A vibrator is provided that includes a substrate having a major surface defined in width and length directions and one or more electrodes formed at least in a substantial entire region of the major surface of the substrate in the length direction, and that performs, as main vibration, expansion-contraction vibration along the width direction in accordance with a voltage applied to the electrodes. Moreover, a holder surrounds at least a portion of the vibrator; and a holding arm connects the vibrator to the holder. Moreover, the vibrator has a width Wo in the width direction positioned at an end in the length direction and includes, to have a width Wm differing from the width Wo and positioned between a pair of ends opposing in the length direction, a variant portion at least one or more locations that is in a shape recessed or projecting in the width direction.

A mechanical resonator-based cascadable logic device includes which includes a resonator having a beam with a first fixed end, a second fixed end, and a length between the first and second fixed ends. A first electrode and a second electrode are aligned along a first side of the beam. A third electrode and a fourth electrode are aligned along a second side of the beam and opposite the first and second electrodes. A DC voltage source is coupled to one of the first and second fixed ends of the beam. At least one of the first, second, third, and fourth electrodes is coupled to a first AC voltage source so that a logic operation is performed by activating a second resonant mode of the resonator.

A moveable micromachined member of a microelectromechanical system (MEMS) device includes an insulating layer disposed between first and second electrically conductive layers. First and second mechanical structures secure the moveable micromachined member to a substrate of the MEMS device and include respective first and second electrical interconnect layers coupled in series, with the first electrically conductive layer of the moveable micromachined member and each other, between first and second electrical terminals to enable conduction of a first joule-heating current from the first electrical terminal to the second electrical terminal through the first electrically conductive layer of the moveable micromachined member.

A moveable micromachined member of a microelectromechanical system (MEMS) device includes an insulating layer disposed between first and second electrically conductive layers. First and second mechanical structures secure the moveable micromachined member to a substrate of the MEMS device and include respective first and second electrical interconnect layers coupled in series, with the first electrically conductive layer of the moveable micromachined member and each other, between first and second electrical terminals to enable conduction of a first joule-heating current from the first electrical terminal to the second electrical terminal through the first electrically conductive layer of the moveable micromachined member.

A mechanical resonator-based cascadable logic device includes which includes a resonator having a beam with a first fixed end, a second fixed end, and a length between the first and second fixed ends. A first electrode and a second electrode are aligned along a first side of the beam. A third electrode and a fourth electrode are aligned along a second side of the beam and opposite the first and second electrodes. A DC voltage source is coupled to one of the first and second fixed ends of the beam. At least one of the first, second, third, and fourth electrodes is coupled to a first AC voltage source so that a logic operation is performed by activating a second resonant mode of the resonator.

A vibration transducer includes a silicon substrate, a first oxide film formed on the silicon substrate, an activation layer formed on the first oxide film, a second oxide film formed on the activation layer, a polysilicon layer formed on the second oxide film, and a substrate contact part. A vibrator, a vibrator electrode electrically conducted with the vibrator, a fixed electrode close to the vibrator and a vacuum chamber configured to surround the vibrator are formed in the activation layer. The polysilicon layer forms a shell. The substrate contact part is configured to electrically conduct the polysilicon layer and the silicon substrate, and is formed to continuously surround the vacuum chamber in a region, in which the vibrator, the vibrator electrode and the fixed electrode of the activation layer are not formed, of the activation layer.

A continuous or distributed resonator geometry is defined such that the fabrication process used to form a spring mechanism also forms an effective mass of the resonator structure. Proportional design of the spring mechanism and/or mass element geometries in relation to the fabrication process allows for compensation of process-tolerance-induced fabrication variances. As a result, a resonator having increased frequency accuracy is achieved.

Embodiments of the invention include a piezoelectric resonator which includes an input transducer having a first piezoelectric material, a vibrating structure coupled to the input transducer, and an output transducer coupled to the vibrating structure. In one example, the vibrating structure is positioned above a cavity of an organic substrate. The output transducer includes a second piezoelectric material. In operation the input transducer causes an input electrical signal to be converted into mechanical vibrations which propagate across the vibrating structure to the output transducer.

The present disclosure relates to a micro electro mechanical system (MEMS) resonator. An example MEMS resonator includes a substrate, a barrier layer, a conducting layer, a dielectric isolation layer, a harmonic oscillator, a first electrical isolation structure, and a first conducting structure. The substrate and the barrier layer are combined to form a cavity, and a junction between the substrate and the barrier layer includes the conducting layer. The dielectric isolation layer is included between the conducting layer and the barrier layer. The harmonic oscillator is connected to the conducting layer and is suspended in the cavity. The conducting layer is connected to a first conducting structure that is outside the barrier layer, and a first electrical isolation structure is included between the first conducting structure and the barrier layer. The barrier layer and the dielectric isolation layer are configured to isolate the first electrical isolation structure from the cavity.

MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.