits.

A magnet-free non-reciprocal device realized using modulated filters. The device includes one or more filters in one or more branches, where each branch connects two ports or a port and a central node. The poles and zeros of each of the first, second and third filters are modulated in time such that degenerate modes at each pole and zero is split thereby destructively interfering at one or more output ports and adding up at another output port allowing non-reciprocal transmission, isolation and/or non-reciprocal phase shift. The device is able to realize a magnet-free full-duplex communication scheme implementing a magnet-free circulator for radio frequency cancellation or a magnet-free isolator or gyrator.

Techniques that facilitate a superconducting combiner or separator of DC-currents and microwave signals are provided. In one example, a device includes a direct current circuit and a microwave circuit. The direct current circuit comprises a bandstop circuit and provides transmission of a direct current signal. The microwave circuit provides transmission of a microwave signal. The microwave circuit and the direct current circuit that comprises the bandstop circuit are joined by a common circuit that provides transmission of the direct current signal and the microwave signal.

Aspects of this disclosure relate to a band pass filter that includes LC resonant circuits coupled to each other by a capacitor. A bridge capacitor can be in parallel with series capacitors, in which the series capacitors include the capacitor coupled between the LC resonant circuits. The bridge capacitor can create a transmission zero at a frequency below the passband of the band pass filter. The LC resonant circuits can each include a surface mount capacitor and a conductive trace of the substrate, and an integrated passive device die can include the capacitor. Band pass filters disclosed herein can be relatively compact, provide relatively good out-of-band rejection, and relatively low loss.

A filter includes: first and second parallel resonant circuits including a first capacitor, a first line, a second capacitor, and a second line that are shunt-connected to a series pathway connecting the input and output terminals; and first to sixth vias penetrating through a second dielectric layer on which the first and second lines are disposed, the first via connecting the first line to the series pathway, the second via connecting the first line to the ground terminal, the third via connecting the first line at a position between the first and second vias to the first connection line at a first position, the fourth via connecting the second line to the series pathway, the fifth via connecting the second line to the ground terminal, the sixth via connecting the second line at a position between the fourth and fifth vias to the first connection line at a second position.