Patent classifications
H03H9/14502
Acoustic wave device
An acoustic wave device includes a support substrate having a central region and a surrounding region located around the central region, a silicon oxide film that is located in the central region directly or indirectly and that has a side surface, a piezoelectric layer that is provided on the silicon oxide film and that has a first principal surface and a second principal surface, an excitation electrode provided on at least one of the first principal surface and the second principal surface, a cover film provided to cover the entire side surface of the silicon oxide film, a resin layer that is provided in the surrounding region and that is provided to cover the side surface of the silicon oxide film from above the cover film, and a wiring electrode that is electrically connected to the excitation electrode and that extends from the piezoelectric layer to the resin layer.
Nebulisation of liquids
A device is disclosed for the preparation of nebulised droplets, for inhalation. The device has: a surface acoustic wave (SAW) transmission surface; a SAW transducer adapted to generate and propagate SAWs along the SAW transmission surface; and an array of cavities opening at the SAW transmission surface for containing a liquid. In operation, SAWs propagating along the SAW transmission surface interact with the liquid in the cavities to produce nebulised droplets of the liquid. Operation of the device results in a nebulised plume of droplets of average diameter in the range 1-5 μm.
ACOUSTIC WAVE ELEMENT, FILTER ELEMENT, AND COMMUNICATION APPARATUS
An acoustic wave element 1 according to the present disclosure includes a piezoelectric substrate 2 and an IDT electrode 3 on the piezoelectric substrate 2. The IDT electrode 3 includes a multilayer structure of a first layer 35 comprised of Al containing 10% or less of a sub-component and a second layer 37 comprised of a CuAl.sub.2 alloy. The second layer 37 enables the acoustic wave element 1 to have excellent electric power resistance.
ACOUSTIC WAVE DEVICE HAVING MASS LOADING STRIP WITH THERMAL EXPANSION COMPENSATION BUFFER LAYER
An acoustic wave device is disclosed. The acoustic wave device can include a piezoelectric layer, an interdigital transducer electrode formed with the piezoelectric layer, a temperature compensation layer over the interdigital transducer electrode. The interdigital transducer electrode includes a bus bar and fingers that extend from the bus bar. The fingers each includes an edge portion and a body portion. The acoustic wave device can include a mass loading strip overlaps the edge portions of the fingers. The acoustic wave device can include a portion of the temperature compensation layer is positioned between the mass loading strip and the piezoelectric layer. The acoustic wave device can include a buffer layer that is disposed at least partially between the mass loading strip and the temperature compensation layer. The buffer layer can have a coefficient of thermal expansion greater than a coefficient of thermal expansion of the temperature compensation layer and less than a coefficient of thermal expansion of the mass loading strip.
ACOUSTIC WAVE DEVICE HAVING MASS LOADING STRIP WITH BUFFER LAYER
An acoustic wave device is disclosed. The acoustic wave device can include a piezoelectric layer, an interdigital transducer electrode formed with the piezoelectric layer, a temperature compensation layer over the interdigital transducer electrode. The interdigital transducer electrode includes a bus bar and fingers that extend from the bus bar. The fingers each includes an edge portion and a body portion. The acoustic wave device can include a mass loading strip overlaps the edge portions of the fingers. The acoustic wave device can include a portion of the temperature compensation layer is positioned between the mass loading strip and the piezoelectric layer. The acoustic wave device can include a buffer layer that is disposed at least partially between the mass loading strip and the temperature compensation layer. A thickness of the buffer layer can be at least one forth a thickness of the mass loading strip. The buffer layer can be disposed at least partially between a bottom side, a top side, and a side wall of the mass loading strip and the temperature compensation layer.
TEMPERATURE COMPENSATED SURFACE ACOUSTIC WAVE DEVICE HAVING MASS LOADING STRIP WITH BUFFER LAYER
An acoustic wave device and a method of forming the same is disclosed. The acoustic wave device can include a piezoelectric layer, an interdigital transducer electrode formed with the piezoelectric layer, and a temperature compensation layer over the interdigital transducer electrode. The interdigital transducer electrode includes a bus bar and fingers that extend from the bus bar. The fingers each includes an edge portion and a body portion. The acoustic wave device can include a mass loading strip that overlaps the edge portions of the fingers. A portion of the temperature compensation layer is positioned between the mass loading strip and the piezoelectric layer. The acoustic wave device can include a buffer layer that is disposed at least partially between the mass loading strip and the temperature compensation layer. The buffer layer includes a material different from materials of the temperature compensation layer and the mass loading strip.
Nebulisation of Liquids
A device is disclosed for the preparation of nebulised droplets, for inhalation. The device has: a surface acoustic wave (SAW) transmission surface; a SAW transducer adapted to generate and propagate SAWs along the SAW transmission surface; and an array of cavities opening at the SAW transmission surface for containing a liquid. In operation, SAWs propagating along the SAW transmission surface interact with the liquid in the cavities to produce nebulised droplets of the liquid. Operation of the device results in a nebulised plume of droplets of average diameter in the range 1-5 μm.
Frequency information-based computer having sensor interface
A hybrid wave computer that computes an inputted original signal as frequency information includes: an input module configured to separate a frequency of the original signal by detecting an oscillation of an piezoelectric element by each position as the original signal having an embedded frequency of several bands is transmitted in a form of acoustic waves on a substrate provided with the piezoelectric element; a calculation module including at least one vibration amplifier or vibration damper for receiving the frequency of the original signal separated in the input module and amplifying or attenuating a wave for each frequency band to calculate the inputted original signal in a frequency band; and a storage module configured to store binarized frequency information in the calculation module as digital information, so that the original signal is interfaced in a form of waves.
Reconfigurable Feed-Forward for Electrical Balance Duplexers (EBD)
Systems, methods, and devices for reducing insertion loss and/or swapping transmitter (TX) and receiver (RX) frequencies in an electrical balance duplexer (EBD) used in a transceiver device for frequency division duplexing (FDD) applications are provided. Feed-forward receiver path from the antenna to a low noise amplifier (LNA) and a feed-forward path from the antenna to a power amplifier (PA) of the EBD may be used for reducing insertion loss of the RX and TX signals. In some embodiments, switches may be used to selectively alter operational modes for varied levels of isolation and/or swapping of TX and RX frequencies.
METHODS OF MANUFACTURING ACOUSTIC WAVE DEVICE WITH ANTI-REFLECTION LAYER
Methods of manufacturing an acoustic wave device are disclosed. An anti-reflection layer can be formed over a conductive layer that is over a piezoelectric layer. The conductive layer can include aluminum, for example. The anti-reflection layer can remain distinct from the conductive layer after a heating process. A photolithography process can pattern an interdigital transducer of the acoustic wave device from one or more interdigital transducer electrode layers that include the conductive layer. The anti-reflection layer can reduce reflection from the conductive layer during the photolithography process.