A vibration device has a substrate, a mount disposed on the substrate, a vibration element having a base end and a tip end, the base end being disposed on the mount, and an adhesive fixing the mount and the vibration element. The mount has a first protrusion and a second protrusion disposed to be aligned in a first direction in which the base end and the tip end are aligned, and whose protrusion heights on the vibration element side differ from each other, the second protrusion is located on the base end side of the vibration element relative to the first protrusion, the vibration element is disposed on the first protrusion and the second protrusion, and a portion of the vibration element on the base end side relative to the second protrusion is separated from the substrate and the mount.

An improved device delivers a fluid medicament to the subcutaneous tissue of a user. The device is better suited for patients with Parkinson's Disease and other central nervous system disorders, than conventional infusion devices. The device can include a reusable part including a drive component (e.g., motor) and control electronics and a disposable part including a medicament reservoir. Medicament can be evacuated from the medicament reservoir by a plunger assembly that includes a plunger attached to a lead screw that is rotated by a nut, all within the disposable part. The device can be fluidically coupled with the tissue via a flexible cannula. Various embodiments relate to an improved cannula insertion mechanism that delivers the cannula under a force applied by a spring. Various embodiments relate to improved filling of the device, for example, using a vial adapter and an automated filling station.

A vibrator device includes: a base having a first surface and a second surface in a front-back relationship with each other; a circuit element located at a first surface side of the base and having a third surface at the first surface side and a fourth surface in a front-back relationship with the third surface; a vibrator element located at a fourth surface side of the circuit element; a first bonding member that bonds the base to the circuit element; a second bonding member that bonds the circuit element to the vibrator element; and a lid bonded to the base so as to form a cavity that accommodates the circuit element and the vibrator element between the lid and the base, in which at least a part of the second bonding member overlaps the first bonding member in a plan view of the circuit element.

A vibrating element includes a piezoelectric substrate having an excitation section adapted to excite a thickness-shear vibration, and provided with a step section in each of side surfaces on both ends, and a peripheral section having a thickness smaller than a thickness of the excitation section, and the peripheral section has at least one projection section disposed on both principal surfaces in an area where a vibratory displacement when the excitation section excites a vibration is sufficiently attenuated.

A piezoelectric component in which leakage of vibration is suppressed and vibration characteristics are excellent is provided. A piezoelectric component of the invention includes a support substrate; and a piezoelectric element mounted on the support substrate. The piezoelectric element includes electrodes (vibration electrodes) on one main surface and the other main surface of the piezoelectric element so that the electrodes have an area facing each other, and a concave area extending in a width direction of the piezoelectric element, in at least one of excepted areas which are areas other than the electrodes facing each other of the one main surface and the other main surface. At least part of corner portions of the concave area which extend in the width direction forms a curved surface.

A piezoelectric vibration component that includes a piezoelectric vibrator, a substrate, and a conductive adhesive that bonds the piezoelectric vibrator to the substrate. The conductive adhesive contains a silicone-based base resin, a cross-linker, a conductive filler, and an insulating filler. The silicone-based base resin has a weight-average molecular weight of 20,000 to 102,000. The cross-linker has a number-average molecular weight of 1,950 to 4,620. The conductive filler and the insulating filler have a particle size of 10 μm or less.

A piezoelectric device includes a piezoelectric vibrating piece, a base, a wire, a conductive adhesive, and a buffer layer. The piezoelectric vibrating piece includes excitation electrodes and extraction electrodes at both principal surfaces. The base includes the piezoelectric vibrating piece and a first wiring electrode and a second wiring electrode connected to the extraction electrodes. The wire connects the extraction electrode on a surface opposite to a side of the base among the extraction electrodes to one wiring electrode of the first wiring electrode and the second wiring electrode. The conductive adhesive connects the extraction electrode at the base side among the extraction electrodes to the other wiring electrode among the first wiring electrode and the second wiring electrode. The buffer layer reduces stress of the wire between the extraction electrode to which the wire is connected and the piezoelectric vibrating piece.

A multi-piece wiring substrate includes a matrix substrate including first and second insulating layers, and interconnection substrate regions arranged in a matrix. The matrix substrate includes dividing grooves opposing each other and disposed along boundaries between the interconnection substrate regions, and through-holes penetrating the matrix substrate in a thickness direction at positions where the dividing grooves are disposed. The inner surface conductor gradually decreases in thickness from a thick portion in a middle of the inner surface conductor, to thin portions disposed on a side of a boundary between the first and second insulating layers and on a first main surface side, and includes inclination portions each of which gradually increases in thickness from a boundary between corresponding one of the dividing grooves and the inner surface conductor to an inner surface of the inner surface conductor, in vertical sectional view.

A method of wafer scale packaging acoustic resonator devices and an apparatus therefor. The method including providing a partially completed semiconductor substrate comprising a plurality of single crystal acoustic resonator devices, each having a first electrode member, a second electrode member, and an overlying passivation material. At least one of the devices to be configured with an external connection, a repassivation material overlying the passivation material, an under metal material overlying the repassivation material. Copper pillar interconnect structures are then configured overlying the electrode members, and solder bump structures are form overlying the copper pillar interconnect structures.

A micro-transfer printable transverse bulk acoustic wave filter comprises a piezoelectric filter element having a top side, a bottom side, a left side, and a right side disposed over a sacrificial portion on a source substrate. A top electrode is in contact with the top side and a bottom electrode is in contact with the bottom side. A left acoustic mirror is in contact with the left side and a right acoustic mirror is in contact with the right side. The thickness of the transverse bulk acoustic wave filter is substantially less than its length or width and its length can be greater than its width. The transverse bulk acoustic wave filter can be disposed on, and electrically connected to, a semiconductor substrate comprising an electronic circuit to control the transverse bulk acoustic wave filter and form a composite heterogeneous device that can be micro-transfer printed.