An acoustic wave filter includes a first longitudinally coupled resonator including first and second IDT electrodes, and a second longitudinally coupled resonator including third and fourth IDT electrodes. Each IDT electrode includes a wide pitch electrode finger group and a narrow pitch electrode finger group. A number of electrode fingers in the wide pitch electrode finger group of the first IDT electrode is smaller than that in the wide pitch electrode finger group of the second IDT electrode by a percentage equal to or more than about 4.2% and equal to or less than about 23.5%. A number of the electrode fingers in the wide pitch electrode finger group of the IDT electrode third is smaller than that in the wide pitch electrode finger group of the fourth IDT electrode by a percentage equal to or more than about 9.5% and equal to or less than about 52.4%.

A surface acoustic wave resonator, comprising: an interdigital electrode comprising a first bus bar and a second bus bar. The first bus bar connects first fingers and second pseudo-fingers alternately arranged in a first direction, and the second bus bar connects second fingers and first pseudo-fingers alternately arranged in the first direction. Each first finger extends along a same straight line and is spaced apart from its corresponding first pseudo-finger. Each second finger extends along a same straight line and is spaced apart from its corresponding second pseudo-finger. In each pair of adjacent first and second fingers, a distance between an end of the first finger away from the first bus bar and an end of the second finger away from the second bus bar is an interdigital aperture. At least a part of the interdigital apertures formed among the first fingers and the second fingers are different.

Aspects of this disclosure relate to a filter that includes an acoustic wave device with a multi-layer substrate with heat dissipation. The multi-layer substrate includes a support substrate (e.g., a quartz substrate), a piezoelectric layer, an interdigital transducer electrode on the piezoelectric layer, and a thermally conductive layer configured to dissipate heat associated with the acoustic wave device. The thermally conductive layer is disposed between the support substrate and the piezoelectric layer. The thermally conductive layer has a thickness that is greater than 10 nanometers and less than a thickness of the piezoelectric layer.

An acoustic wave sensor device comprises a quartz material layer surface; arranged along a first axis, a first interdigitated transducer disposed over the planar surface of the quartz material layer, a first reflection structure disposed over the planar surface of the quartz material layer, and a second reflection structure disposed over the planar surface of the quartz material layer; and arranged along a second axis, a second interdigitated transducer disposed over the planar surface of the quartz material layer, a third reflection structure disposed over the planar surface of the quartz material layer, and a fourth reflection structure disposed over the planar surface of the quartz material layer; and wherein the first axis and the second axis are inclined to each other by a finite angle.