An acoustic wave device includes a package substrate including first and second principal surfaces, an acoustic wave element at the first principal surface, a sealing resin layer covering at least a portion of the acoustic wave element, and a metal shield film covering the sealing resin layer. The package substrate includes a ground connection electrode in the package substrate, electrically connected to the acoustic wave element, and connected to a ground potential. The package substrate includes a side surface and a connection portion connected to at least a portion of an end edge on a side with the second principal surface in the side surface and at least a portion of an outer peripheral edge in the second principal surface. The shield film reaches the side surface of the package substrate and does not reach the connection portion, and the shield film is connected to the ground connection electrode.

Disclosed is a device and methods for making same. In one aspect, a device includes a package having at least four pins, and, within the package, a die that includes a filter circuit electrically coupled to the four pins. The filter can: receive, from a first pin, an input signal comprising first and second frequency components, produce, at a second pin, a first output signal of the first frequency component, and produce, at a third and fourth pin, a second output signal of the second frequency component; and/or receive, from a second pin, a first input signal comprising the first frequency component, receive, from a third or fourth pin, a second input signal comprising the second frequency component, and produce, at a first pin, an output signal comprising the first and second frequency components. The second pin is interposed between the third and fourth pins on the package.

A multiplexer (100) includes a first filter (FLT1) that passes a signal in a first frequency band, a second filter (FLT2) that passes a signal in a second frequency band lower than the first frequency band, and a third filter (FLT3) that passes a signal in a third frequency band. The third frequency band is a frequency band higher than the first frequency band, or a frequency band lower than the second frequency band. The first filter includes a first inductor (L11) that forms a first attenuation pole on a low-frequency side of the first frequency band. The second filter includes a second inductor (L23) that forms a second attenuation pole on a high-frequency side of the second frequency band. At least a portion of a component constituting the third filter is disposed between the first inductor and the second inductor.

A high-frequency module includes a substrate having a mounting surface, a laminated component disposed on the mounting surface, and a wiring, in which the laminated component includes a lower stage component, and an upper stage component disposed on the lower stage component, the lower stage component includes a lower surface 31 facing the mounting surface, an upper surface facing the lower surface 31 back to back, and a connection terminal 33 provided on the lower surface 31, the upper stage component includes a lower surface 41 facing the upper surface, and a connection terminal 43 provided on the lower surface 41, and the wiring is provided on the upper surface, and is connected with the connection terminal 43.

A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier disposed on the module board; a low noise amplifier disposed on the module board; a transmission filter (a first acoustic wave filter) disposed on one of the first principal surface and the second principal surface; and a reception filter (a second acoustic wave filter) disposed on one of the first principal surface and the second principal surface. An absolute value of a temperature coefficient of frequency (TCF) of the transmission filter is smaller than an absolute value of a TCF of the reception filter, and a distance between the transmission filter and the power amplifier is shorter than a distance between the reception filter and the power amplifier.

Systems and methods for phasing line holders are described herein. In certain embodiments, an apparatus includes a groove in a conductive body. Additionally, the apparatus includes a phasing line for electrically coupling a plurality of components, the phasing line extending through the groove. Further, the apparatus includes a holder inserted into the groove, the holder maintaining the phasing line at a specific position in relation to a plurality of groove surfaces, wherein a plurality of holder surfaces apply sufficient pressure to the plurality of groove surfaces to secure the holder within the groove.

Disclosed is a device and methods for making same. In one aspect, a device includes a package having at least four pins, and, within the package, a die that includes a filter circuit electrically coupled to the four pins. The filter can: receive, from a first pin, an input signal comprising first and second frequency components, produce, at a second pin, a first output signal of the first frequency component, and produce, at a third and fourth pin, a second output signal of the second frequency component; and/or receive, from a second pin, a first input signal comprising the first frequency component, receive, from a third or fourth pin, a second input signal comprising the second frequency component, and produce, at a first pin, an output signal comprising the first and second frequency components. The second pin is interposed between the third and fourth pins on the package.

A duplexer includes a duplexer package having a transmit terminal, an antenna terminal, a receive terminal and at least one package ground terminal, a transmit filter disposed within the duplexer package, and a receive filter disposed within the duplexer package. Coupled first and second inductors, the first inductor connected to the transmit filter and the second inductor connected to the receive filter, are configured to cancel, at least in part, RF signal leakage between the transmit filter and the receive filter.

A substrate that includes an encapsulation layer, a first acoustic resonator, a second acoustic resonator, at least one first dielectric layer, a plurality of first interconnects, at least one second dielectric layer, and a plurality of second interconnects. The first acoustic resonator is located in the encapsulation layer. The first acoustic resonator includes a first piezoelectric substrate comprising a first thickness. The second acoustic is located in the encapsulation layer. The second acoustic resonator includes a second piezoelectric substrate comprising a second thickness that is different than the first thickness. The at least one first dielectric layer is coupled to a first surface of the encapsulation layer. The plurality of first interconnects is coupled to the first surface of the encapsulation layer. The plurality of first interconnects is located at least in the at least one first dielectric layer.

An acoustic wave device is disclosed. The acoustic wave device can include a transmit filter that includes bulk acoustic wave resonators and a series surface acoustic wave resonator that is coupled between the bulk acoustic wave resonators and a transmit output node. The acoustic wave device can also include a loop circuit that is coupled to the transmit filter. The loop circuit can generate an anti-phase signal to a target signal at a particular frequency.