A filter device includes an antenna terminal to be connected to an antenna, first inductors connected between the antenna terminal and a ground potential and defined by parallel divided inductors, and first and second acoustic wave filters commonly connected to the antenna terminal and including second inductors, respectively. The first inductors and the second inductors are electromagnetically coupled to each other mainly in a one-to-one relationship.

An electronic module includes a substrate, at least one first electronic component that includes a hollow portion, at least one second electronic component that includes no hollow portion, a first sealing resin, and a second sealing resin. The at least one first electronic component is sealed with the first sealing resin. The at least one second electronic component has a narrowest pitch between the electrodes that are provided on the mounting surface, and at least the mounting surface including the electrodes of the at least one second electronic component are sealed with the second sealing resin. The volume percentage of a filler that is included in the first sealing resin is larger than the volume percentage of a filler that is included in the second sealing resin.

A filter device includes a substrate and first to third filters provided on the substrate and each including an input terminal and an output terminal. A center frequency of a pass band of the first filter is lower than a center frequency of a pass band of the second filter, and the center frequency of the pass band of the second filter is lower than a center frequency of a pass band of the third filter. Of the first and third filters, when the filter having the center frequency of the pass band close to the center frequency of the filter is defined as a proximity filter and the other is defined as a non-proximity filter, an input terminal and an output terminal of the proximity filter are not adjacent to an input terminal and an output terminal of the second filter.

A circuit module 2 comprises: a wiring structure 4; an electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which the electronic component 6a, 6b is embedded; and a metal layer 10 provided on a side surface S1 of the insulating resin layer 8 and a side surface S2 of the wiring structure 4. The surface roughness of the side surface S1 of the insulating resin layer 8 is expressed as R1. The surface roughness of the side surface S2 of the wiring structure 4 is expressed as R2. R1 and R2 differ from each other.

An elastic wave filter includes a piezoelectric substrate, an IDT electrode provided on the piezoelectric substrate, a first shield electrode provided on the piezoelectric substrate, a first insulating film laminated on the piezoelectric substrate and extending onto the first shield electrode, a first signal terminal provided on the first insulating film, a second signal terminal provided on the piezoelectric substrate, and a first ground terminal provided on the piezoelectric substrate and connected to a ground potential. The first shield electrode is not electrically connected to the IDT electrode and the first and second signal terminals. The first signal terminal is included in the first shield electrode when seen from above. One of the first signal terminal and the second signal terminal is an output terminal and the other thereof is an input terminal.

A high-frequency module includes a SAW filter including a piezoelectric substrate and an electrode pattern provided on the piezoelectric substrate, a module substrate, a resin member covering the SAW filter, and a wiring pattern connected to the electrode pattern and provided on the resin member. The electrode pattern and the wiring pattern are inductively coupled, capacitively coupled, or inductively coupled and capacitively coupled with each other.

A wafer level package comprises a functional wafer with a first surface, device structures connected to device pads arranged on the first surface. A cap wafer, having an inner and an outer surface, is bonded with the inner surface to the first surface of the functional wafer. A frame structure surrounding the device structures is arranged between functional wafer and cap wafer. Connection posts are connecting the device pads on the first surface to inner cap pads on the inner surface. Electrically conducting vias are guided through the cap wafer connecting inner cap pads on the inner surface and package pads on the outer surface of the cap wafer.

An elastic wave device includes a substrate, an elastic wave element, and an exterior resin layer. The substrate includes an outer electrode on one main surface thereof and a first mounting electrode on another main surface thereof. The elastic wave element includes a piezoelectric substrate, a transmission functional electrode, a reception functional electrode, and ground terminals on one main surface of the piezoelectric substrate, and the ground terminals are connected to the first mounting electrode. High-thermal-conductivity conductor layers are provided on another main surface of the piezoelectric substrate, conductor vias penetrate between both main surfaces of the piezoelectric substrate, and the high-thermal-conductivity conductor layers and the ground terminals are connected to each other by the conductor vias.

An acoustic wave device includes: a first substrate that includes a first acoustic wave filter located on an upper surface of the first substrate; a second substrate that is flip-chip mounted on the upper surface of the first substrate through a bump, and includes a second acoustic wave filter on a lower surface of the second substrate, the lower surface of the second substrate facing the upper surface of the first substrate across an air gap; and a shield electrode that is supported by the upper surface of the first substrate, and is located between at least a part of the first acoustic wave filter and at least a part of the second acoustic wave filter through the air gap.

A filter device includes an antenna terminal to be connected to an antenna, first inductors connected between the antenna terminal and a ground potential and defined by parallel divided inductors, and first and second acoustic wave filters commonly connected to the antenna terminal and including second inductors, respectively. The first inductors and the second inductors are electromagnetically coupled to each other mainly in a one-to-one relationship.