Design and operation of a processing device is configurable to optimize wake-up time and peak power cost during restoration of a machine state from non-volatile storage. The processing device includes a plurality of non-volatile logic element arrays configured to store a machine state represented by a plurality of volatile storage elements of the processing device. A stored machine state is read out from the plurality of non-volatile logic element arrays to the plurality of volatile storage elements. During manufacturing, a number of rows and a number of bits per row in non-volatile logic element arrays are based on a target wake up time and a peak power cost. In another approach, writing data to or reading data of the plurality of non-volatile arrays can be done in parallel, sequentially, or in any combination to optimize operation characteristics.

A scan flip-flop includes an input unit and a flip-flop. The input unit is configured to select one signal from among a data input signal and a scan input signal to supply the selected one signal as an internal signal according to an operation mode. The flip-flop is configured to latch the internal signal according to a clock signal. The flip-flop includes a cross coupled structure that includes first and second tri-state inverters which share a first output node and face each other.

A D-type flip-flop circuit 1 has a structure in which a pMOS transistor p8 and an nMOS transistor n8 are added to a general D-type flip-flop circuit comprising pMOS transistors p1 to p7, p11 to p15 and nMOS transistors n1 to n7, n11 to n15.

Integrated circuit devices are provided. The devices may include a substrate including a first region, a second region and a boundary region between the first and second regions. The first and second regions may be spaced apart from each other in a first horizontal direction. The devices may also include a first latch on the first region, a second latch on the second region, and a conductive layer extending in the first horizontal direction and crossing over the boundary region. The first latch may include a first vertical field effect transistor (VFET), a second VFET, a third VFET, and a fourth VFET. The second latch may include a fifth VFET, a sixth VFET, a seventh VFET, and an eighth VFET. The first and seventh VFETs may be arranged along the first horizontal direction. Portions of the conductive layer may include gate electrodes of the first and seventh VFETs, respectively.

Integrated circuit devices are provided. The devices may include a substrate including a first region, a second region and a boundary region between the first and second regions. The first and second regions may be spaced apart from each other in a first horizontal direction. The devices may also include a first latch on the first region, a second latch on the second region, and a conductive layer extending in the first horizontal direction and crossing over the boundary region. The first latch may include a first vertical field effect transistor (VFET), a second VFET, a third VFET, and a fourth VFET. The second latch may include a fifth VFET, a sixth VFET, a seventh VFET, and an eighth VFET. The first and seventh VFETs may be arranged along the first horizontal direction. Portions of the conductive layer may include gate electrodes of the first and seventh VFETs, respectively.

A fast Mux-D scan flip-flop is provided, which bypasses a scan multiplexer to a master keeper side path, removing delay overhead of a traditional Mux-D scan topology. The design is compatible with simple scan methodology of Mux-D scan, while preserving smaller area and small number of inputs/outputs. Since scan Mux is not in the forward critical path, circuit topology has similar high performance as level-sensitive scan flip-flop and can be easily converted into bare pass-gate version. The new fast Mux-D scan flip-flop combines the advantages of the conventional LSSD and Mux-D scan flip-flop, without the disadvantages of each.

A flip-flop is provided. The flip-flop includes: a first inverter including an input terminal to receive data signal and an output terminal coupled to an input terminal of the master latch, a second inverter, a master latch including an output terminal coupled to an input terminal of a slave latch, and the slave latch including an output terminal coupled to an input terminal of the second inverter. An output terminal of the second inverter is configured as an output terminal of the flip-flop. A duration of the first clock signal inputted to the master latch is greater than a duration of the first clock signal inputted to the slave latch. A duration of the second clock signal inputted to the master latch is greater than a duration of the second clock signal inputted to the slave latch.

A flip-flop is provided. The flip-flop includes: a first inverter including an input terminal to receive data signal and an output terminal coupled to an input terminal of the master latch, a second inverter, a master latch including an output terminal coupled to an input terminal of a slave latch, and the slave latch including an output terminal coupled to an input terminal of the second inverter. An output terminal of the second inverter is configured as an output terminal of the flip-flop. A duration of the first clock signal inputted to the master latch is greater than a duration of the first clock signal inputted to the slave latch. A duration of the second clock signal inputted to the master latch is greater than a duration of the second clock signal inputted to the slave latch.

A semiconductor device includes a first active region, a second active region, a first gate line disposed to overlap the first and second active regions, a second gate line disposed to overlap the first and second active regions, a first metal line electrically connecting the first and second gate lines and providing a first signal to both the first and second gate lines, a first contact structure electrically connected to part of the first active region between the first and second gate lines, a second contact structure electrically connected to part of the second active region between the first and second gate lines, and a second metal line electrically connected to the first and second contact structures and transmitting a second signal, wherein an overlapped region that is overlapped by the second metal line does not include a break region.

A semiconductor device includes a first active region, a second active region, a first gate line disposed to overlap the first and second active regions, a second gate line disposed to overlap the first and second active regions, a first metal line electrically connecting the first and second gate lines and providing a first signal to both the first and second gate lines, a first contact structure electrically connected to part of the first active region between the first and second gate lines, a second contact structure electrically connected to part of the second active region between the first and second gate lines, and a second metal line electrically connected to the first and second contact structures and transmitting a second signal, wherein an overlapped region that is overlapped by the second metal line does not include a break region.