A branching filter includes a first filter and a second filter. The first filter includes a first inductor. The second filter includes a second inductor. Each of the first inductor and the second inductor is wound about an axis extending in a direction orthogonal to a stacking direction of a stack. The first inductor is arranged at a position closer to a first end portion of the stack than to a second end portion of the stack. The second inductor is arranged at a position closer to the second end portion than to the first end portion.

A filter assembly is disclosed that includes a monolithic filter having a surface and a heat sink coupled to the surface of the monolithic filter. The heat sink includes a layer of thermally conductive material that can have a thickness greater than about 0.02 mm. The heat sink may provide electrical shielding for the monolithic filter. In some embodiments, the filter assembly may include an organic dielectric material, such as liquid crystalline polymer or polyphenyl ether. In some embodiments, the filter assembly may include an additional monolithic filter.

A termination/attenuation network applies to an input of a set-top box a MOCA channel signal having a narrow band of frequencies and included in RF signals having a wide band of frequencies received via a cable from a satellite antenna. The network includes a pair of series resistors and a parallel resistor coupled to a junction terminal between the pair of series resistors in a T-shaped configuration. A series-pass band-pass filter (L1, C2) bypasses the pair of series resistors and a parallel band stop filter (L2, C1) decouples the parallel resistor at the frequency band of the MOCA channel signal for selectively reducing attenuation at the frequency band of the MOCA channel signal.

Radio frequency (RF) receiver design is a challenging task, involving conflicting requirements such as tight link budget, small footprint, low insertion loss, tuning and out-of-band rejections. Methods and devices are described to allow RF receiver design meeting stringent requirements at higher frequencies while preserving a small footprint and without affecting the overall performance.

A compact band pass filter (BPF), including a first transmission line electromagnetically coupled to a second transmission line; and an isolating surface positioned between the first transmission line and the second transmission line, wherein the isolating surface includes at least one aperture designed to produce a desired electromagnetic coupling between the first transmission line and the second transmission line wherein the coupling produces a passband such that certain frequencies within an input transmission signal are filtered out.

Methods and devices suitable for monitoring the frequency of microwave tunable filters in real time. The frequency readout relies on the natural response of such a filter when excited by a pulse. Methods of measuring an operating frequency of a pole in a tunable filter include measuring a number of cycles in a natural response in the filter when the filter is excited by an electric current pulse, and determining a resonance frequency based on the number of cycles measured in the natural response. Such a method can provide the operating frequency information in a binary digital format, making it relatively easy to read and process. A measuring resonator may be mounted to the filter resonator and connected by a common actuator.

RF communications circuitry, which includes a first tunable RF filter and a first RF low noise amplifier (LNA) is disclosed. The first tunable RF filter includes a pair of weakly coupled resonators, and receives and filters a first upstream RF signal to provide a first filtered RF signal. The first RF LNA is coupled to the first tunable RF filter, and receives and amplifies an RF input signal to provide an RF output signal.

A laminate defining a high-frequency laminated component includes a ground electrode on a bottom surface of a lowermost insulating layer. A second insulating layer includes an inner-layer ground electrode arranged over substantially the entire surface thereof. A portion from a third insulating layer to a fifth insulating layer is provided with a capacitor electrode defining a series capacitor of a ground impedance adjustment circuit and capacitor electrodes defining a first parallel capacitor and a second parallel capacitor. A sixth insulating layer has an inner-layer ground electrode provided over substantially the entire surface thereof. The inner-layer ground electrodes are arranged in electrical continuity with the ground electrode by via holes.

An electronic component includes a multilayer body and a first resonator. The multilayer body includes insulating layers stacked on each other in a stacking direction. The first resonator includes a first inductor and a first capacitor disposed in the multilayer body. The first inductor is defined by a conductive layer disposed on an insulating layer of the plurality of insulating layers and an interlayer connecting conductor which passes through an insulating layer of the plurality of insulating layers in the stacking direction connected to each other so that the first inductor preferably has a helical or substantially helical shape as viewed from a first direction perpendicular or substantially perpendicular to the stacking direction. A certain portion of the first inductor is located on a predetermined plane perpendicular or substantially perpendicular to the first direction, and a remaining portion of the first inductor is displaced from the predetermined plane in the first direction.

The present disclosure provides circuits and methods for fabricating circuits. A circuit may include an insulator having a first surface, a second surface, a periphery, a first subset of circuit elements disposed on the first surface, a second subset of circuit elements disposed on the second surface, and at least one conductive sidewall disposed on the periphery, wherein the conductive sidewall electrically couples the first subset of circuit elements to the second subset of circuit elements.