An apparatus and method for making an acoustic filter package where the apparatus includes a base layer; a support layer disposed on the base layer; a piezoelectric structure disposed on the support layer; wherein the piezoelectric structure comprises: a piezoelectric layer; a top electrode on a top surface of the piezoelectric layer; a bottom electrode on a bottom surface of the piezoelectric layer; a contact pad coupled to the bottom electrode that extends through an opening in the piezoelectric layer and is coupled to the bottom electrode or the top electrode; and a corrosion resistant pad disposed on the contact pad; and a capping structure disposed on the piezoelectric structure.

A method of manufacturing a piezoelectric resonator unit that includes preparing a piezoelectric resonator having a piezoelectric element, a pair of excitation electrodes respectively disposed on a first main surface and a second main surface of the piezoelectric element so as to face each other with the piezoelectric element therebetween, and a pair of connection electrodes that are respectively electrically connected to the pair of excitation electrodes; electrically connecting the pair of connection electrodes to a pair of electrode pads on a third main surface of a base member using an electroconductive holding member so as to excitably hold the piezoelectric resonator on the third main surface of the base member; and attaching an electroconductive material, which is scattered from an electroconductive member, to a surface of the electroconductive holding member.

A piezoelectric device includes a piezoelectric vibrating piece and a container. The piezoelectric vibrating piece has a rectangular planar shape and has a portion of a first side secured to the container. The piezoelectric vibrating piece has a second side opposing the first side and includes a projecting portion that projects outward from the second side in at least one of proximity of both ends of the second side along the second side.

An acoustic resonator includes a membrane layer disposed on an insulating layer; a cavity formed by the insulating layer and the membrane layer and having a hydrophobic layer disposed on at least one of a portion of an upper surface of the cavity and a portion of a lower surface of the cavity; and a resonating portion disposed on the cavity and having a second electrode on a piezoelectric layer on a first electrode.

A bulk acoustic wave resonator includes a substrate including a cavity groove, a membrane layer disposed above the substrate and including a convex portion. And a lower electrode including a portion thereof disposed on the convex portion. The bulk acoustic wave resonator also includes a piezoelectric layer configured so that a portion of the piezoelectric layer is disposed above the convex portion, and an upper electrode disposed on the piezoelectric layer. A first space formed by the cavity groove and a second space formed by the convex portion form a cavity, the cavity groove is disposed below an active region, and the convex portion comprises an inclined surface disposed outside of the cavity groove.

There is disclosed acoustic resonators and filter devices. An acoustic resonator device includes a piezoelectric plate, and an interdigital transducer (IDT) formed on a front surface of the piezoelectric plate. The IDT includes interleaved fingers. At least one of the interleaved fingers includes a first layer adjacent the piezoelectric plate and a second layer over the first layer, wherein a width of the first layer is constant, and wherein a width of the second layer varies along a length of the at least one interleaved finger.

An acoustic wave device includes a piezoelectric layer provided with a part of the piezoelectric layer between lower and upper electrodes and having a through hole along a resonance region, an insertion film provided between the lower electrode and the piezoelectric layer and having a resistivity higher than those of the lower electrode and the upper electrode, a first film provided on a side of the upper electrode, a second film provided between the side surface of the upper electrode and the first film, and a third film provided between the side surface of the upper electrode and the second film or between the first film and the second film, a concentration of a first element of the third film being higher than that of the second film and a concentration of a second element of the third film being lower than that of the second film.

A package for an electronic component, the package comprising a front end, a back end, and an active membrane layer sandwiched between front and back electrodes of conducting material; wherein front electrode has a surface that extends beyond an adjacent surface of the active membrane layer, the active membrane mechanically supported by the front end and covered by a back end comprising at least one back cavity having organic walls and lid of organic material, with filled through vias traversing the organic walls and lid for coupling to the electrodes by an internal routing layer; the vias being coupleable by external solderable bumps to a circuit board for coupling the package in a flip chip configuration.