An acoustic wave filter device includes a piezoelectric layer, a high-acoustic-velocity member, a low-acoustic-velocity film between the high-acoustic-velocity member and the piezoelectric layer, and first and second IDT electrodes on the piezoelectric layer to define acoustic wave resonators. An acoustic wave resonator of a series-arm resonator portion closest to an antenna end and/or an acoustic wave resonator of a parallel-arm resonator portion closest to the antenna end includes the first IDT electrode including first and second electrode fingers, and the remaining acoustic wave resonators include the second IDT electrode including third and fourth electrode fingers. In the first IDT electrode, a central area, first and second low-acoustic-velocity areas, and first and second high-acoustic-velocity areas extend along a direction perpendicular or substantially perpendicular to an acoustic wave propagating direction. First and second envelopes connecting the tips of the third and fourth electrode fingers of the second IDT electrode are inclined.

An acoustic wave device includes a piezoelectric substrate with a reverse-velocity surface having an ellipse shape, an IDT electrode on the piezoelectric substrate, and a dielectric film on the piezoelectric substrate and covering the IDT electrode. The acoustic wave device utilizes a Love wave. The IDT electrode includes an intersecting region in which first electrode fingers and second electrode fingers are interdigitated. The intersecting region includes a central region, a first edge region and a second edge region located at both ends of the central region. When x(%) denotes a wavelength-normalized film thickness of the IDT electrode and y (g/cm.sup.3) denotes an electrode density of the IDT electrode, the wavelength-normalized film x is set at a value not less than x that satisfies Equation 1. The film thicknesses of the dielectric films in the first and second edge regions are smaller than the dielectric film in the central region.

An acoustic wave filter device includes at least one series arm resonator and a parallel arm resonator. The series arm resonators and the parallel arm resonator are defined by acoustic wave resonators, an interdigital transducer electrode of the series arm resonators is an apodized interdigital transducer electrode subjected to apodization weighting, in the interdigital transducer electrode of the parallel arm resonator, an intersecting portion includes a central region and low acoustic velocity regions provided at both outer side portions of the central portion, an acoustic velocity of an acoustic wave in the low acoustic velocity region is lower than an acoustic velocity of an acoustic wave in the central region, and a high acoustic velocity region where an acoustic velocity of an acoustic wave is higher than that of the low acoustic velocity region is provided at an outer side portion of each of the low acoustic velocity regions.

In an acoustic wave device, an interdigital transducer electrode is disposed on a piezoelectric substrate with a reverse velocity surface having an elliptic shape, and a dielectric film is disposed to cover the interdigital transducer electrode. Assuming an electrode density (%) of the interdigital transducer electrode to be y (%) and a wavelength-normalized film thickness 100 h/ (%) of the interdigital transducer electrode to be x (%), the wavelength-normalized film thickness x of the interdigital transducer electrode takes a value not less than x satisfying y=0.3452x.sup.26.0964x+36.262 depending on the electrode density of the interdigital transducer electrode.

A surface acoustic wave (SAW) device includes a substrate; an interdigital transducer (IDT) having lead-out portions and arrays of interdigital electrodes formed on the substrate, wherein the interdigital electrodes includes central portions, end portions, and intermediate portions between the end portions and the lead-out portions, and a thickness of the interdigital electrodes at the end portions is greater than a thickness of the interdigital electrodes at the central portions and the intermediate portions, thereby forming protruding structures at the end portions of the interdigital electrodes; a protective layer formed on the protruding structures at the end portions of the interdigital electrodes; a first temperature compensation layer formed on the protective layer; a second temperature compensation layer formed on the first temperature compensation layer and on the central portions and the intermediate portions of the interdigital electrodes; and a passivation layer formed on the second temperature compensation layer.

Aspects of the disclosure relate to wireless communication, and high-frequency filters with resonators. One aspect is a device including first and second busbars, and electrode fingers coupled between the busbars, with electrode fingers extending different distances toward an opposite busbar such that a second end of each of the electrode fingers collectively form wave shapes. The device further includes pluralities of gap reflectors positioned between the wave shapes and a nearest busbar.

A method for fabricating a surface acoustic wave (SAW) device includes forming an interdigital transducer (IDT) having lead-out portions and arrays of interdigital electrodes on a substrate, wherein the interdigital electrodes include central portions, end portions, and intermediate portions between the end portions and the lead-out portions; forming a protective layer on the IDT; forming a first temperature compensation layer on the protective layer; forming openings in the first temperature compensation layer to expose portions of the protective layer on the central portions and the intermediate portions of the interdigital electrodes; and etching the exposed portions of the protective layer, and etching the central portions and the intermediate portions of the interdigital electrodes to a preset thickness, to form protruding structures at the end portions of the interdigital electrodes.

There are disclosed acoustic resonators and method of fabricating acoustic resonators. An acoustic resonator includes a single-crystal piezoelectric plate having front and back surfaces, the back surface attached to a surface of a substrate except for portions of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A conductor pattern on the front surface includes an interdigital transducer (IDT) with interleaved fingers of the IDT disposed on the diaphragm. A periodic array of holes is provided in the diaphragm.

A surface acoustic wave device includes: a substrate; an electrode disposed on the substrate in a first direction; a dummy bar disposed to be spaced apart from the electrode by a predetermined distance in the first direction; and an additional film formed on the dummy bar, wherein the electrode and the dummy bar are disposed in plurality in parallel in a second direction perpendicular to the first direction, and the dummy bars are alternately disposed on a left side or a right side of the electrode to be spaced apart from the electrode by the predetermined distance, and the additional film is formed on the predetermined distance between the electrode and the dummy bar and on the plurality of dummy bars.

An elastic wave device includes a high-acoustic-velocity film, a low-acoustic-velocity film, and a piezoelectric film stacked on a substrate in this order, and a bonding layer is disposed at any position from inside of the high-acoustic-velocity film to an interface between the low-acoustic-velocity film and the piezoelectric film. Alternatively, an elastic wave device includes a low-acoustic-velocity film and a piezoelectric film stacked on a high-acoustic-velocity substrate, and a bonding layer is located in the low-acoustic-velocity film or at an interface between the piezoelectric film and the low-acoustic-velocity film.