The present disclosure discloses a capacitively transduced Micro or Nano Electromechanical ring oscillator device comprising two or more resonance units coupled with each other, the two or more resonance units are coupled with one or more Signal Conditioning Circuits (SCCs). The oscillator further comprises a first set of the one or more SCC is coupled with at least one of the two or more resonance units. Further, the oscillator comprises a second set of the one or more SCC is coupled with at least one of the two or more resonance units, wherein one of the first set of the one or more SCC and the second set of the one or more SCC is configured to operate in a buffer active state. The two or more resonance units comprises one or more control gate units, and the two or more resonance units are coupled with each other in a back-to-back configuration.

The present disclosure relates to methods and system that provides techniques of designing amplifiers with controllable gain for electrical signals/power based on capacitively transduced Micro and/or Nano electromechanical resonators. The present disclosure provides techniques of implementing an RF voltage amplifier, a phase shift amplifier, and/or an RF power amplifier through capacitively transduced Micro/Nano electromechanical resonators. In some embodiments, the amplifier is narrow-band with the centre frequency specified by the resonant frequency of the Micro/Nano electromechanical resonators. In addition, the present disclosure provides a technique by which a set of capacitively transduced Micro/Nano electromechanical resonators are implemented as RF power amplifier with multiple inputs and multiple outputs with the output voltage being measured at electrically floating electrodes that are capacitively coupled with the resonator. These electrically-floating electrodes can also be used to sum various output signals from a resonator and signals output from various resonators.

A method for manufacturing a vibration element includes, a base film forming step of forming a first base film at a first substrate surface of a quartz crystal substrate in first and second vibrating arm forming regions, a protective film forming step of forming a first protective film in a bank portion forming region of the first base film, and a dry-etching step of dry-etching the quartz crystal substrate through the first base film and the first protective film.