A proximity sensor that outputs presence or absence of a detection object or a position of the detection object as a detection result includes: a detection part configured to include a detection coil and a capacitor; an oscillation circuit configured to excite the detection part; an analog/digital conversion circuit configured to detect a signal change occurring in the detection part and output a digital signal indicating the detected signal change; a temperature detection part configured to detect a temperature inside a casing of the proximity sensor; a storage part configured to store a characteristic parameter unique to the proximity sensor in advance; a control calculation part configured to process a digital signal from the analog/digital conversion circuit to calculate a signal indicating a distance to the detection object, compensate the calculated signal using the characteristics parameter stored in the storage part, and output the compensated signal as the detection result.

A proximity sensor (12) is provided which comprises a magnet (16) and a sensor (18). The sensor (18) is aligned relative to the magnet (16) in such a manner that the direction (E) of maximum sensitivity of the sensor (18) is formed so as to be substantially parallel to the magnet axis (M) extending through the poles (20, 22) of the magnet (16). Further, an assembly unit (10) is provided.

A semiconductor device includes a first diffusion region of a first type with embedded therein, a second and a third diffusion region of a second type different from the first type. The second and third diffusion regions are more doped than the first region. The second and third diffusion regions are each connected to a respective contact. A dielectric layer covers at least an edge of the second and third diffusion regions, and the region in between the second and third diffusion regions. A piezoelectric layer is disposed on, over, adjacent to or in contact with the dielectric layer. A first structure is in a first soft ferromagnetic material and is arranged to perform mechanical stress on the piezoelectric layer in response to a magnetic field.

An induction sensor assembly for a securing and locking unit of a telescoping jib having at least one signal transmitter configured for generating an electromagnetic stray field oriented towards its active switching surface, and at least one switching element provided for contactless cooperation with the signal transmitter. The signal transmitter and switching element are displaceable relative to each other in relation to an adjusting direction extending in parallel with a main plane. To provide a simple and cost-effective installation of the induction sensor assembly despite having high detection security, the active switching surface of the signal transmitter and the main plane are inclined with respect to each other. As such, the electromagnetic stray field of the signal transmitter is also advantageously inclined whereby a possible displacement between the signal transmitter and switching element cannot exert an influence on the precision of the position detection in relation to the adjusting direction.

A manufacturing process switch with a housing consisting of a first member and a second member. The first member is rotatable from a closed position to an open position. A proximity sensor is secured to the housing that detects the proximity of the first member to the second member and generates a signal when the first member is in the open position. An engagement device is secured to the housing for retaining the first member to the second member in the closed position. A cable attachment mechanism is attached to the first member of the housing and securable to a cable of a tool. The first member is rotatable from the closed position to the open position when a breakaway force is applied to the cable attachment mechanism. The manufacturing process is stopped when the first member is in the open position.

A proximity sensor for detecting the proximity of an object, including a sensing element, a detection circuitry provided on a circuit board, and a housing with a rear portion adjoining a rear end of the housing and a front portion adjoining a front end of the housing, the sensing element being arranged inside the front portion of the housing to interact with the object through the front portion, the detection circuitry being interconnected with the sensing element to receive a detection signal from the sensing element, the housing including side walls extending in a longitudinal direction from the rear end to the front end of the housing, the side walls surrounding the circuit board. To allow a better flexibility of the sensor along its length expansion, the circuit board includes at least one bendable section extending in a transverse direction with respect to the longitudinal direction and that the side walls substantially consist of at least one flexible material in a region surrounding the bendable section of the circuit board such that the sensor is bendable through the transverse direction.

The present disclosure relates to a proximity sensor for detecting the proximity of an object, the sensor including a sensing element (11), a detection circuitry (65), and a housing (5), the sensing element (11) being arranged in a front portion (21) of the housing (5) such that it is adapted to interact with the object through the front portion (21) and the detection circuitry being interconnected with the sensing element (11) in order to receive a detection signal from the sensing element (11), wherein the detection circuitry (65) is provided on a circuit board (15, 15A, 15B, 15C) extending at least through a middle portion (22) of the housing (5).

To allow a better flexibility of the sensor along its length expansion, it is proposed that the housing (5) includes multiple segments (41, 42, 43, 44) that are consecutively arranged in a longitudinal direction (27) from a rear end (56) toward a front end (55) of the housing (5), wherein neighboring segments of said segments (41, 42, 43, 44) are linked to each other via a respective pivot axis (35, 39, 40) extending transversely with respect to said longitudinal direction (27), such that the housing (5) is bendable around each of said pivot axes (35, 39, 40), wherein both of said front portion (21) and said middle portion (22) each includes at least one of said segments (41, 42, 43, 44), and wherein the circuit board (15, 15A, 15B, 15C) includes at least one bendable section (61, 75, 76, 77, 85, 86) extending transversely with respect to said longitudinal direction (27), said bendable section (61, 75, 76, 77, 85, 86) being provided inside said neighboring segments (41, 42, 43, 44).

An inductive sensor includes a core body, a coil wound on the core body, a cavity having a fixed volume within the core body, and an epoxy mixture filling a controlled portion of the fixed volume. The controlled portion of the fixed volume filled with the epoxy mixture controls an inductance of the sensor.

A proximity sensor includes a transmission circuit that supplies a current to each of detection coils, a reception circuit that detects voltages generated at both ends of the coils or currents flowing in the coils due to the supply of the current for each of the coils, a control unit that senses the presence or position of a detection object using a detection result of the reception circuit, and an output unit that outputs a sensing result of the control unit. The control unit extracts a first component caused by a mounting fitting for mounting the proximity sensor on a support member and a second component caused by the detection object from the detection result of the reception circuit. The control unit compensates the second component using the first component. The control unit senses the presence or position of the detection object on the basis of the compensated second component.

An inductive proximity switch comprising signal oscillating circuit and a reference oscillating circuit; multiplexer circuit designed to alternately activate the signal oscillating circuit and the reference oscillating circuit; driver circuit having an oscillator designed to operate the activated signal oscillating circuit and the activated reference oscillating circuit with an oscillator frequency, respectively; detection module designed to determine a number of oscillations of the activated signal oscillating circuit measured within a predetermined gate time and a number of oscillations of the activated reference oscillating circuit measured within the predetermined gate time; and an evaluation module designed to determine a difference signal on basis of the determined number of oscillations of the activated signal oscillating circuit measured within the predetermined gate time and the determined number of oscillations of the activated reference oscillating circuit measured within the predetermined gate time, and to generate a control signal depending on the difference signal.