An acoustic wave resonator package is provided. The acoustic wave resonator package includes an acoustic wave resonator including an acoustic wave generator on a first surface of a substrate; a cover disposed to face the first surface of the substrate; a bonding member disposed between the substrate and the cover, and configured to bond a bonding surface of the acoustic wave generator and the cover to each other, wherein the bonding member includes glass frit, and the bonding surface of the acoustic wave resonator which is bonded to the bonding member may be formed of a dielectric material.

A BAW resonance device comprises a first layer including a cavity located on a first side, a first electrode having a first end located in the cavity and a second end contacting with the first layer, a second layer located on the first side, and a second electrode located on the second layer above the cavity, wherein the first electrode and the second electrode are located on two sides of the second layer. The first electrode comprises a first electrode layer and a second electrode layer, and the second electrode layer and the second layer are located on two sides of the first electrode layer. The second electrode comprises a third electrode layer and a fourth electrode layer, and the second layer and the fourth electrode layer are located on two sides of the third electrode layer. Thus, the electrical resistance is lowered and the electrical losses are reduced.

A bulk acoustic wave resonator comprises a piezoelectric material layer, a first metal layer disposed on the upper surface of the piezoelectric material layer, a second metal layer disposed on the lower surface of the piezoelectric material layer, and a laterally distributed raised frame including a first raised frame disposed on the upper surface of the first metal layer and having an inner raised frame section with a tapered portion and a non-tapered portion and an outer raised frame section, and a second raised frame disposed beneath the first metal layer and the outer raised frame section, but not beneath the inner raised frame section, the inner raised frame section being laterally disposed from a central active region of the bulk acoustic wave resonator by a first distance, the outer raised frame section being laterally disposed from the central active region by a second distance greater than the first distance.

An acoustic wave device includes: a substrate; a first electrode on the substrate; a piezoelectric layer on the first electrode; and a second electrode on the piezoelectric layer. A bonding interface is located between the substrate and the first electrode. The full width at half maximum (FWHM) in the X-ray diffraction pattern of the crystal plane <002> of the piezoelectric layer is between 10 arc-sec and 3600 arc-sec.

Disclosed is a film bulk acoustic resonator (FBAR) including a substrate, a lower electrode formed above the substrate, a piezoelectric layer formed above the lower electrode, an upper electrode formed above the piezoelectric layer, and a first protection layer formed above the upper electrode. Here, the first protection layer covers the upper electrode while extending downward along a side surface of one end of the upper electrode to cover a certain area of the piezoelectric layer.

A high Q acoustic BAW resonator with high coupling and improved spurious mode suppression is given. The BAW resonator comprises an active resonator region (AR) formed by an overlap of the three layers bottom electrode (BE), piezoelectric layer (PL) and top electrode layer (TE). An inner-flap (IF) is formed by a dielectric 3D structure sitting on a marginal region (MR) of the active resonator region (AR) or adjacent thereto, extending inwardly towards the center thereof and having a section that runs in parallel and distant to the top surface of the resonator keeping an inner gap (IG) thereto or an angle Θ.

An acoustic wave resonator includes a resonating part disposed on and spaced apart from a substrate by a cavity, the resonating part including a membrane layer, a first electrode, a piezoelectric layer, and a second electrode that are sequentially stacked. 0 Å≤ΔMg≤170 Å may be satisfied, ΔMg being a difference between a maximum thickness and a minimum thickness of the membrane layer disposed in the cavity.

A BAW resonator comprises a center area (CA), an underlap region (UL) surrounding the center area having a thickness smaller than the thickness d.sub.C of the center region and a frame region (FR), surrounding the underlap region having thickness d.sub.F greater than d.sub.C.

A film bulk acoustic wave resonator (FBAR) comprises a recessed frame region including an undulating perimeter.

An acoustic device includes a foundation structure and a transducer provided over the foundation structure. The foundation structure includes a piezoelectric layer between a top electrode and a bottom electrode. The piezoelectric layer has an active portion within an active region of the transducer, and a bi-polar border portion within a border region of the transducer. The piezoelectric material in the active portion has a first polarization. The bi-polar border portion has a first sub-portion and a second sub-portion, which resides either above or below the first sub-portion. The piezoelectric material in the first sub-portion has the first polarization, and the piezoelectric material in the second sub-portion has a second polarization, which is opposite the first polarization.