An oscillator includes a second container as a container in which a vibrator is accommodated, a base substrate on which the second container is mounted, three or more protruding portions provided on the base substrate at positions overlapping the second container in a plan view, and a bonding member configured to bond the second container and at least one of the protruding portions.

A compound acoustic wave filter device comprises a support substrate having an including two or more circuit connection pads. An acoustic wave filter includes a piezoelectric filter element and two or more electrodes. The acoustic wave filter is micro-transfer printed onto the support substrate. An electrical conductor electrically connects one or more of the circuit connection pads to one or more of the electrodes.

A vibrator includes a vibration element having an excitation section which is provided with excitation electrodes, and which excites a thickness shear vibration, and a fixation section electrically coupled to at least one of the excitation electrodes, a vibration attenuator disposed on at least one of principal surfaces of the vibration element, and a support substrate having a coupling electrode which is electrically coupled to the fixation section, and which supports the vibration element, wherein the vibration attenuator is disposed at the fixation section side of the excitation electrodes, and at an outer circumferential edge side of the vibration element from the fixation section in a direction perpendicular to a direction in which the excitation electrodes and the fixation section are arranged side by side.

A crystal device includes a rectangular shaped substrate, a mounting frame which is along an outer circumferential edge of a lower surface of the substrate on its short-side sides and configures a recessed part, electrode pads on an upper surface of the substrate, connection pads on the lower surface of the substrate in the mounting frame, a crystal element mounted on the electrode pads, a temperature sensing element mounted on the connection pads, and a lid air-tightly sealing the crystal element. The electrode pads and the recessed part do not overlap in a plane perspective view.

A piezoelectric device includes a piezoelectric element, a package, a temperature sensitive component and a conductive adhesive. The package includes a base body and a connection conductor. The base body has electric insulation and configures a space. The space is sealed and holds the piezoelectric element. The connection conductor is located on a predetermined surface of the base body. The predetermined surface is on an outer side relative to the space. The temperature sensitive component includes apart terminal and converts temperature to an electrical signal. The conductive adhesive is configured by a thermosetting resin containing a conductive filler and is bonded to the connection conductor and the part terminal.

In a crystal unit, a substrate is rectangle-shaped. A frame includes a pair of portions located in regions on the sides of a pair of short sides of the substrate on the lower surface of the substrate and forms a concave portion between these pair of portions. An electrode pad is located on the upper surface of the substrate. A connection pad is located on the lower surface of the substrate within the frame. A plurality of external terminals are located on the lower surface of the frame. A crystal element is mounted on the electrode pad. A temperature sensing element is mounted on the connection pad. A ratio S2/S1 of an area S1 of a rectangular region formed by an outer edge of the lower surface of the frame and an area S2 of a smallest rectangular region containing all of the external terminals is 0.75 to 0.91.

An AT-cut crystal element includes a vibrator and a supporting portion. The vibrator has a planar shape with an approximately rectangular shape. The supporting portion is connected to one short side of the vibrator and has a thickness thicker than a thickness of the vibrator. The AT-cut crystal element has an oscillation frequency of approximately 76 Mhz. The vibrator has a distal end portion that is an end portion on a side opposite to the supporting portion. The distal end portion is formed to have a protrusion shape toward a distal end side thereof. The vibrator has both ends formed to have a protrusion shape toward an outside direction along the short side. The vibrator has a long side dimension L and a short side dimension W. A W/L is in a range of 0.74 to 0.79 or in a range of 0.81 to 0.93.

A method of wafer scale packaging acoustic resonator devices and an apparatus therefor. The method including providing a partially completed semiconductor substrate comprising a plurality of single crystal acoustic resonator devices, each having a first electrode member, a second electrode member, and an overlying passivation material. At least one of the devices to be configured with an external connection, a repassivation material overlying the passivation material, an under metal material overlying the repassivation material. Copper pillar interconnect structures are then configured overlying the electrode members, and solder bump structures are form overlying the copper pillar interconnect structures.

A vibrator includes a vibration element having an excitation section which is provided with excitation electrodes, and which excites a thickness shear vibration, and a fixation section electrically coupled to at least one of the excitation electrodes, a vibration attenuator disposed on at least one of principal surfaces of the vibration element, and a support substrate having a coupling electrode which is electrically coupled to the fixation section, and which supports the vibration element, wherein the vibration attenuator is disposed at the fixation section side of the excitation electrodes, and at an outer circumferential edge side of the vibration element from the fixation section in a direction perpendicular to a direction in which the excitation electrodes and the fixation section are arranged side by side.

A crystal device includes a bearing base, an integrated chip and a conductive adhesive unit. The bearing base includes a conductive seat. The integrated chip includes a principal reference plane facing the conductive seat, and having a first major axis. The conductive adhesive unit has a second major axis and an aspect ratio, and is at least partly disposed between the conductive seat and the integrated chip. The aspect ratio ranges from 1.1 to 1.9. The principal reference plane further has a perpendicular projection straight line defined according to the second major axis. A practical angle is included by the first perpendicular projection straight line and the first major axis, and ranges from 0 degree to 90 degrees.