Methods and systems for double-sided semiconductor device fabrication. Devices having multiple leads on each surface can be fabricated using a high-temperature-resistant handle wafer and a medium-temperature-resistant handle wafer. Dopants can be introduced on both sides shortly before a single long high-temperature diffusion step diffuses all dopants to approximately equal depths on both sides. All high-temperature processing occurs with no handle wafer or with a high-temperature handle wafer attached. Once a medium-temperature handle wafer is attached, no high-temperature processing steps occur. High temperatures can be considered to be those which can result in damage to the device in the presence of aluminum-based metallizations.

A bridge leg circuit assembly comprising: a circuit board, a first active switch die, and a second active switch die. The circuit board having an insulating plate with a first and second side and a first and second conducting layer on the first and second sides of the insulating plate, respectively. The second conducting layer having a first and second conducting region that are insulated from each other. The first active switch die having an opposing first side, facing and coupled with the first conducting region, and an opposing second side, coupled with the second conducting region, which are embedded into the circuit board. The second active switch die having an opposing first side, coupled with the second conducting region, and an opposing second side, coupled with the first conducting layer, which are embedded into the circuit board.

A bridge leg circuit assembly comprising: a circuit board, a first active switch die, and a second active switch die. The circuit board having an insulating plate with a first and second side and a first and second conducting layer on the first and second sides of the insulating plate, respectively. The second conducting layer having a first and second conducting region that are insulated from each other. The first active switch die having an opposing first side, facing and coupled with the first conducting region, and an opposing second side, coupled with the second conducting region, which are embedded into the circuit board. The second active switch die having an opposing first side, coupled with the second conducting region, and an opposing second side, coupled with the first conducting layer, which are embedded into the circuit board.

The present application discloses new approaches to providing “passive-off” protection for a B-TRAN-like device. Even if the control circuitry is inactive, AC coupling uses transient voltage on the external terminals to prevent forward biasing an emitter junction. Preferably the same switches which implement diode-mode and pre-turnoff operation are used as part of the passive-off circuit operation.

A semiconductor switching string includes a plurality of series-connected semiconductor switching assemblies, each having a main semiconductor switching element that includes first and second connection terminals. The main semiconductor switching element also has an auxiliary semiconductor switching element electrically connected between the first and second connection terminals. Each semiconductor switching assembly also includes a control unit configured to switch on a respective auxiliary semiconductor switching element to selectively create an alternative current path between the first and second connection terminals whereby current is diverted to flow through the alternative current path to reduce the voltage across the corresponding main semiconductor switching element. The or each control unit is further configured to switch on the auxiliary semiconductor switching element when the voltage across the corresponding main semiconductor switching element differs from a voltage reference derived from the voltage across all of the main semiconductor switching elements.

A semiconductor switching string includes a plurality of series-connected semiconductor switching assemblies, each having a main semiconductor switching element that includes first and second connection terminals. The main semiconductor switching element also has an auxiliary semiconductor switching element electrically connected between the first and second connection terminals. Each semiconductor switching assembly also includes a control unit configured to switch on a respective auxiliary semiconductor switching element to selectively create an alternative current path between the first and second connection terminals whereby current is diverted to flow through the alternative current path to reduce the voltage across the corresponding main semiconductor switching element. The or each control unit is further configured to switch on the auxiliary semiconductor switching element when the voltage across the corresponding main semiconductor switching element differs from a voltage reference derived from the voltage across all of the main semiconductor switching elements.

Current sharing among bidirectional double-base bipolar junction transistors. One example is a method comprising: conducting current through a first bidirectional double-base bipolar junction transistor (first B-TRAN); conducting current through a second B-TRAN the second B-TRAN coupled in parallel with the first B-TRAN; measuring a value indicative of conduction of the first B-TRAN, and measuring a value indicative of conduction of the second B-TRAN; and adjusting a current flow through the first B-TRAN, the adjusting responsive to the value indicative of conduction of the first B-TRAN being different than the value indicative of conduction of the second B-TRAN.

An output module for a PLC includes an output circuit. This output circuit is open or closed selectively between a power supply terminal (to which a power supply voltage is supplied) and an output terminal (connected to a solenoid). The output module includes a control apparatus which controls the operation of the output circuit. The output circuit includes switches connected in series to each other between the power supply terminal and the output terminal, and a current output section which performs an operation of short-circuiting terminals of the switch to pass a predetermined current through a path formed due to the short-circuiting. The control apparatus includes on/off control sections which controls on/off states of the respective switches, and diagnosis sections which perform a diagnosis on presence of a short-circuit fault in the respective switches based on diagnostic signals output from a low-potential terminal of the switches.

An output module for a PLC includes an output circuit. This output circuit is open or closed selectively between a power supply terminal (to which a power supply voltage is supplied) and an output terminal (connected to a solenoid). The output module includes a control apparatus which controls the operation of the output circuit. The output circuit includes switches connected in series to each other between the power supply terminal and the output terminal, and a current output section which performs an operation of short-circuiting terminals of the switch to pass a predetermined current through a path formed due to the short-circuiting. The control apparatus includes on/off control sections which controls on/off states of the respective switches, and diagnosis sections which perform a diagnosis on presence of a short-circuit fault in the respective switches based on diagnostic signals output from a low-potential terminal of the switches.

The disclosure relates to a switch arrangement for a converter, comprises: a first series connection of at least two switches between two terminals of the switch arrangement, wherein the two switches are semiconductor switches; a second series connection of a first capacitor and a first diode circuit electrically connected in parallel to first part of the first series connection between a first terminal of the two terminals and node between the two switches, wherein the first diode circuit comprises at least one diode; and third series connection of a second capacitor and a second diode circuit electrically connected in parallel to a second part of the first series connection between second terminal of the two terminals and the node between the two switches, wherein the second diode circuit comprises at least one diode. Further a method for switching such a switch arrangement between the conducting state and the non-conducting state.