A amplifier device includes an amplifier, a coupling circuit, and a filter circuit. The amplifier amplifies a high frequency signal, and outputs to signal output ports the high frequency signal. The coupling circuit is provided side-by-side with the amplifier in a first direction on a substrate, connected to the signal output ports, and configured to couple output signals and output one output signal to an output terminal. The filter circuit is provided on the substrate and connected to the coupling circuit, and configured to reduce third-order IMD included in the one output signal. The one output signal is output from a middle of the substrate in a second direction intersecting with the first direction, and the filter circuit is arranged next to an edge of the substrate in the second direction, and arranged next to an edge of the substrate on the output terminal side in the first direction.

A dual mode notch filter for use in a multi-band millimeter wave (mmW) transmitter includes a transmit filter circuit disposed between two amplifiers in a mmW transmit signal path, the transmit filter circuit formed by at least one switch, at least one capacitor, and a double-tuned transformer, the transmit filter circuit having at least two modes configured to selectively filter a spurious signal in at least a first communication band.

A thin-film filter may include a monolithic substrate and a patterned conductive layer formed over the monolithic substrate. The patterned conductive layer may include at least one thin-film inductor. The thin-film filter may have a power capacity that is greater than about 25 W. In some embodiments, the thin-film inductor(s) may be connected between the input port and the output port. A heat sink terminal may be exposed along the bottom surface of thin-film filter. In some embodiments, the heat sink terminal may have an exposed heat sink area, and the bottom surface of the thin-film filter has an area that is less than 20 times larger than the exposed heat sink area.

A low pass filter includes a first inductor, a second inductor magnetic-field-coupled to the first inductor, a third inductor, and a first capacitor. The first inductor is electrically connected between a first port and an intermediate node, being a node to which the second inductor is electrically connected, between the first inductor and the second port. The second inductor is electrically connected between the intermediate node and a ground terminal. The third inductor is electrically connected between the intermediate node and the second port, and a first parallel resonant circuit is defined by the third inductor and the first capacitor. The first inductor and the second inductor are coupled to each other in such a relationship that a negative inductance is generated between the intermediate node and the third inductor due to magnetic field coupling between the first inductor and the second inductor.

An LC composite component includes a multilayer body including insulating base members that are laminated and include insulating base members on which conductor patterns are provided. Capacitor conductor patterns are provided on insulating base members different from an insulating base member on which a coil conductor pattern is provided, and each include an extending portion overlapping with a line segment connecting a center of a first terminal and a center of a second terminal in a shortest distance as viewed in the lamination direction and projecting portions projecting in directions different from the direction of the line segment, and the projecting portions overlap with linear portions of the coil conductor pattern without overlapping with bent portions thereof as viewed in the lamination direction.

A multilayered filter device includes a first port, a second port, a first LC resonator electrically connected to the first port, a second LC resonator electrically connected to the second port, a third LC resonator provided between the first LC resonator and the second LC resonator in a circuit configuration, and a stack. The first LC resonator includes a first inductor. The second LC resonator includes a second inductor. The first inductor and the second inductor are configured to be magnetically coupled inside the stack.

An adjustment circuit is connected between a power generation circuit that converts environmental energy into electric power and a power conversion circuit that converts the electric power generated by the power generation circuit into a desired form. The adjustment circuit includes a first circuit unit and a second circuit unit. The first circuit unit is configured to have an input connected to the power generation circuit and an output connected to the power conversion circuit. The second circuit unit is configured to have a connection point connected to the first circuit unit, a grounding point connected to a grounding electric potential, and a capacitor connected between the connection point and the grounding point. A magnitude of output resistance included in the second circuit unit is smaller than a magnitude of output resistance included in the power generation circuit. The capacitor is charged with the electric power output from the power generation circuit and outputs the charged electric power to the power conversion circuit.

Radio frequency (RF) systems with tunable filters are provided herein. In certain embodiments, an RF system includes a first RF processing circuit configured to process a first frequency band of a first communication standard and a second frequency band of a second communication standard. The first frequency band and the second frequency band are close in frequency and/or partially overlapping in frequency. The first RF processing circuit includes a tunable filter for changing the bandwidth of the first RF processing circuit to enhance the robustness of the first RF processing circuit to blocker or jammer signals of a third frequency band.

An LC composite component includes a multilayer body including insulating base members that are laminated and include insulating base members on which conductor patterns are provided. Capacitor conductor patterns are provided on insulating base members different from an insulating base member on which a coil conductor pattern is provided, and each include an extending portion overlapping with a line segment connecting a center of a first terminal and a center of a second terminal in a shortest distance as viewed in the lamination direction and projecting portions projecting in directions different from the direction of the line segment, and the projecting portions overlap with linear portions of the coil conductor pattern without overlapping with bent portions thereof as viewed in the lamination direction.

A high frequency package includes a package having an input terminal and an output terminal. A substrate housed in the package, has a first side, a second side facing the input terminal, and a third side facing the output terminal. The first side extends in a first direction and connects the second side and the third side, and the second side and the third side extend in a second direction intersecting the first direction. A coupling circuit on the substrate is electrically connected to the input terminal and the output terminal to input an input signal from the input terminal disposed at the second side of the substrate and output an output signal to the output terminal disposed at the third side of the substrate. A filter circuit on the substrate is electrically connected to the coupling circuit, an is configured to reduce third-order IMD (Inter Modulation Distortion) included in the output signal. The output signal is output from the coupling circuit in a middle of the output terminal side of the third side of the substrate. The filter circuit is arranged on an edge of the first side of the substrate, and an edge of the third side of the substrate.